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SMC Corporation of America MBL32-160Z CYLINDER, TIE ROD, MB-Z SERIES \| SMC Corporation MBL32-160Z
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	MBL32-160Z	Bulk		5 Weeks	1	1 $136.51 10 $136.51 100 $136.51 1000 $136.51 10000 $136.51	Get Quote
Others EBL3216-4R7K INSTOCK
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Chip 1 Exchange	EBL3216-4R7K		5,500			1 - 10 - 100 - 1000 - 10000 -	Get Quote

BL3216 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PCB Chip Types PCB Chip, Cylindrical Top with Inner Lens TCI Part No. TSP3-WL3212A2 TSP3-WL3216T1A2 TSP3-CL3216 TSP3-BL3216A2 TSP3-BL3216C2 TSP3-TL3216C2 TSP3-FL3216E2 TSP3-XL3216A2 TSP3-XL3216A3 TSP3-QL3216A2 TSP3-QL3216A3 Chip Matrial Emitted Color InGaN	Original	PDF	TSP3-WL3212A2 TSP3-WL3216T1A2 TSP3-CL3216 TSP3-BL3216A2 TSP3-BL3216C2 TSP3-TL3216C2 TSP3-FL3216E2 TSP3-XL3216A2 TSP3-XL3216A3 TSP3-QL3216A2
ACX Multilayer Chip Abstract: BL3216 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 3216 Series【Preliminary】 Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL321607B1900_ ACX Multilayer Chip BL3216 ACX balun multilayer GHz
ACX Multilayer Chip Abstract: ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL321620B2100_ ACX Multilayer Chip ACX balun multilayer GHz
ACX Multilayer Chip Abstract: ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL321610B0900_ ACX Multilayer Chip ACX balun multilayer GHz
hcl l54 Abstract: t538 LM3935 TXC7A dr3 c502 7A14300038 T596 quanta b30 c300 - 1 South Bridge ALI M1535 Text: 5 4 3 2 1 Model MODEL REV MK3 M/B BOARD 1A 2A CHANGE LIST MK3 M/B BOARD Page FM 1 1A 2 3A PAGE 8 Layout change add R420,R423 for U25 OSC32K,Y3 BOM del 3 3B PAGE11 Layout change add C648 for HWPG,U5 and TC1&D2 BOM del First Release PAGE 2 Layout change add U37,R411,R412,R413,R414,R415,C647 for AMD recommand	Original	PDF	OSC32K PAGE11 PAGE12 PAGE13 PAGE15 PAGE16 PAGE17 C620for 102K/F 1U/25V hcl l54 t538 LM3935 TXC7A dr3 c502 7A14300038 T596 quanta b30 c300 - 1 South Bridge ALI M1535
Untitled Abstract: No abstract text available Text: 2-1 TEL: 852-26909605 FAX: 852-26909606 E-mail: [email protected] b CERAMIC BASIC TYPE HIGH-PERFORMANCE LEDs Rev: B 陶瓷型高效率發光二極體 Date: 2005/4/10 GH-3216 Series Electro-Optical Characteristics: Code for parts GH-XXXXX Lighting Color	Original	PDF	GH-3216 RQ3216TC-DPE OV3216TC-DPE YU3216TC-DPE GB3216TC-DPJ G33216TC-JPH BL3216TC-JPH RS-481 3000pcs/Reel
ACX balun Abstract: ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 3216 Series【Preliminary】 Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL321607B1200_ ACX balun ACX Multilayer Chip multilayer GHz
ACX balun Abstract: ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL321620B0900_ ACX balun ACX Multilayer Chip multilayer GHz
ACX Multilayer Chip Abstract: ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL321620B1800_ ACX Multilayer Chip ACX balun multilayer GHz