Untitled
Abstract: No abstract text available
Text: Package outline BGA324: plastic ball grid array package; 324 balls SOT1129-2 B D D1 A ball A1 index area E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 shape
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BGA324:
OT1129-2
sot1129-2
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm SOT1129-1 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A e2 1/2 e 1 2 3 4 5 6 7 9 11 13 15 17 19 21
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BGA324:
OT1129-1
sot1129-1
MS-034
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MS-034
Abstract: No abstract text available
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA329: plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm SOT611-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 ∅v M C A B b e y y1 C ∅w M C AC AB AA e Y W V U T R P N e2
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BGA329:
OT611-1
MS-034
MS-034
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19X19
Abstract: PBGA324 PRBG0324FA-A P-BGA-324 324f
Text: JEITA Package Code P-BGA324-19x19-1.00 RENESAS Code PRBG0324FA-A D B D1 Previous Code 324F7X-A MASS[Typ.] 1.1g A b A ZD S AB e ZE V U T R P N M L K J H G F E D C B E1 E e A1 A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Reference Symbol D
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P-BGA324-19x19-1
PRBG0324FA-A
324F7X-A
19X19
PBGA324
PRBG0324FA-A
P-BGA-324
324f
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BGA 328
Abstract: SF-BGA328B-B-11
Text: D C Package Code: BGA328B See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA328B
FR4/G10
SF-BGA328B-B-11
BGA 328
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SF-BGA328A-B-11
Abstract: BGA 328
Text: D C Package Code: BGA328A 31.75mm [1.250"] See BGA pattern code to the right for actual pattern layout Y [0.025"] 0.89mm [0.035"] X Top View reference only 31.75mm [1.250"] 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"] [0.210"]
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BGA328A
FR4/G10
SF-BGA328A-B-11
BGA 328
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PRBG0329DA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA329-31x31-1.27 RENESAS Code PRBG0329DA-A D MASS[Typ.] 3.4g A ZD A D1 b S AB e A1 y S Index mark S ZE AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 329F7X-B 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 19 20 21 22 23
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P-BGA329-31x31-1
PRBG0329DA-A
329F7X-B
PRBG0329DA-A
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MS-034
Abstract: No abstract text available
Text: PDF: 2003 Jan 31 Philips Semiconductors Package outline BGA329: plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm SOT611-2 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 e y y1 C ∅v M C A B b ∅w M C AC AB AA Y W V U T R P N M L
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BGA329:
OT611-2
MS-034
MS-034
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SF-BGA320C-B-11
Abstract: No abstract text available
Text: D Package Code: BGA320C C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X Top View reference only 25.4mm [1.000"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 3 1.27mm [0.050"]
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BGA320C
FR4/G10
SF-BGA320C-B-11
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pitch 0.4mm BGA
Abstract: SF-BGA324A-B-11
Text: C Package Code: BGA324A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]
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BGA324A
FR4/G10
20X20
SF-BGA324A-B-11
pitch 0.4mm BGA
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0.4mm pitch BGA
Abstract: pitch 0.4mm BGA SF-BGA324G-B-11 1mm pitch BGA
Text: C Package Code: BGA324G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 17.00mm [0.669"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA324G
FR4/G10
18X18
SF-BGA324G-B-11
0.4mm pitch BGA
pitch 0.4mm BGA
1mm pitch BGA
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SF-BGA324D-B-11
Abstract: No abstract text available
Text: D Package Code: BGA324D C 25.5mm [1.004"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 1.5mm typ. [0.059"] X 25.5mm [1.004"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]
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BGA324D
18X18
SF-BGA324D-B-11
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SF-BGA324H-B-11
Abstract: No abstract text available
Text: D Package Code: BGA324H C 21.59mm [0.850"] 0.69mm [0.027"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 21.59mm [0.850"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 0.63mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA324H
FR4/G10
18X18
SF-BGA324H-B-11
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sot611
Abstract: No abstract text available
Text: PDF: 2000 Mar 22 Philips Semiconductors Package outline BGA329: plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm SOT611-2 B D A D1 ball A1 index area A A2 A1 E1 E detail X k k C e1 v M B b e ∅w M AC AB AA Y W V U T R P N M L K J H G F E
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BGA329:
OT611-2
sot611
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Untitled
Abstract: No abstract text available
Text: Package outline BGA329: plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm SOT611-2 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 e ∅w M C AC AB AA Y W V U T R P N M L K J H G F E D C B A e e2 shape optional 4x 1 2 3 4 5 6 7 8
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BGA329:
OT611-2
MS-034
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SF-BGA320B-B-11
Abstract: No abstract text available
Text: D C Package Code: BGA320B 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA320B
FR4/G10
SF-BGA320B-B-11
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BGA324B
Abstract: SF-BGA324B-B-11
Text: D C Package Code: BGA324B 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA324B
FR4/G10
SF-BGA324B-B-11
BGA324B
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SF-BGA329A-B-11
Abstract: No abstract text available
Text: D C Package Code: BGA329A 29.21mm [1.150"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.48mm [0.019"] X Top View reference only 29.21mm [1.150"] 2 1.27 mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 0.64mm
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BGA329A
FR4/G10
36cription:
SF-BGA329A-B-11
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philips 3120
Abstract: sot611
Text: PDF: 2000 Mar 24 Philips Semiconductors Package outline BGA329: plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm SOT611-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X k k C e1 v M B b e ∅w M AC AB AA Y W V U T R P N M L K J H G F E
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BGA329:
OT611-1
philips 3120
sot611
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SF-BGA324F-B-11
Abstract: land pattern BGA 0,50
Text: D Package Code: BGA324F C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 0.025" dia . pad X 24.13mm [0.950"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 3 Side View (reference only)
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BGA324F
FR4/G10
20X20
SF-BGA324F-B-11
land pattern BGA 0,50
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BGA324
Abstract: BGA-324 MS-034 sot787
Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.75 mm SOT787-1 B D A D1 ball A1 index area A A2 A 1 E1 E detail X C e1 e 1/2 ∅v M b e ∅w M AB AA Y W V U T R P N M L K J H G F
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BGA324:
OT787-1
MS-034
BGA324
BGA-324
MS-034
sot787
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SF-BGA324E-B-11
Abstract: No abstract text available
Text: D C Package Code: BGA324E 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA324E
FR4/G10
SF-BGA324E324
SF-BGA324E-B-11
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pitch 0.4mm BGA
Abstract: 22X22 SF-BGA324J-B-11
Text: C Package Code: BGA324J D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm
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BGA324J
FR4/G10
22X22
SF-BGA324J-B-11
pitch 0.4mm BGA
22X22
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SAMSUNG MCP
Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)
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KBB0xB400M
16Mx16)
4Mx16)
80-Ball
80x12
SAMSUNG MCP
ECH information
KBB0xB400M
BA102
ba4901
UtRAM Density
BA5101
samsung NAND memory
BGA180
ba30 transistor
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