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    BGA-56 12 Search Results

    BGA-56 12 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA-56 12 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transistor A7

    Abstract: G28F640J5
    Text: CIC-56µ µBGA-40D-A6-YAM 56-Bump µ BGA to a 40-Pin DIP Mar-98 µ BGA DEVICES: EXAMPLES PIN CONFIGURATION: G28F320J5 G28F640J5 SOCKET: Yamaichi NP291-07210-AC08338 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $300.00 $270.00 $255.00 $225.00 TYPICAL DIMENSIONS:


    Original     		PDF CIC-56 BGA-40D-A6-YAM 56-Bump 40-Pin Mar-98 G28F320J5 G28F640J5 NP291-07210-AC08338 transistor A7 G28F640J5

    transistor A7

    Abstract: G28F640J5 A5D2 Apr98
    Text: CIC-56µ µBGA-48D-A6-YAM 56-Bump µ BGA to a 48-Pin DIP Apr-98 µ BGA DEVICES: EXAMPLES PIN CONFIGURATION: G28F320J5 G28F640J5 SOCKET: Yamaichi NP291-07210-AC08338 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $310.00 $279.00 $263.50 $232.50 TYPICAL DIMENSIONS:


    Original     		PDF CIC-56 BGA-48D-A6-YAM 56-Bump 48-Pin Apr-98 G28F320J5 G28F640J5 NP291-07210-AC08338 transistor A7 G28F640J5 A5D2 Apr98

    EPF6024A

    Abstract: No abstract text available
    Text: EPF6024A Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6024A 208-Pin PQFP EPF6024A 240-Pin PQFP EPF6024A 256-Pin BGA EPF6024A 256-Pin FineLine BGA EPF6024A MSEL (2) 33 46 52 T3 L5 nSTATUS (2) 56 80 92 W11 K8 nCONFIG (2) 53 77 89 Y11 N8 DCLK (2) 128


    Original     		PDF EPF6024A 144-Pin EPF6024A 208-Pin 240-Pin 256-Pin

    48 ball VFBGA

    Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
    Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated


    Original     		PDF SZZA029B 16-Bit 56-Ball, 65-mm 56-ball MO-225, 48-pin 56-pin 48 ball VFBGA 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET ALVCH16373 LVCH16244A

    CS478

    Abstract: bst r16 166 EPF6016A 77n8 C13-C16 j9148 k970 272C9 M15N-3
    Text: EPF6016A Device Pin-Outs ver. 1.0 Pin Name 1 100-Pin TQFP EPF6016A 100-Pin FineLine BGA EPF6016A 144-Pin TQFP EPF6016A 208-Pin PQFP EPF6016A 256-Pin FineLine BGA EPF6016A MSEL (2) 22 H2 33 46 L5 nSTATUS (2) 39 G5 56 80 K8 nCONFIG (2) 36 K5 53 77 N8 DCLK (2)


    Original     		PDF EPF6016A 100-Pin EPF6016A 144-Pin 208-Pin 256-Pin CS478 bst r16 166 77n8 C13-C16 j9148 k970 272C9 M15N-3

    UA42

    Abstract: VFBGA-48 bga rework aa56 yamaichi socket
    Text: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm


    Original     		PDF 56GQL 56-pin 65-mm SCET004 UA42 VFBGA-48 bga rework aa56 yamaichi socket

    entek Cu-56

    Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		PDF Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability

    EPF6010A

    Abstract: K553
    Text: EPF6010A Device Pin-Outs ver. 1.0 Pin Name 1 100-Pin TQFP EPF6010A 100-Pin FineLine BGA EPF6010A 144-Pin TQFP EPF6010A MSEL (2) 22 H2 33 nSTATUS (2) 39 G5 56 nCONFIG (2) 36 K5 53 DCLK (2) 89 D6 128 CONF_DONE (2) 72 C9 105 INIT_DONE (3) 64 E10 94 nCE (2)


    Original     		PDF EPF6010A 100-Pin EPF6010A 144-Pin EPF6016AT100 EPF6010AT100 EPF6010AT144 K553

    TS512MQR72V4T

    Abstract: No abstract text available
    Text: 240PIN DDR2 400 Registered DIMM 4096MB With 256Mx4 CL3 TS512MQR72V4T Description Placement The TS512MQR72V4T is a 512M x 72bits DDR2-400 Registered DIMM. The TS512MQR72V4T consists of 18 pcs st.512Mx4bits DDR2 SDRAMs in 56 ball BGA package, 2 pcs register in 96 ball uBGA package, 1 pcs


    Original     		PDF 240PIN 4096MB 256Mx4 TS512MQR72V4T TS512MQR72V4T 72bits DDR2-400 512Mx4bits 240-pin

    Untitled

    Abstract: No abstract text available
    Text: 240PIN DDR2 400 Registered DIMM 4096MB With 256Mx4 CL3 TS512MQR72V4T Placement Description The TS512MQR72V4T is a 512M x 72bits DDR2-400 Registered DIMM. The TS512MQR72V4T consists of 18 pcs st.512Mx4bits DDR2 SDRAMs in 56 ball BGA package, 2 pcs register in 96 ball uBGA package, 1 pcs


    Original     		PDF 240PIN 4096MB 256Mx4 TS512MQR72V4T TS512MQR72V4T 72bits DDR2-400 512Mx4bits 240-pin

    EPF6016

    Abstract: 216 C9 T20 ver 2
    Text: EPF6016 Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6016 208-Pin PQFP EPF6016 240-Pin PQFP EPF6016 256-Pin BGA EPF6016 MSEL (2) 33 46 52 T3 nSTATUS (2) 56 80 92 W11 nCONFIG (2) 53 77 89 Y11 DCLK (2) 128 184 212 C10 CONF_DONE (2) 105 150 172 E18 INIT_DONE (3)


    Original     		PDF EPF6016 144-Pin EPF6016 208-Pin 240-Pin 256-Pin EPF6024AB256 216 C9 T20 ver 2

    EP1K10

    Abstract: DATA44
    Text: EP1K10 Device Pin-Outs Version 1.4 Pin Name 1 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 256-Pin FineLine BGA 77 76 35 74 107 2 14 106 3 142 141 144 143 11 7 116 114 113 112 111 110 109 108 105 4 1 34 54, 56, 124, 126 108 107 52 105 155 2 19 154 3 206 204 208


    Original     		PDF EP1K10 100-Pin 144-Pin 208-Pin 256-Pin DATA44

    bga 0,8 mm

    Abstract: XC2C32A VQ44 XC2C128 XC2C32A XC2C256 XC2C384 XC2C64A XCR3032XL CP132 XCR3128XL
    Text: CoolRunner-II Family Logic Resources XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL XCR3512XL System Gates 750 1,500 3,000 6,000 9,000 12,000 750 1,500 3,000 6,000 9,000 12,000 Macrocells 32 64 128 256 384


    Original     		PDF XC2C64A XC2C128 XC2C256 XC2C384 XC2C512 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL bga 0,8 mm XC2C32A VQ44 XC2C128 XC2C32A XC2C256 XC2C384 XC2C64A XCR3032XL CP132 XCR3128XL

    Migration Guide for Intel StrataFlash Memory J

    Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3
    Text: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst


    Original     		PDF W18/W30) K3/K18) 128-bit Migration Guide for Intel StrataFlash Memory J Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    LVDSEXT-25

    Abstract: BLVDS-25 LVDSEXT25 bga 896 BGA 31 x 31 mm XC2V80 XC2V8000 XC2V40 XC2V250 XC2V500
    Text: XILINX VIRTEX FPGAs http://www.xilinx.com/products/platform/ Pins Body Size I/O’s 204 348 396 564 852 88 120 200 264 432 528 624 720 912 1104 1296 XCV812E XCV405E XCV3200E XCV2600E XCV2000E V-EM 1.8V XCV1600E XCV1000E XCV600E XCV400E XCV300E XCV200E XCV100E


    Original     		PDF XC2V250 XC2V500 XC2VP20 XC2VP50 XC2V40 XC2V80 XC2V1000 XC2V1500 XC2V2000 XC2V3000 LVDSEXT-25 BLVDS-25 LVDSEXT25 bga 896 BGA 31 x 31 mm XC2V8000

    bga 1296

    Abstract: XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25
    Text: XILINX FPGA PACKAGE OPTIONS AND USER I/O Pins Body Size I/O’s 88 120 200 264 432 528 624 720 912 1104 1296 176 176 284 316 404 512 660 724 804 804 804 404 556 XC2S200 XC2S150 XC2S100 XC2S50 XC2S30 Spartan-II 2.5V XC2S15 XC2S300E XC2S200E XC2S150E XC2S100E


    Original     		PDF XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 XC2V250 XC2V500 XCV100E bga 1296 XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25

    T25 4 h5

    Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
    Text: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –


    Original     		PDF EP20K60E 144-Pin 208-Pin 240-Pin 324-Pin 356-Pin T25 4 h5 AE23 AF23 356-pin 215 bga BGA128

    PQFP ALTERA 160

    Abstract: TQFP 132 PACKAGE EPM7256A EPM7256AE EPM7256B EPM7256S EPM7512AE EPM7512B
    Text: EPM7256B Dedicated Pin-Outs ver. 1.1 Dedicated Pin 100-Pin TQFP 144-Pin TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 87 125 D8 INPUT/GCLRn 89 127 D6 INPUT/OE1 88 126 D7 INPUT/OE2/GCLK2 90 128 E7 TDI 2 TMS (2) TCK (2) TDO (2) VREFA (3) VREFB (3) GNDINT GNDIO (3)


    Original     		PDF EPM7256B 100-Pin 144-Pin 169-Pin 208-Pin PQFP ALTERA 160 TQFP 132 PACKAGE EPM7256A EPM7256AE EPM7256S EPM7512AE EPM7512B

    Untitled

    Abstract: No abstract text available
    Text: EN71NS128B0 EN71NS128B0 Base MCP Stacked Multi-Chip Product MCP Flash Memory and RAM 128 Megabit (8M x 16-bit) CMOS 1.8 Volt-only Simultaneous Operation Burst Mode Flash Memory and 32 Megabit (2M x 16-bit) Pseudo Static RAM Distinctive Characteristics MCP Features


    Original     		PDF EN71NS128B0 EN71NS128B0 16-bit) 108MHz) EN71NS E29NS128

    Untitled

    Abstract: No abstract text available
    Text: EN71NS128B0 EN71NS128B0 Base MCP Stacked Multi-Chip Product MCP Flash Memory and RAM 128 Megabit (8M x 16-bit) CMOS 1.8 Volt-only Simultaneous Operation Burst Mode Flash Memory and 32 Megabit (2M x 16-bit) Pseudo Static RAM Distinctive Characteristics MCP Features


    Original     		PDF EN71NS128B0 EN71NS128B0 16-bit) 108MHz) EN71NS E29NS128

    MX23L12814TI-10

    Abstract: MX23L12814TI-12 MX23L12814XI-10 MX23L12814XI-12
    Text: PRELIMINARY MX23L12814 128M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 16Mb x 8 byte mode - 8Mb x 16 (word mode) • Fast access time - Random access:100/30ns(max.) • Page size - 8 words per page • Current - Operating:50mA - Standby:15uA(max.)


    Original     		PDF MX23L12814 128M-BIT 100/30ns 64-BGA PM0779 SEP/09/2002 SEP/16/2002 JUL/03/2003 MX23L12814TI-10 MX23L12814TI-12 MX23L12814XI-10 MX23L12814XI-12

    MX23L1

    Abstract: MX23L12814TI-10 MX23L12814TI-12 MX23L12814XI-10 MX23L12814XI-12
    Text: PRELIMINARY MX23L12814 128M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 16Mb x 8 byte mode - 8Mb x 16 (word mode) • Fast access time - Random access:100/30ns(max.) • Page size - 8 words per page • Current - Operating:50mA - Standby:15uA(max.)


    Original     		PDF MX23L12814 128M-BIT 100/30ns MAY/15/2001 JUL/13/2001 SEP/10/2001 OCT/05/2001 MX23L1 MX23L12814TI-10 MX23L12814TI-12 MX23L12814XI-10 MX23L12814XI-12

    PQFP-144

    Abstract: EP20K30E
    Text: EP20K30E I/O Pins ver. 1.1 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 208-Pin PQFP 144-Pin 1 (1) FineLine BGA 324-Pin FineLine BGA 8 8 8 8 8 8 8 8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 8 8 8 8 7 7 15 16 17 18 19 20 21 22 23 24 25 26


    Original     		PDF EP20K30E 144-Pin 208-Pin 144-Pin 324-Pin PQFP-144