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    BOND PULL TEST Search Results

    BOND PULL TEST Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    FO-62.5LPBMT0-001 Amphenol Cables on Demand Amphenol FO-62.5LPBMT0-001 MT-RJ Connector Loopback Cable: Multimode 62.5/125 Fiber Optic Port Testing .1m Datasheet

    BOND PULL TEST Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    precap

    Abstract: No abstract text available
    Text: Manufacturing Flow KIT FORMATION KIT INSPECTION DIE & COMPONENT ATTACH - WITH EPOXY CURE EPOXY CUSTOMER SOURCE INSPECTION IF APPLICABLE VACUUM BAKE HERMETIC SEAL MARK WIRE BOND QUAL/DESTRUCT WIRE PULL TEMPERATURE CYCLE WIRE BOND CONSTANT ACCELERATION WIRE BOND


    Original     		PDF

    Quality & Reliability

    Abstract: No abstract text available
    Text: Quality & Reliability Program Calogic Quality Flow for Semiconductor Circuit Manufacturing Receiving Assembly QC Operator Monitor and Process Audit Die attach Lead-bond inspect Wire pull-test Incoming Inspection 100% Production 3rd Optical Stores QC Gate 3rd Optical


    Original     		PDF MIL-STD-883 1Q-25 Quality & Reliability

    INCOMING RAW MATERIAL INSPECTION chart

    Abstract: INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart LINEAR TECHNOLOGY mark code INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL aql incoming inspection mil-std-883 2015 Gold Ball Bond Shear
    Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS TO-92 Linear Technology Carsem Maylasia Linear Technology


    Original     		PDF MIL-STD-883 INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart LINEAR TECHNOLOGY mark code INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL aql incoming inspection mil-std-883 2015 Gold Ball Bond Shear

    Mil-Std-883 Wire Bond Pull Method 2011

    Abstract: MIL-STD-883 Method 2010 pHEMT transistor RF MESFET S parameters MESFET 0.15 phemt p-hemt TGA8310 MIL-STD-883 method 2011 GaAs 0.15 pHEMT
    Text: GaAs MMIC Space Qualification GaAs MMIC Testing TriQuint Semiconductor has advanced Lot Acceptance Testing LAT for High Reliability Applications of GaAs MMICs. A flowchart depicting the entire MMIC processing flow, including the Quality Conformance Inspection


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    INCOMING RAW MATERIAL INSPECTION

    Abstract: 7224 markem INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL flowchart Markem 7224 Ink INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method LINEAR TECHNOLOGY mark code asm chart INCOMING RAW MATERIAL
    Text: ATTACHMENT 2. ASSEMBLY FLOWCHART Pg. 1 of 3 INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS DD PACK Linear Technology Penang & Carsem Linear Technology


    Original     		PDF MIL-STD-883 INCOMING RAW MATERIAL INSPECTION 7224 markem INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL flowchart Markem 7224 Ink INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method LINEAR TECHNOLOGY mark code asm chart INCOMING RAW MATERIAL

    INCOMING RAW MATERIAL INSPECTION

    Abstract: INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart CARSEM LINEAR TECHNOLOGY mark code mil-std-883 2015 Gold Ball Bond Shear INCOMING RAW MATERIAL INSPECTION chart INCOMING MATERIAL FLOW PROCESS
    Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology Corporation BIPOLAR PROCESS 3, 4, 5, 6 Lead SOT-23 Linear Technology Corp., Milpitas,


    Original     		PDF OT-23 MIL-STD-883 INCOMING RAW MATERIAL INSPECTION INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart CARSEM LINEAR TECHNOLOGY mark code mil-std-883 2015 Gold Ball Bond Shear INCOMING RAW MATERIAL INSPECTION chart INCOMING MATERIAL FLOW PROCESS

    LINEAR TECHNOLOGY mark code

    Abstract: INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION chart INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method wafer prober INCOMING RAW MATERIAL flowchart aql incoming inspection INCOMING MATERIAL FLOW PROCESS
    Text: ATTACHMENT 2. ASSEMBLY FLOWCHART Pg. 1 of 3 INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS TO-3P Linear Technology Chinteik Thailand, Linear Technology


    Original     		PDF MIL-STD-883 LINEAR TECHNOLOGY mark code INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION chart INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method wafer prober INCOMING RAW MATERIAL flowchart aql incoming inspection INCOMING MATERIAL FLOW PROCESS

    INCOMING RAW MATERIAL INSPECTION

    Abstract: INCOMING RAW MATERIAL INSPECTION method INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL LINEAR TECHNOLOGY mark code inspection sampling plan INCOMING RAW MATERIAL INSPECTION chart mil-std-883 2015 Gold Ball Bond Shear
    Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology Corporation Bipolar Process 3 Lead SOT-223 Linear Technology Corp., Milpitas,


    Original     		PDF OT-223 MIL-STD-883 INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL LINEAR TECHNOLOGY mark code inspection sampling plan INCOMING RAW MATERIAL INSPECTION chart mil-std-883 2015 Gold Ball Bond Shear

    aec-q100

    Abstract: AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782
    Text: Automotive Qualification Report MAX7042ATJ+ 308MHz/315MHz/ 418MHz/433.92MHz Low-Power, FSK Superheterodyne Receiver Grade 1 32-Lead TQFN 5 x 5 mm AEC-Q100 Rev. F Tests MSL 1 - Preconditioning PC Biased HAST (HAST) 9 9 9 Lot # 2 (Q43ACQ001B) MAX1499EHJ Maxim


    Original     		PDF MAX7042ATJ+ 308MHz/315MHz/ 418MHz/433 92MHz 32-Lead AEC-Q100 QYK0BQ001D) MAX7042ATJ AEC-Q100 LF12Z AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782

    combiner THEORY

    Abstract: wilkinson divider AN999 HMMC5033 HMMC-5033 HMMC5040 HMMC-5040 DC TO 18GHZ RF AMPLIFIER MMIC bond wire gold Analysis and Prevention Oscillations
    Text: 1 WATT 17.7 GHz – 32 GHz Linear Power Amplifier Application Note # 52 - Rev. A.1 July 1998 1.0 Introduction This application note provides application information and performance data on the use of HMMC5033 linear amplifiers in multiple chip combined configurations to increase output power. Configurations of two 2x and four (4×) MMICs were assembled and tested to demonstrate feasibility and


    Original     		PDF HMMC5033 HMMC-5033 combiner THEORY wilkinson divider AN999 HMMC-5033 HMMC5040 HMMC-5040 DC TO 18GHZ RF AMPLIFIER MMIC bond wire gold Analysis and Prevention Oscillations

    Untitled

    Abstract: No abstract text available
    Text: N RADIATION OWNER’S MANUAL Table of Contents – Processing & Flows Page Glossary Processing Capabilities Space Options & Test Flows QML V and JAN Class S Process Flow QML M, QML Q, and JAN Class B Process Flow 35 36 37 N RADIATION OWNER’S MANUAL – Processing Capabilities


    Original     		PDF MIL-PRF-38535 MIL-PRF-38535.

    ph9a

    Abstract: Ablebond 71-1 TC906 TC904 TC905 GaAs 0.15 um pHEMT RELIABILITY capacitor MTTF
    Text: PH9 Reliability Application Note # 51 - Rev. A Marketing March 1997 1.0 Introduction es at the HTOL stress temperatures. This application note provides a summary of reliability and environmental testing performed to date on 0.25 µm gate length PHEMT processes PH9A


    Original     		PDF TC904 ph9a Ablebond 71-1 TC906 TC905 GaAs 0.15 um pHEMT RELIABILITY capacitor MTTF

    ph9a

    Abstract: Ablebond 71-1 RELIABILITY DATA capacitor MTTF HMMC-5023 HMMC5040 HMMC-5040 HMMC-5618
    Text: PH9 Reliability Application Note # 51 - Rev. A March 1997 1.0 Introduction es at the HTOL stress temperatures. This application note provides a summary of reliability and environmental testing performed to date on 0.25 µm gate length PHEMT processes PH9A


    Original     		PDF HMMC-5023 ph9a Ablebond 71-1 RELIABILITY DATA capacitor MTTF HMMC5040 HMMC-5040 HMMC-5618

    ph9a

    Abstract: Ablebond 71-1 60-circuit
    Text:  PH9 Reliability Application Note # 51 - Rev. A MWTC MARKETING March 1997 1.0. Introduction This application note provides a summary of reliability and environmental testing performed to date on 0.25 µm gate length PHEMT processes PH9A and PH9B at HP-MWTC. The


    Original     		PDF HMMC-5023 ph9a Ablebond 71-1 60-circuit

    Sn60A

    Abstract: MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM
    Text: MIL-STD-883H METHOD 2001.3 * CONSTANT ACCELERATION 1. PURPOSE. This test is used to determine the effects of constant acceleration on microelectronic devices. It is an accelerated test designed to indicate types of structural and mechanical weaknesses not necessarily detected in shock and


    Original     		PDF MIL-STD-883H Sn60A MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM

    MIL-STD-883 method 2019

    Abstract: Diode T3D 82 T3D 82 T3D 82 diode t3d diode W125D "MIL-STD-883 Method 2019" 48T4 Mil-Std-883 Wire Bond Pull Method 2011
    Text: Specifications and Test Methods No. 1 Specification Item Operating Temperature Test Method X7R : Y55D to W125D Y5V : Y30D to W85D 2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor.


    Original     		PDF W125D 1000T12 MIL-STD-883 method 2019 Diode T3D 82 T3D 82 T3D 82 diode t3d diode W125D "MIL-STD-883 Method 2019" 48T4 Mil-Std-883 Wire Bond Pull Method 2011

    Untitled

    Abstract: No abstract text available
    Text: !SPECIFICATIONS AND TEST METHODS No. 1 Item Specification 2 Rated Voltage See the previous pages. 3 4 Appearance Dimensions No defects or abnormality. See the previous pages. 5 Dielectric Strength No defects or abnormality. 6 Insulation Resistance I.R. 10,000MΩ min.


    Original     		PDF W125D 1000T12

    IMCS 700

    Abstract: Ablebond 71-1 TC729 TC724 tc725
    Text: MMICB Reliability Application Note # 42 May 1993 1.0 Introduction This application note provides information regarding the reliability performance of GaAs integrated circuits and components fabricated with the MMICB process at MWTC. The objective is to compile and summarize the reliability test results in a


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    AN-1060

    Abstract: Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49
    Text: AN-1060 International Rectifier • 233 Kansas Street, El Segundo, CA 90245 ! USA BARE DIE: HANDLING AND STORAGE By Richard Clark Introduction International Rectifier supply a range of power devices in a variety of packages and in Bare Die form. The Bare Die products are available in a


    Original     		PDF AN-1060 AN-1060 Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49

    Silicon Controlled Rectifier Manual

    Abstract: jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060
    Text: Application Note AN-1060 Bare Die: Handling and Storage By Richard Clark Table of Contents Page Introduction .1 Packing/Carrier Type .1


    Original     		PDF AN-1060 Silicon Controlled Rectifier Manual jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060

    WIRE SHEAR PULL MIL-STD

    Abstract: Mil-Std-883 Wire Bond Pull Method 2011 PH25
    Text: Application Note UMS GaAs Wafer Acceptance Tests This application note describes the tests performed by UMS in order to control and guarantee the overall quality of the GaAs MMIC wafers, prior to the individual chip measurement and individual visual inspection. These wafer acceptance tests consist in a


    Original     		PDF ANWAT9137 04-JAN-00 WIRE SHEAR PULL MIL-STD Mil-Std-883 Wire Bond Pull Method 2011 PH25

    BS0001

    Abstract: BS-0001 INCOMING RAW MATERIAL INSPECTION method centrifuge
    Text: m o \ Reliability Program ELECTRONIC DESIGNS IN C . Quality Control Tests and Procedures Electronic Designs, Inc.'s continuing effort to be a leader in providing top quality products has lead us to com plete our m ission to become IS 09001 certified. The certification is the most comprehensive quality


    OCR Scan     		PDF Hours/80 C/150 EP-00008 TP-00002 QP-00062 TP-00006 EP-00004, EP-00005 QP-00062 BS0001 BS-0001 INCOMING RAW MATERIAL INSPECTION method centrifuge

    Untitled

    Abstract: No abstract text available
    Text: T602B HMIX 77 GHz GaAs Harmonic Mixer • Operating RF/LO-Frequencies: Fr f = 76,5 GHz, F l o = 15.1 GHz • Input/Output matched, RF/LO-Port: 50 Q . ESD: Electrostatic discharge sensitive device, observe handling precautions! Description: The given description is based on preliminary test results at room temperature. During


    OCR Scan     		PDF T602B 100x100/50x50

    Untitled

    Abstract: No abstract text available
    Text: T602B MPA 2 77 GHz GaAs Two-stage Medium Power Amplifier • Output Power 13.5 dBm • Operating RF-Frequency: 76,5 GHz • Input/Output matched to 50 Q. ESD: Electrostatic discharge sensitive device, observe handling precautions! D escription: The given description is based on preliminary test results at room temperature. During


    OCR Scan     		PDF T602B