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    BGA L Search Results

    BGA L Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA L Price and Stock

    Texas Instruments AWR2943ABGALTQ1

    SENSOR RADAR CAN/GPIO/I2C OUT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR2943ABGALTQ1 Tray 168 1
    • 1 $40.54
    • 10 $33.298
    • 100 $40.54
    • 1000 $40.54
    • 10000 $40.54
    		Buy Now
    Mouser Electronics AWR2943ABGALTQ1 671
    • 1 $40.54
    • 10 $33.3
    • 100 $32.44
    • 1000 $32.43
    • 10000 $32.43
    		Buy Now

    KEMET Corporation C1206C103KBGAL

    .010UF 630V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey C1206C103KBGAL Bulk 1,059
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.1699
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    Newark C1206C103KBGAL Bulk 1,059
    • 1 -
    • 10 -
    • 100 -
    • 1000 $0.153
    • 10000 $0.137
    		Buy Now

    Texas Instruments IWR2944ABGALTR

    Industrial, 76-GHz to 81-GHz hig
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey IWR2944ABGALTR Reel 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $29.1158
    • 10000 $29.1158
    		Buy Now
    Mouser Electronics IWR2944ABGALTR 1,000
    • 1 $41.55
    • 10 $38.77
    • 100 $33.66
    • 1000 $29.71
    • 10000 $29.71
    		Buy Now

    KEMET Corporation C0805H471JBGAL

    470.PF 630V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey C0805H471JBGAL Bulk 19
    • 1 -
    • 10 -
    • 100 $9.34632
    • 1000 $9.34632
    • 10000 $9.34632
    		Buy Now

    Texas Instruments AWR2944ABGALTQ1

    SENSOR RADAR CAN/GPIO/I2C OUT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR2944ABGALTQ1 Tray 168
    • 1 -
    • 10 -
    • 100 -
    • 1000 $38.44381
    • 10000 $38.44381
    		Buy Now
    Mouser Electronics AWR2944ABGALTQ1 485
    • 1 $53.01
    • 10 $44.64
    • 100 $40.06
    • 1000 $38.67
    • 10000 $38.67
    		Buy Now
    Find more BGA L price and stock on Findchips.com

    BGA L Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    reflow temperature rohs bga

    Abstract: 0.65mm pitch BGA
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 157 BGA socket
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    led matrix circuits

    Abstract: 256-pin Plastic BGA BGA-256P-M02
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)


    Original     		PDF BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02

    led matrix circuits

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)


    Original     		PDF BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits

    led matrix circuits

    Abstract: fujitsu FUJITSU SEMICONDUCTOR
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)


    Original     		PDF BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)


    Original     		PDF BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)


    Original     		PDF BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P

    256-pin BGA

    Abstract: 24 pin MATRIX led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)


    Original     		PDF BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits

    256-pin BGA

    Abstract: led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)


    Original     		PDF BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits

    bga PCB footprint

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF CAT16-PREVIEW06

    BGA-256P-M02

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)


    Original     		PDF BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 BGA-256P-M02

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1

    BGA-420P

    Abstract: BGA-420P-M01
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ


    Original     		PDF BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 BGA-420P BGA-420P-M01

    416-PIN

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)


    Original     		PDF BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2

    led matrix circuits

    Abstract: BGA-272P-M01
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)


    Original     		PDF BGA-272P-M01 272-pin BGA-272P-M01) B272001SC-1-3 led matrix circuits BGA-272P-M01

    BGA-352

    Abstract: 352-PIN
    Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M02 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008)


    Original     		PDF BGA-352P-M02 50mil 352-pin BGA-352P-M02) BGA352003SC-1-1 BGA-352

    T0-50

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.20(1.378±.008)SQ 31.75±0.20(1.250±.008) INDEX C1.0 (.039) 1.27±0.20


    Original     		PDF BGA-352P-M01 50mil 352-pin BGA-352P-M01) BGA352002SC-1-1 T0-50

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2

    256-pin Plastic BGA

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ


    Original     		PDF BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 o256-pin 256-pin Plastic BGA

    BGA-576

    Abstract: BGA576 576-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)


    Original     		PDF BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 BGA-576 BGA576