SF-BGA352B-B-11
Abstract: No abstract text available
Text: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads
|
Original
|
PDF
|
BGA352B
FR4/G10
26X26
SF-BGA352B-B-11
|
LS-BGA352B-11
Abstract: No abstract text available
Text: Tooling hole X2 BGA352B Ø 0.0156" (2x) (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] Top View (reference only) 1.00mm [0.039"] pitch typ. X Variable 0.508 mm [0.020"] dia pads 0.50mm [0.020"] 1 5.33mm [0.210"]
|
Original
|
PDF
|
BGA352B
FR4/G10
LS-BGA352B-11
|
BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
|
Original
|
PDF
|
BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
|