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Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: M Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: M Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: M Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Solder Coated SnPb; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate
Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 2225; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.225" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate