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    BGA PACKAGE TOP MARK INTEL Search Results

    BGA PACKAGE TOP MARK INTEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE TOP MARK INTEL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3

    BGA PACKAGE TOP MARK intel

    Abstract: intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK CG-041493 Intel BGA Solder bga intel
    Text: E PRELIMINARY Mechanical Specification for Easy BGA Package March 1999 Revision: 2.0 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


    Original     		PDF 32-Mb 64-Mb 128-Mb BGA PACKAGE TOP MARK intel intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK CG-041493 Intel BGA Solder bga intel

    BGA PACKAGE TOP MARK intel

    Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
    Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK

    Untitled

    Abstract: No abstract text available
    Text: TDK FLASH STOR STORAGE AGE DATA SHEET eSSD SATA 3Gbps SSD Device ERS3S Series Merging Memory and Intelligence “eSSD” The adoption of solid state drives SSDs as storage devices that substitute and complement HDDs is rapidly increasing for various electronic devices. The memory


    Original     		PDF 55MByte/sec 30MByte/sec 15bit/512Byte

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    rd33708

    Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3
    Text: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF 28F1602C3 US048631 28F1604C3 28F3202C3 28F3204C3 US048681 rd33708 BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3

    LV 1084 73

    Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
    Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA


    Original     		PDF SZZA028A 20-Ball, 65-mm 20-ball LV 1084 73 LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245

    48 ball VFBGA

    Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
    Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated


    Original     		PDF SZZA029B 16-Bit 56-Ball, 65-mm 56-ball MO-225, 48-pin 56-pin 48 ball VFBGA 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET ALVCH16373 LVCH16244A

    TE28F320B3TD

    Abstract: TE28F320B3BD70 GE28F160B3BC70 TE28F160B3BC70 TE28F320B3TD70 PH28F320 TE28F320B3BC70 TE28F320B3BD GE28F160B3BD70 te28f160b3ta90
    Text: Intel Advanced Boot Block Flash Memory B3 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.7 V – 3.6 V read/program/erase — 12 V VPP fast production programming • 1.65 V – .5 V or 2.7 V – 3.6 V I/O option


    Original     		PDF 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 64-KB 48-ball TE28F320B3TD TE28F320B3BD70 GE28F160B3BC70 TE28F160B3BC70 TE28F320B3TD70 PH28F320 TE28F320B3BC70 TE28F320B3BD GE28F160B3BD70 te28f160b3ta90

    JS28F160B3BD70

    Abstract: flash device MARKing intel 28f016 te28F320B3BD70 BGA PACKAGE TOP MARK intel uBGA device MARKing intel GE28F160B3BC70 JS28F320B3BD70 intel BGA PACKAGE TOP MARK 28F016B3 28F160B3
    Text: Intel Advanced Boot Block Flash Memory B3 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.7 V – 3.6 V read/program/erase — 12 V V PP fast production programming • 1.65 V – .5 V or 2.7 V – 3.6 V I/O option


    Original     		PDF 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 64-KB 48-ball JS28F160B3BD70 flash device MARKing intel 28f016 te28F320B3BD70 BGA PACKAGE TOP MARK intel uBGA device MARKing intel GE28F160B3BC70 JS28F320B3BD70 intel BGA PACKAGE TOP MARK 28F016B3 28F160B3

    intel nand flash

    Abstract: HBM 00-07H pf29f32 nand flash ONFI 3.0 DQ04-1 intel nand flash decoder 3185* Intel intel nand flash memory Z-P140 16GB Nand flash dual channel
    Text: Intel Z-P140 PATA Solid State Drive SSDPAPS0002G1, SSDPAPS0004G1 Preliminary Datasheet Product Features „ „ „ „ „ Capacities — 2 GB extensible to 8 GB using Intel SD54B NAND Flash Memory components — 4 GB (extensible to 16 GB using Intel SD58B NAND Flash Memory components)


    Original     		PDF Z-P140 SSDPAPS0002G1, SSDPAPS0004G1 SD54B SD58B 318890-001US intel nand flash HBM 00-07H pf29f32 nand flash ONFI 3.0 DQ04-1 intel nand flash decoder 3185* Intel intel nand flash memory 16GB Nand flash dual channel

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    te28f320b3bd70

    Abstract: TE28F320B3TD flash device MARKing intel 28f016 28F008B3 28F016B3 28F160B3 28F320B3 28F640B3 28F800B3 76000-77FFF
    Text: Intel£ Advanced Boot Block Flash Memory B3 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.7 V – 3.6 V Read/Program/Erase — 12 V VPP Fast Production Programming • 1.65 V – .5 V or 2.7 V – 3.6 V I/O Option


    Original     		PDF 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 48-ball te28f320b3bd70 TE28F320B3TD flash device MARKing intel 28f016 28F008B3 28F016B3 28F160B3 28F320B3 28F640B3 28F800B3 76000-77FFF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


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    ic 6116 datasheet from texas instruments

    Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
    Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF

    pentium mmx specification update

    Abstract: intel DIP mark
    Text: Intel IXF1010 10-Port 100/1000 Mbps Ethernet Media Access Controller Specification Update July 2003 Notice: The IXF1010 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this specification


    Original     		PDF IXF1010 10-Port pentium mmx specification update intel DIP mark

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    B5589-01

    Abstract: UCLXT312E b5589 LXT315ANE LXT312ANE PDLXT312ANE.A2 INTEL LOT NUMBER code label LXT315ANE-A2 PDLXT315ANE PDLXT315ANE.A2
    Text: Intel LXT312A/LXT315A Low Power T1 PCM Repeaters/Transceivers Datasheet The LXT312A and LXT315A are integrated repeater/transceiver circuits for T1 carrier systems. The LXT312A is a dual repeater/transceiver and the LXT315A is a single repeater/transceiver.


    Original     		PDF LXT312A/LXT315A LXT312A LXT315A B5589-01 B5589-01 UCLXT312E b5589 LXT315ANE LXT312ANE PDLXT312ANE.A2 INTEL LOT NUMBER code label LXT315ANE-A2 PDLXT315ANE PDLXT315ANE.A2

    L640ML12P

    Abstract: 64 fortified bga ei 306 20 64
    Text: ADVANCE INFORMATION Am29LV640MH/L 64 Megabit 4 M x 16-Bit/8 M x 8-Bit MirrorBit 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Single power supply operation — 3 V for read, erase, and program operations


    Original     		PDF Am29LV640MH/L 16-Bit/8 128-word/256-byte 8-word/16-byte TS056 TSR056 L640ML12P 64 fortified bga ei 306 20 64

    W-CSP footprint

    Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
    Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board


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    CM16C550P

    Abstract: 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP
    Text: Rev. 2.1 i960 Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP