BT 317 DATASHEET
Abstract: IC 2733 pdf datasheet circuit diagram of calling bell crystal 3.579545MHZ datasheet DTMF fsk cli circuit OSC4 E0C5250 GR-30-CORE SIN227
Text: PF997-02 E0C5250 CAS + FSK IC ● ITU V.23 & Bell 202 FSK Receiver ● Bellcore "CPE Alerting Signal" Detection ● BT "Idle Tone Alert Signal" Detection ● Low Voltage Operation • DESCRIPTION The CAS + FSK IC Calling Number Identification Receiver IC with Calling Waiting is a CMOS integrated circuit,
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PF997-02
E0C5250
GR-30-CORE,
BT 317 DATASHEET
IC 2733 pdf datasheet
circuit diagram of calling bell
crystal 3.579545MHZ datasheet
DTMF fsk cli circuit
OSC4
E0C5250
GR-30-CORE
SIN227
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BT 317 DATASHEET
Abstract: DTMF fsk circuit MDR 14 pin BELLCORE GR-30 crystal 3.579545MHZ datasheet mdr 50 cable MDR 80 pin BELLCORE FSK Call Progress Tone generator MDR 20 pin
Text: PF997-02 E0C5250 CAS + FSK IC ● ITU V.23 & Bell 202 FSK Receiver ● Bellcore "CPE Alerting Signal" Detection ● BT "Idle Tone Alert Signal" Detection ● Low Voltage Operation • DESCRIPTION The CAS + FSK IC Calling Number Identification Receiver IC with Calling Waiting is a CMOS integrated circuit,
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PF997-02
E0C5250
GR-30-CORE,
BT 317 DATASHEET
DTMF fsk circuit
MDR 14 pin
BELLCORE GR-30
crystal 3.579545MHZ datasheet
mdr 50 cable
MDR 80 pin
BELLCORE FSK
Call Progress Tone generator
MDR 20 pin
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DDR3 impedance
Abstract: bc 945 data sheet viking connector 12 pin
Text: DDR3 ECC ADDRESS PARITY DIMM VR7EAxx7298xxx Module Configuration Viking Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7EA287298FBZ VR7EA287298FBA VR7EA287298FBB VR7EA287298FBC VR7EA287298FBD
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VR7EAxx7298xxx
VR7EA287298FBZ
VR7EA287298FBA
VR7EA287298FBB
VR7EA287298FBC
VR7EA287298FBD
VR7EA287298FBE
VR7EA567298GBZ
VR7EA567298GBA
VR7EA567298GBB
DDR3 impedance
bc 945 data sheet
viking connector 12 pin
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256Mx8
Abstract: VR7EU127258GBD 2628 S-108 tfBGA PACKAGE thermal resistance
Text: DDR3 UNBUFFERED DIMM VR7EUxxxx58xxx Module Configuration Non-ECC Viking Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7EU286458FBZ VR7EU286458FBA VR7EU286458FBB VR7EU286458FBC VR7EU286458FBD
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VR7EUxxxx58xxx
VR7EU286458FBZ
VR7EU286458FBA
VR7EU286458FBB
VR7EU286458FBC
VR7EU286458FBD
VR7EU286458FBE
VR7EU566458GBZ
VR7EU566458GBA
VR7EU566458GBB
256Mx8
VR7EU127258GBD
2628
S-108
tfBGA PACKAGE thermal resistance
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VR7WU567258GBD
Abstract: VR7WU127258GHB VR7WU127258GHD vr7wu287258fbd VR7WU127258 ck 66 ul94v-0 ddr3 ram S-108 DDR3 "application note"
Text: DDR3 ECC VLP MINI-UDIMM MODULE CONFIGURATIONS Viking Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7WU287258FBZ VR7WU287258FBA VR7WU287258FBB VR7WU287258FBC VR7WU287258FBD VR7WU287258FBE
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VR7WU287258FBZ
VR7WU287258FBA
VR7WU287258FBB
VR7WU287258FBC
VR7WU287258FBD
VR7WU287258FBE
VR7WU567258GBZ
VR7WU567258GBA
VR7WU567258GBB
VR7WU567258GBC
VR7WU567258GBD
VR7WU127258GHB
VR7WU127258GHD
vr7wu287258fbd
VR7WU127258
ck 66 ul94v-0
ddr3 ram
S-108
DDR3 "application note"
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2000w power amplifier circuit diagram
Abstract: JEP147
Text: DDR3 ECC MINI-UDIMM MODULE CONFIGURATIONS Viking Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7JU567258FBZ VR7JU567258FBA VR7JU567258FBB VR7JU567258FBC VR7JU567258FBD VR7JU567258FBE VR7JU127258GBZ
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VR7JU567258FBZ
VR7JU567258FBA
VR7JU567258FBB
VR7JU567258FBC
VR7JU567258FBD
VR7JU567258FBE
VR7JU127258GBZ
VR7JU127258GBA
VR7JU127258GBB
VR7JU127258GBC
2000w power amplifier circuit diagram
JEP147
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S1C05251
Abstract: V23 FSK Japan DTMF fsk cli circuit BELLCORE FSK BELL202 GR-30-CORE S1C05250 SIN227
Text: PF1243-01 S1C05251 CAS + FSK IC ge oltan V o Lowerati ts p c u O od Pr ● ITU V.23 & Bell 202 FSK Receiver ● Bellcore "CPE Alerting Signal" Detection ● BT "Idle Tone Alert Signal" Detection ● Low Voltage Operation • DESCRIPTION The S1C05251 CAS + FSK IC , an upgraded version of the S1C05250, is a CMOS IC for calling number
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PF1243-01
S1C05251
S1C05250,
GR-30-CORE,
S1C05251
V23 FSK Japan
DTMF fsk cli circuit
BELLCORE FSK
BELL202
GR-30-CORE
S1C05250
SIN227
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VR7JA127258GBD
Abstract: ddr3 VR7JA287258FBA VR7JA567258GB DDR3-1066F b.a part 1
Text: DDR3 ECC ADDRESS PARITY MINI-DIMM MODULE CONFIGURATIONS Viking Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7JA287258FBZ VR7JA287258FBA VR7JA287258FBB VR7JA287258FBC VR7JA287258FBD VR7JA287258FBE
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VR7JA287258FBZ
VR7JA287258FBA
VR7JA287258FBB
VR7JA287258FBC
VR7JA287258FBD
VR7JA287258FBE
VR7JA287258FBF1
VR7JA567258GBZ
VR7JA567258GBA
VR7JA567258GBB
VR7JA127258GBD
ddr3
VR7JA287258FBA
VR7JA567258GB
DDR3-1066F
b.a part 1
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VR7VA12
Abstract: DDR3 RDIMM SPD JEDEC VR7VA1G7254GED VR7VA1G725 ddr3 4gb ddp
Text: DDR3 ECC ADDRESS PARITY VLP DIMM VR7VAxx7254xBx Module Configuration V/I Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7VA567254FBZ VR7VA567254FBA VR7VA567254FBB VR7VA567254FBC VR7VA567254FBD
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VR7VAxx7254xBx
VR7VA567254FBZ
VR7VA567254FBA
VR7VA567254FBB
VR7VA567254FBC
VR7VA567254FBD
VR7VA567254FBE
VR7VA127254GBZ
VR7VA127254GBA
VR7VA127254GBB
VR7VA12
DDR3 RDIMM SPD JEDEC
VR7VA1G7254GED
VR7VA1G725
ddr3 4gb ddp
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viking pc100
Abstract: tsop 338 dtx 360
Text: PC100/PC133 ECC REGISTERED DIMM VR8ARxx7238xTx MODULE CONFIGURATIONS VMS Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks 128MB 16Mx72 16M x 8 9 TSOP 1 VR8AR167238CTC VR8AR167238CTD Performance CAS Latency PC100
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PC100/PC133
VR8ARxx7238xTx
128MB
16Mx72
VR8AR167238CTD
PC100
VR8AR167238CTC
PC133
VR8AR167238CTE
viking pc100
tsop 338
dtx 360
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SM564163578NW3R
Abstract: SM564163578
Text: SM564163578NW3R February 26, 2002 Orderable Part Numbers Module Part Number CAS Latency Speed SM564163578NW3R 3 only 133MHz Revision History • February 26, 2002 Modified AC Characteristics on page 7. • June 20, 2001 Modified DC Characteristics on page 5.
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SM564163578NW3R
SM564163578NW3R
133MHz
604-399290IN
SM564163578
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sm5643
Abstract: No abstract text available
Text: SM564323578NV3R May 11, 2001 Orderable Part Numbers Module Part Number CAS Latency Speed SM564323578NV3R 3 only 133MHz Revision History • May 11, 2001 Datasheet released. Corporate Headquarters: P. O. Box 1757, Fremont, CA 94538, USA • Tel: 510 623-1231 • Fax:(510) 623-1434 • E-mail: [email protected]
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SM564323578NV3R
133MHz
256MByte
32Mx16
144-pin
sm5643
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM374F160 8 0BK/BS Revision History Version 0.0 (Dec, 1997) • Removed two AC parameters t CACP (access time from CAS) and t AAP (access time from col. addr.) in AC CHARACTERISTICS. • Changed Module part number from KMM374F160(8)0AK/AS to KMM374F160(8)0BK/BS caused by component revision.
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KMM374F160
16Mx4,
16Mx72bits
16Mx4bits
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intel 8042
Abstract: 450GX 450NX 82451NX 82452NX 82453NX 82454NX CL-CK L10
Text: intel Intel 450NX PCIset 82454NX PCI Expander Bridge PXB 82453NX Data Path Multiplexor (MUX) 82452NX RAS/CAS Generator (RCG) 82451NX Memory & I/O Controller (MIOC) Order Number: 243771-004 June 1998 Intel Corporation 1998 Information in this document is provided in connection with Intel products. No license, express or
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450NX
82454NX
82453NX
82452NX
82451NX
intel 8042
450GX
CL-CK L10
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Untitled
Abstract: No abstract text available
Text: SM564323578NVUP May 11, 2001 Orderable Part Numbers Module Part Number CAS Latency Speed SM564323578NV3P 3 only 100MHz SM564323578NVBP 2&3 100MHz Revision History • May 11, 2001 Datasheet released. Corporate Headquarters: P. O. Box 1757, Fremont, CA 94538, USA • Tel: 510 623-1231 • Fax:(510) 623-1434 • E-mail: [email protected]
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SM564323578NVUP
SM564323578NV3P
SM564323578NVBP
100MHz
100MHz
256MByte
32Mx16
144-pin
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Untitled
Abstract: No abstract text available
Text: SM564643578NVUP April 25, 2001 Orderable Part Numbers Module Part Number CAS Latency Speed SM564643578NVBP CL= 2 & 3 100MHz SM564643578NV3P CL= 3 100MHz Revision History • April 25, 2001 Datasheet released. Corporate Headquarters: P. O. Box 1757, Fremont, CA 94538, USA • Tel: 510 623-1231 • Fax:(510) 623-1434 • E-mail: [email protected]
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SM564643578NVUP
SM564643578NVBP
SM564643578NV3P
100MHz
100MHz
512MByte
32Mx16
144-pin
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Untitled
Abstract: No abstract text available
Text: SM564643578NV3R June 20, 2001 Orderable Part Numbers Module Part Number CAS Latency Speed SM564643578NV3R 3 133MHz Revision History • June 20, 2001 Modified AC Characteristics tRCD on page 7. • April 25, 2001 Datasheet released. Corporate Headquarters: P. O. Box 1757, Fremont, CA 94538, USA • Tel:(510) 623-1231 • Fax:(510) 623-1434 • E-mail: [email protected]
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SM564643578NV3R
133MHz
512MByte
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HYM7V64401
Abstract: hym7v64401b
Text: 4Mx64 bits PC66 SDRAM SO DIMM based on 4Mx16 SDRAM with LVTTL, 4 banks & 4K Refresh HYM7V64401B Q-Series Preliminary DESCRIPTION The Hyundai HYM7V64401B Q-Series are 4Mx64bits Synchronous DRAM Modules composed of four 4Mx16bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package and 2Kbit EEPROM in 8pin TSSOP package on a 144pin glassepoxy printed circuit board. Two 0.22uF and two 0.0022uF decoupling capacitors per each SDRAM are mounted on the
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4Mx64
4Mx16
HYM7V64401B
4Mx64bits
4Mx16bit
400mil
54pin
144pin
0022uF
HYM7V64401
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hym7v64801
Abstract: HYM7V64801B
Text: 8Mx64 bits PC66 SDRAM SO DIMM based on 8Mx8 SDRAM with LVTTL, 4 banks & 4K Refresh HYM7V64801B Z-Series Preliminary DESCRIPTION The Hyundai HYM7V64801B Z-Series are 8Mx64bits Synchronous DRAM Modules composed of eight 8Mx8bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package and 2Kbit EEPROM in 8pin TSSOP package on a 144pin glassepoxy printed circuit board. One 0.22uF and one 0.0022uF decoupling capacitors per each SDRAM are mounted on the
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8Mx64
HYM7V64801B
8Mx64bits
400mil
54pin
144pin
0022uF
64Mbytes
hym7v64801
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BELLCORE GR-30-CORE
Abstract: GR-30-CORE
Text: EPSON PF997-01 E0C5250 CAS + FSK 1C • ITU V.23 & Bell 202 FSK Receiver • Bellcore "CPE Alerting Signal" Detection • BT "Idle Tone Alert Signal" Detection • Low Voltage Operation • DESCRIPTION The CAS + FSK 1C Calling Number Identification Receiver 1C with Calling Waiting is a CMOS integrated circuit,
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OCR Scan
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PDF
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PF997-01
E0C5250
GR-30-CORE,
dete42
33b4134
00D3347
C-425
BELLCORE GR-30-CORE
GR-30-CORE
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Untitled
Abstract: No abstract text available
Text: 5 - 1 5 Bub interface 5.1 Bus Control General The processor provides on-chip all functions to control memory and peripheral devices, including RAS-CAS multiplexing, DRAM refresh and parity generation and checking. The number of bus cycles used for a memory or I/O access Is also defined by the
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OCR Scan
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Untitled
Abstract: No abstract text available
Text: 5 - 1 5 Bub interface 5.1 Bus Control General Tbe processor provides on-chip a ll functions to control memory and peripheral devices, including RAS-CAS m ultiplexing, D RAM refresh and p arity generation and checking. The number of bus cycles used for a memory or I/O access Is also defined by the
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OCR Scan
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-40pf)
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P873-G35-380
Abstract: P873G35-380 P873-25 HPK P873-25 P873 P673 P873-G35-687 6133 P
Text: 200 1 $ 2ñ 60 1613 li HPK/SOLID STATE DIV No, 6133 'P. 2/4 W S Ë B È È È m iœ & m i cas OUTPUT TYPE HAMAMATSU <vC PHOTOCOUPLERS P873 SERIES TECHNICAL DATA LED Input, CdS Ceil Output, Cylindrical Package The CdS output type photocoupler has a number of features such
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OCR Scan
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P873-G35-687,
P873-24,
P873-25
E75221)
P873-G35-380)
P873-G35-380
P873G35-380
P873-25
HPK P873-25
P873
P673
P873-G35-687
6133 P
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p873
Abstract: cds cell p873-25 P873-G35-687 HPK P873-25 PHOTOCOUPLER CDS P873-24 P873-g35 P873-G35-380 triac photocoupler
Text: 2 0 0 1 $ 2ñ 6 0 1 6 1 3 li H P K / S O L I D S T A T E D IV No, 6 1 3 3 'P. 2 / 4 W S Ë B È È È m iœ & m i cas OUTPUT TYPE HAMAMATSU <vC PHOTOCOUPLERS P873 SERIES TECHNICAL DATA LED Input, CdS Ceil Output, Cylindrical Package The CdS output type photocoupler has a number of features such
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3-G35-'
3-G35-
873-GC
873-G:
p873
cds cell
p873-25
P873-G35-687
HPK P873-25
PHOTOCOUPLER CDS
P873-24
P873-g35
P873-G35-380
triac photocoupler
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