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    BY THERMAL PERFORMANCE Search Results

    BY THERMAL PERFORMANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation
    SF Impression Pixel

    BY THERMAL PERFORMANCE Price and Stock

    Advanced Thermal Solutions Inc ATS-54400W-C1-R0

    40.0 x 40.0 x 24.5 mm BGA Heat Sink High Performance Straight Fin with adhesive thermal tape Black Anodized Aluminum
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    Onlinecomponents.com ATS-54400W-C1-R0 100
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    Advanced Thermal Solutions Inc ATS-55400K-C1-R0

    40.0 x 40.0 x 14.5 mm BGA Heat Sink High Performance Cross Cut adhesive thermal tape Aluminum Black Anodized
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    Onlinecomponents.com ATS-55400K-C1-R0 100
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    Advanced Thermal Solutions Inc ATS-55450W-C1-R0

    45.0 x 45.0 x 24.5 mm BGA Heat Sink High Performance Cross Cut adhesive thermal tape Aluminum Black Anodized
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    Onlinecomponents.com ATS-55450W-C1-R0 100
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    Advanced Thermal Solutions Inc ATS-54250D-C1-R0

    25.0 x 25.0 x 9.5 mm BGA Heat Sink High Performance Straight Fin with adhesive thermal tape Black Anodized Aluminum
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    Onlinecomponents.com ATS-54250D-C1-R0 100
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    Advanced Thermal Solutions Inc ATS-55250K-C1-R0

    25.0 x 25.0 x 14.5 mm BGA Heat Sink High Performance Cross Cut adhesive thermal tape Aluminum Black Anodized
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com ATS-55250K-C1-R0 100
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    Find more BY THERMAL PERFORMANCE price and stock on Findchips.com

    BY THERMAL PERFORMANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SMD TRANSISTOR js t

    Abstract: smd transistor 2T smd transistor js
    Text: Philips Semiconductors Thermal Considerations - Transistors THERMAL CONSIDERATIONS - TRANSISTORS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are improved by keeping the die temperature junction


    Original     		PDF MBG388 SMD TRANSISTOR js t smd transistor 2T smd transistor js

    JTP 55 diode

    Abstract: diode sod57 SOD87 sod87 package Schottky SOD87 JTP 38 diode JTp 07
    Text: Philips Semiconductors Thermal Considerations - Diodes General THERMAL CONSIDERATIONS - DIODES Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the die. Normally, both are improved by keeping the die temperature junction temperature low.


    Original     		PDF MBH562 MGA200 JTP 55 diode diode sod57 SOD87 sod87 package Schottky SOD87 JTP 38 diode JTp 07

    base resistance for SOT23

    Abstract: MBB444
    Text: Philips Semiconductors Thermal Considerations - FETs General ,  , ,  THERMAL CONSIDERATIONS ,, , Thermal resistance 1 Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are improved by keeping the die temperature junction


    Original     		PDF MBE242 MGC124 MBB447 base resistance for SOT23 MBB444

    JESD51-2

    Abstract: JESD-51 JESD51-9 JESD51-6 G30-88 JESD51-3 JESD51 thermal resistance jesd51 6 SAMSUNG TSOP
    Text: Thermal Characteristics Information 1 Samsung Proprietary • Definition of Thermal Resistance ○ In general, thermal performance of electronic package is represented by two kinds of thermal resistance,θja and θjc. ○ Heat dissipation path in a package and the equivalent thermal resistance


    Original     		PDF JESD51-2 JESD51-6 G30-88 JESD51-3/7 JESD51-9 JESD51-2 JESD-51 JESD51-9 JESD51-6 G30-88 JESD51-3 JESD51 thermal resistance jesd51 6 SAMSUNG TSOP

    MBH561

    Abstract: Thermal Considerations for Power Semiconductors jtp sot23
    Text: Philips Semiconductors Thermal Considerations - Diodes General ,  , ,  THERMAL CONSIDERATIONS - DIODES ,, , Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the die. Normally, both are improved by keeping the die temperature junction temperature low.


    Original     		PDF MBH560 OD110 OD323 OT143 MBH561 Thermal Considerations for Power Semiconductors jtp sot23

    JTP 68 diode

    Abstract: SOD87 SC70-6 SO20 SSOP16 SSOP24 Thermal Considerations for Power Semiconductors SOD-64 SOD-106 SOD-83
    Text: Philips Semiconductors Power Diodes Thermal Considerations Thermal resistance Circuit performance and long term reliability are affected by the temperature of the chip. Normally, both are improved by keeping the chip temperature junction temperature low.


    Original     		PDF OT428 OT404 JTP 68 diode SOD87 SC70-6 SO20 SSOP16 SSOP24 Thermal Considerations for Power Semiconductors SOD-64 SOD-106 SOD-83

    FR4 epoxy pcb double sided

    Abstract: SA transistor thermal resistance of low power semiconductor
    Text: Philips Semiconductors Thermal considerations PowerMOS Transistors The elements of thermal resistance shown in Fig.2 are defined as follows: THERMAL CONSIDERATIONS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are


    Original     		PDF MBB446 MBB447 FR4 epoxy pcb double sided SA transistor thermal resistance of low power semiconductor

    The Effect of Forced Air Cooling on Heat Sink Thermal Ratings

    Abstract: No abstract text available
    Text: zpero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which


    Original     		PDF

    crouzet 900

    Abstract: No abstract text available
    Text: pero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Emission Microscope R series Thermal Emission Microscope 5AHEAI The THEMOS series thermal emission microscope is a semiconductor failure analysis system that pinpoints failures by detecting thermal emissions generated within the semiconductor device. The increasing


    Original     		PDF SE-164 SSMS0012E10 JAN/2013

    wacker P12

    Abstract: graphite foil PG-3504 keratherm graphite foil thermal interface resistance htc electrolube 1000-1 POWER MODULE TIC4000 thermal grease p12 uscan
    Text: Application Note AN-10-001 Revision: Issue Date: 2010-03-30 Prepared by: Dieter Esau Key Words: Thermal paste THERMAL PASTE APPLICATION Designated use of thermal interface material TIM . 1


    Original     		PDF AN-10-001 wacker P12 graphite foil PG-3504 keratherm graphite foil thermal interface resistance htc electrolube 1000-1 POWER MODULE TIC4000 thermal grease p12 uscan

    thermal analysis on pcb

    Abstract: AND8432
    Text: AND8432 Thermal Considerations for a 4x4 mm QFN Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview board−to−ambient thermal resistance which is controlled by board size, materials, layout, and thermal boundary conditions , can easily range from about 15°C/W up to in


    Original     		PDF AND8432 AND8432/D thermal analysis on pcb AND8432

    TMS320

    Abstract: TX75243
    Text: TMS320 DSP Number 91 DESIGNER’S NOTEBOOK TMS320C6x Thermal Design Considerations Contributed by David Bell April 29, 1998 Design Problem Thermal analysis and heat sink selection for the TMS320C6x. Solution Like most high-performance processors, the ‘C6x dissipates some thermal energy during


    Original     		PDF TMS320 TMS320C6x TMS320C6x. 045A-17 TX75243

    temperature controlled cooling system

    Abstract: co2 sensor circuit APP4334 DS28EA00 ZigBee internal circuit intelligent energy saving system
    Text: Maxim > App Notes > 1-Wire Devices Keywords: 1-Wire, chain mode, thermal monitor, thermal measurement, server farm, thermal efficiency May 25, 2009 APPLICATION NOTE 4334 Add Thermal Monitoring to Reduce Data Center Energy Consumption By: Erin Mannas, Scott Jones


    Original     		PDF DS28EA00: com/an4334 AN4334, APP4334, Appnote4334, temperature controlled cooling system co2 sensor circuit APP4334 DS28EA00 ZigBee internal circuit intelligent energy saving system

    MQUAD

    Abstract: Aavid Thermalloy financial
    Text: THERMAL MANAGEMENT OF HIGH PERFORMANCE MICROPROCESSORS TECHNICAL NOTE TN-28 Integrated Device Technology, Inc. By Chris Wyland Introduction Sample Application Designing in highly integrated, high clock rate microprocessors requires careful consideration of thermal


    Original     		PDF TN-28 2327B. MQUAD Aavid Thermalloy financial

    AN1955

    Abstract: AN1955 rf integrated circuit
    Text: Freescale Semiconductor Application Note AN1955 Rev. 0, 1/2004 Thermal Measurement Methodology of RF Power Amplifiers By: Mali Mahalingam and Edward Mares INTRODUCTION This document explains the methodology used by Freescale for thermal measurement of high power RF Radio


    Original     		PDF AN1955 AN1955 AN1955 rf integrated circuit

    Untitled

    Abstract: No abstract text available
    Text: MICROTEMP Thermal Cutoff APPLICATION NOTES MICROTEMP® thermal cutoffs, available in a variety of standard and custom configurations, provide reliable one-shot, over-temperature protection in a wide range of applications. Performance can be affected by installation method and proper location of the thermal cutoff. Both application


    Original     		PDF

    Application Note 02_01 TELUX

    Abstract: CECC00802 TLWR7600
    Text: Application Note 02_01 TELUX Vishay Semiconductors Specification, Thermal management and design-in 1. Introduction The performance and reliability of TELUX LED are mainly determined by a proper thermal management of the complete lamp system. The thermal management is a critical part in the design in of high power


    Original     		PDF D-74025 06-Aug Application Note 02_01 TELUX CECC00802 TLWR7600

    16888

    Abstract: CECC00802 TLWR7600
    Text: Application Note 02_01 TELUX VISHAY Vishay Semiconductors Specification, Thermal management and design-in \ 1. Introduction The performance and reliability of TELUX LED are mainly determined by a proper thermal management of the complete lamp system. The thermal management is a critical part in the design in of high power


    Original     		PDF D-74025 06-Aug 16888 CECC00802 TLWR7600

    to-268

    Abstract: No abstract text available
    Text: HEATSINK D Series THERMAL MANAGEMENT Heatsink For SMT devices F e at u r e s • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum


    Original     		PDF O-263) DV-T263-101E DA-T263-101E DV-T263-101E-TR DA-T263-101E-TR DV-T268-101E DA-T268-101E DV-T268-101E-TR DA-T268-101E-TR 1-866-9-OHMITE to-268

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Thermal considerations PowerMOS Transistors The elements of thermal resistance shown in Fig.2 are defined as follows: THERMAL CONSIDERATIONS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Small-signal Transistors General THERMAL CONSIDERATIONS The elements of thermal resistance shown in Fig.8 are defined as follows: Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are


    OCR Scan     		PDF

    MOTOROLA POWER TRANSISTOR

    Abstract: working of astable multivibrator circuit bipolar transistor tester mje13008 motorola AN1033 BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS Tektronix 7603 tester SCR DL111/D AN569
    Text: by'ANI 083/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA AN1083 Basic Thermal Management of Power Semiconductors BY AL PSHAENICH MOTOROLA SEMICONDUCTOR PRODUCTS SECTOR Thermal management of power semiconductors is often overlooked by design engineers, either through oversight,


    OCR Scan     		PDF AN1083/D AN1083/D MOTOROLA POWER TRANSISTOR working of astable multivibrator circuit bipolar transistor tester mje13008 motorola AN1033 BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS Tektronix 7603 tester SCR DL111/D AN569

    astec application note ampss

    Abstract: No abstract text available
    Text: 3. Thermal Management 3.1 Introduction The quality of thermal management techniques employed in equipment design directly affects performance and reliability. Where AMPSS modules form part of a design, good thermal management will ensure that heat generated by the modules is effectively control­


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