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    BGA EP1C20 Search Results

    BGA EP1C20 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA EP1C20 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 PDF

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC PDF

    ep2c20

    Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
    Text: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced


    Original     		100-Pin 144-Pin 208-Pin 240-Pin 256-Pin 324-Pin 400-Pin 484-Pin 672-Pin ep2c20 EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64 PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: C5200 C52006-1 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20
    Text: 15. Package Information for Cyclone Devices C52006-1.2 Introduction This data sheet provides package information for Altera devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 15–1


    Original     		C52006-1 EP1C12 EP1C20 BGA 256 PACKAGE thermal resistance C5200 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20 PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance C52006-1 EP1C12 BGA400 EP1C6 C5200
    Text: 15. Package Information for Cyclone Devices C52006-1.3 Introduction This data sheet provides package information for Altera devices. It includes the following sections: • ■ ■ “Device and Package Cross Reference” on page 15–1 “Thermal Resistance” on page 15–2


    Original     		C52006-1 EP1C20 BGA 256 PACKAGE thermal resistance bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance EP1C12 BGA400 EP1C6 C5200 PDF

    altera cyclone 3

    Abstract: C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6
    Text: Section VII. Cyclone Device Package Information This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


    Original     		EP1C20 altera cyclone 3 C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6 PDF

    altera cyclone 3

    Abstract: C52006-1 EP1C12 table 15
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications. This section includes the following chapter:


    Original     		EP1C12 EP1C20 altera cyclone 3 C52006-1 EP1C12 table 15 PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    EP1C3T100

    Abstract: APEX 20ke development board sram excalibur APEX development board nios SFI-5 APEX nios development board ep20k100 board excalibur Board
    Text: Component Selector Guide February 2003 Altera Corporation S SOPC Solutions The world’s pioneer in system-on-a-programmable-chip SOPC solutions, Altera Corporation offers a complete range of programmable logic device (PLD) products with the flexibility, functionality, package types, and time-tomarket advantages to meet almost any design need.


    Original     		SG-COMP-12 EP1C3T100 APEX 20ke development board sram excalibur APEX development board nios SFI-5 APEX nios development board ep20k100 board excalibur Board PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 PDF

    Fast Cycle RAM

    Abstract: EP1C12
    Text: 1. Introduction C51001-1.2 Introduction The CycloneTM field programmable gate array family is based on a 1.5-V, 0.13-µm, all-layer copper SRAM process, with densities up to 20,060 logic elements LEs and up to 288 Kbits of RAM. With features like phaselocked loops (PLLs) for clocking and a dedicated double data rate (DDR)


    Original     		C51001-1 33-MHz, 32-bit 144-pin 100-Pin 144-Pin 240-Pin 256-Pin 324-Pin 400-Pin Fast Cycle RAM EP1C12 PDF

    "Fast Cycle RAM"

    Abstract: altera cyclone 3 pins BGA and QFP Package 256 PIN QFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION 256-pin Plastic BGA EP1C12 100 PIN PQFP ALTERA DIMENSION 240 PIN QFP ALTERA DIMENSION cyclone serial interface
    Text: 1. Introduction C51001-1.5 Introduction The Cyclone field programmable gate array family is based on a 1.5-V, 0.13- m, all-layer copper SRAM process, with densities up to 20,060 logic elements LEs and up to 288 Kbits of RAM. With features like phase-locked loops (PLLs) for clocking and a dedicated double data rate


    Original     		C51001-1 33-MHz, 32-bit 64-bit "Fast Cycle RAM" altera cyclone 3 pins BGA and QFP Package 256 PIN QFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION 256-pin Plastic BGA EP1C12 100 PIN PQFP ALTERA DIMENSION 240 PIN QFP ALTERA DIMENSION cyclone serial interface PDF

    EP1K100QC208-3 ALTERA

    Abstract: EP1K30TI144-2 EP1K30TC144-3 EPC2LI20 EP1K10TC100-3 EPCS1SI8 EP1C3T144I7 ep1k30 EP1K50-208 ep1K50QC208-3 Datasheet
    Text: Technical Brief Using Extended Temperature Range Devices in Quartus II Software Introduction The Altera MAX® 7000AE, ACEX® 1K, and Cyclone® device families support an extended range of temperatures see Table 1 to meet the production needs of automotive, communications, military, and industrial applications.


    Original     		7000AE, EP1K100QC208-3 ALTERA EP1K30TI144-2 EP1K30TC144-3 EPC2LI20 EP1K10TC100-3 EPCS1SI8 EP1C3T144I7 ep1k30 EP1K50-208 ep1K50QC208-3 Datasheet PDF

    jtag pin

    Abstract: PQFP ALTERA 160 EP1C12
    Text: 1. Introduction C51001-1.4 Introduction The Cyclone field programmable gate array family is based on a 1.5-V, 0.13- m, all-layer copper SRAM process, with densities up to 20,060 logic elements LEs and up to 288 Kbits of RAM. With features like phaselocked loops (PLLs) for clocking and a dedicated double data rate (DDR)


    Original     		C51001-1 33-MHz, 32-bit 64-bit jtag pin PQFP ALTERA 160 EP1C12 PDF

    Error Detection

    Abstract: AA20 AN25 CRC-32 CRC calculation EP1C12 pin diagram Altera Stratix 484 pin BGA diagram
    Text: Error Detection Using CRC in Altera FPGA Devices Application Note 357 July 2004, ver. 1.0 Introduction In critical applications, it is important to be able to confirm that the configuration data in an FPGA device is correct and be able to trigger a re-configuration if data corruption occurs due to a single event upset


    Original     		PDF

    JESD8

    Abstract: ANSI/TIA/EIA-644 15-V EP1C12 JESD89A JESD87
    Text: 8. Using Selectable I/O Standards in Cyclone Devices C51008-1.5 Introduction The proliferation of I/O standards and the need for improved I/O performance have made it critical that low-cost devices have flexible I/O capabilities. Selectable I/O capabilities such as SSTL-2, SSTL-3, and


    Original     		C51008-1 JESD8 ANSI/TIA/EIA-644 15-V EP1C12 JESD89A JESD87 PDF

    JESD85

    Abstract: JESD87 ANSI/TIA/EIA-644 15-V EP1C12 JESD89A
    Text: 8. Using Selectable I/O Standards in Cyclone Devices C51008-1.6 Introduction The proliferation of I/O standards and the need for improved I/O performance have made it critical that low-cost devices have flexible I/O capabilities. Selectable I/O capabilities such as SSTL-2, SSTL-3, and


    Original     		C51008-1 JESD85 JESD87 ANSI/TIA/EIA-644 15-V EP1C12 JESD89A PDF

    BGA and QFP Altera Package mounting

    Abstract: diode zener ph c5v1 527 MOSFET TRANSISTOR motorola PH C5V1 lt1085 linear SOIC Package 8-Pin Surface Mount 601 "Fast Cycle RAM" mounting pad dimentions PQFP motorola smd transistor code 621 BGA OUTLINE DRAWING
    Text: Cyclone Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com C5V1-1.0 Copyright 2003 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


    Original     		00-mm BGA and QFP Altera Package mounting diode zener ph c5v1 527 MOSFET TRANSISTOR motorola PH C5V1 lt1085 linear SOIC Package 8-Pin Surface Mount 601 "Fast Cycle RAM" mounting pad dimentions PQFP motorola smd transistor code 621 BGA OUTLINE DRAWING PDF

    Error Detection

    Abstract: altera stratix ii ep2s60 circuit diagram AN25 EP1S60 CRC-IEEE802
    Text: Error Detection and Recovery Using CRC in Altera FPGA Devices Application Note 357 January 2007, Version 1.3 Introduction In critical applications, such as avionics, telecommunications, system control, and military applications, it is important to be able to:


    Original     		PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 PDF

    tms 3899

    Abstract: lot Code Formats altera cyclone EPC8 bios fail EPM3032 EP1C12F
    Text: Section I. Cyclone FPGA Family Data Sheet This section provides designers with the data sheet specifications for Cyclone devices. The chapters contain feature definitions of the internal architecture, configuration and JTAG boundary-scan testing information,


    Original     		7000B tms 3899 lot Code Formats altera cyclone EPC8 bios fail EPM3032 EP1C12F PDF