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    CBGA 483 Search Results

    CBGA 483 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DAC5670MGEM/EM Texas Instruments 14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA 25 Only Visit Texas Instruments Buy
    5962-0724701VXA Texas Instruments 14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA -55 to 125 Visit Texas Instruments Buy
    R7S721010VCBG#AC0 Renesas Electronics Corporation RTOS MPU with 5MB of On-chip RAM Visit Renesas Electronics Corporation
    R7S910016CBG#AC0 Renesas Electronics Corporation Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip Visit Renesas Electronics Corporation
    R7S721001VCBG#AC0 Renesas Electronics Corporation RTOS MPU with 10MB of On-chip RAM Visit Renesas Electronics Corporation

    CBGA 483 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


    Original     		PDF 25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola

    D7377

    Abstract: MC7457RX1000NB D62673 mc7457 360CB D626 MC7447 MOS13 FIT rate d6108
    Text: Semiconductor Products Sector MC7447/MC7457 Microprocessor MOS-13 HiP7SOI Rev. 1.1 / 1.2 Qualification Report MC7447/MC7457 Product Information: Device No./Rev.: MC7447/MC7457 Rev. 1.1/1.2 Description: L/N/W-spec MC7447/MC7457 Technology:MOS13 Package: 360CBGA / 483CBGA


    Original     		PDF MC7447/MC7457 MOS-13 MC7447/MC7457 MOS13 360CBGA 483CBGA 30-March-04 MC7447: D7377 MC7457RX1000NB D62673 mc7457 360CB D626 MC7447 MOS13 FIT rate d6108

    Teradyne J971 Digital Test system

    Abstract: teradyne J971 CQFP68 J973 5341B teradyne a585 CI 7447 ATMEL ARINC PC603R CQFP132
    Text: HIGH REL MICROPROCESSORS POWERPC PROCESSORS 68K PROCESSORS ARINC CONTROLLER A S S E M B LY & T E S T SERVICES Atmel your partner With over 25 years of experience and in close partnership with FreescaleTM Semiconductor, Atmel offers a wide range of microprocessor


    Original     		PDF 5341B-HIREL-01/05 Teradyne J971 Digital Test system teradyne J971 CQFP68 J973 5341B teradyne a585 CI 7447 ATMEL ARINC PC603R CQFP132

    MPC740

    Abstract: MPC7400 MPC7410 MPC7441 MPC745 MPC750 MPC755 MPC8240 MPC8241 MPC8245
    Text: Motorola Host and Integrated Processor Summary revised FEB2003 755 7400 7410 7441 7450/1 7445 7455 100-133 MHz 603e 200-300 MHz 200-250 MHz 166-200 MHz 266-400 MHz 200-266 MHz 300-333 MHz 300-350 MHz 200-266 MHz 300-400 MHz 300-450 MHz 350-500 MHz 400-550 MHz


    Original     		PDF FEB2003 600-1000MHz 603ePID6 603ePID7t, MPC8240 MPC8241 MPC8245 MPC740 MPC745 MPC7400 MPC7410 MPC7441 MPC745 MPC750 MPC755 MPC8240 MPC8241 MPC8245

    MPC740

    Abstract: MPC7400 MPC7410 MPC745 MPC7450 MPC750 MPC755 MPC8240 MPC8245
    Text: Motorola PowerPC CPU Summary revised 03/21/2001 NickSaid G2 603e G4 G3 8240 8245 740 745 750 755 7400 7410 7450 300-400 MHz 350-500 MHz 400-500 MHz 533-733 MHz 100-133 MHz 200-300 MHz 200-250 MHz 266-333 MHz 200-266 MHz 300-333 MHz 300-350 MHz 200-266 MHz


    Original     		PDF 603ePID6 603ePID7t, MPC8240 MPC8245 MPC740 MPC745 MPC750 MPC755 MPC7400 MPC7410 MPC745 MPC7450 MPC755 MPC8240 MPC8245

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    atmel 938

    Abstract: PC7447 PC7455 PC7457 TYPE OF SRAM
    Text: Features • • • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x 13 Selectable Core-to-L3 Frequency Divisors Selectable MPx/60x Interface Voltage (1.8V, 2.5V)


    Original     		PDF MPx/60x 64-bit 36-bit 5345C atmel 938 PC7447 PC7455 PC7457 TYPE OF SRAM

    TT 2076

    Abstract: IEC C13 pinout PC7447 PC7455 PC7457 TYPE OF SRAM
    Text: Features • • • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x 13 Selectable Core-to-L3 Frequency Divisors Selectable MPx/60x Interface Voltage (1.8V, 2.5V)


    Original     		PDF MPx/60x 64-bit 32-bit 5345B TT 2076 IEC C13 pinout PC7447 PC7455 PC7457 TYPE OF SRAM

    TT 2076

    Abstract: PC7447 PC7455 PC7457 mil 43
    Text: Features • • • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x 13 Selectable Core-to-L3 Frequency Divisors Selectable MPx/60x Interface Voltage (1.8V, 2.5V)


    Original     		PDF MPx/60x 64-bit 32-bit TT 2076 PC7447 PC7455 PC7457 mil 43

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    30BF10

    Abstract: MPC7440 MCM64E836 MPC7400 MPC7450 MPC750 mpc7440 motorola 360 cbga
    Text: Order Number: MPC7450EC/D Rev. 3, 6/2001 Semiconductor Products Sector Advance Information MPC7450 RISC Microprocessor Hardware Specifications The MPC7450 is an implementation of the PowerPC family of reduced instruction set computing RISC microprocessors. This document describes pertinent electrical and physical characteristics of the MPC7450.


    Original     		PDF MPC7450EC/D MPC7450 MPC7450. MPC7400" 30BF10 MPC7440 MCM64E836 MPC7400 MPC750 mpc7440 motorola 360 cbga

    CI 7447

    Abstract: internal diagram of 7447 IC MC 7447 TT 2076 marking W18 7447 gate diagram 7447 cmos MPC7400 MPC7441 MPC7447
    Text: Freescale Semiconductor MPC7457EC Rev. 5, 09/2004 Technical Data MPC7457 RISC Microprocessor Hardware Specifications This hardware specification is primarily concerned with the MPC7457; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7457 and MPC7447 are


    Original     		PDF MPC7457EC MPC7457 MPC7457; MPC7447. MPC7457 MPC7447 MPC7457. MPC7450 CI 7447 internal diagram of 7447 IC MC 7447 TT 2076 marking W18 7447 gate diagram 7447 cmos MPC7400 MPC7441

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    7447

    Abstract: No abstract text available
    Text: Advance Information MPC7457EC/D Rev. 2, 7/2003 MPC7457 RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7457; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7457 and


    Original     		PDF MPC7457EC/D MPC7457 MPC7457; MPC7447. MPC7447 MPC7457. MPC7450 MPC7455, MPC7445, 7447

    7447B

    Abstract: mc7457vg1000
    Text: Freescale Semiconductor MPC7457EC Rev. 7, 03/2006 Technical Data MPC7457 RISC Microprocessor Hardware Specifications This hardware specification is primarily concerned with the MPC7457; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7457 and


    Original     		PDF MPC7457EC MPC7457 MPC7457; MPC7447. MPC7447 MPC7457. MPC7450 MC7457VG1000NC MC7457VG1267LC 7447B mc7457vg1000

    CI 7447

    Abstract: IC 7447 IC 7447 counter MPC7457 ic 7447 pin configuration TT 2076 PowerPC 950 connecting diagram for ic 7447 HD 7447 IC 7447 specification
    Text: Freescale Semiconductor MPC7457EC Rev. 7, 03/2006 Technical Data MPC7457 RISC Microprocessor Hardware Specifications This hardware specification is primarily concerned with the MPC7457; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7457 and


    Original     		PDF MPC7457EC MPC7457 MPC7457; MPC7447. MPC7457 MPC7447 MPC7457. MPC7450 CI 7447 IC 7447 IC 7447 counter ic 7447 pin configuration TT 2076 PowerPC 950 connecting diagram for ic 7447 HD 7447 IC 7447 specification

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data MPC7457EC Rev. 8, 04/2013 MPC7457 RISC Microprocessor This hardware specification is primarily concerned with the MPC7457; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7457 and MPC7447 are


    Original     		PDF MPC7457EC MPC7457 MPC7457; MPC7447. MPC7447 MPC7457. MPC7450

    Loctite 7441

    Abstract: motorola g18 30BF10 MPC7400 MPC7410 MPC7441 MPC7450 MPC750 MPC755
    Text: Advance Information MPC7441EC/D Rev. 0, 10/2001 MPC7441 RISC Microprocessor Hardware Specifications The MPC7441 is a reduced instruction set computing RISC microprocessor that implements the PowerPC instruction set architecture. This document describes pertinent electrical and


    Original     		PDF MPC7441EC/D MPC7441 MPC7441 MPC7441. MPC7450 MPC7400" Loctite 7441 motorola g18 30BF10 MPC7400 MPC7410 MPC750 MPC755

    ci 7445

    Abstract: ibm usa 2001 P6 MOTHERBOARD ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL Ibm 865 MOTHERBOARD pcb CIRCUIT diagram ic 7455
    Text: Advance Information MPC7455EC Rev. 4, 9/2003 MPC7455 RISC Microprocessor Hardware Specifications The MPC7455 and MPC7445 are implementations of the PowerPC microprocessor family of reduced instruction set computer RISC microprocessors. This document is primarily


    Original     		PDF MPC7455EC MPC7455 MPC7445 MPC7455; MPC7445. MPC7455. MPC7450 MPC7400, MPC7410, ci 7445 ibm usa 2001 P6 MOTHERBOARD ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL Ibm 865 MOTHERBOARD pcb CIRCUIT diagram ic 7455

    Loctite 7441

    Abstract: 905-760 Loctite 412 motorola g18 30BF10 MPC7400 MPC7410 MPC7441 MPC7450 MPC750
    Text: Freescale Semiconductor, Inc. Advance Information MPC7441EC/D Rev. 0, 10/2001 Freescale Semiconductor, Inc. MPC7441 RISC Microprocessor Hardware Specifications The MPC7441 is a reduced instruction set computing RISC microprocessor that implements the PowerPC instruction set architecture. This document describes pertinent electrical and


    Original     		PDF MPC7441EC/D MPC7441 MPC7441 MPC7441. MPC7450 MPC7400" Loctite 7441 905-760 Loctite 412 motorola g18 30BF10 MPC7400 MPC7410 MPC750

    Untitled

    Abstract: No abstract text available
    Text: 0.15 A A1 INDEX SEATING PLANE / / 0.25 A CAPACITOR ZONES 4X 8X 8.4 MIN 4X 12.5 MAX TOP VIEW m —II— H|—e 21X 1 635 21X 1.27 483X rh 1 2 3 4 5 6 7 8 9 0.9 0.7 0O.3 |A|B|C| 00.15® A 11 13 15 17 19 21 10 12 14 16 18 2 0 2 2 BOTTOM VIEW F R E E S C A L E SEMICONDUCTOR,


    OCR Scan     		PDF 98ARE10653D 5M-1994.

    Untitled

    Abstract: No abstract text available
    Text: 0.15 A A1 INDEX SEATING PLANE // 0.25 A CAPACITOR ZONES 4X 8X 8.4 MIN 4X 12.5 MAX TOP VIEW m —II— 21X 1 H|—e 635 21X 1.27 483X rh 0O.3 |A|B|C| 00.15® A 1 2 3 4 5 6 7 9 11 13 15 17 19 21 8 10 12 14 16 18 2 0 2 2 BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC.


    OCR Scan     		PDF 98ASA10539D MO-156 5M-1994.