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    BGA 420 Search Results

    BGA 420 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 420 Price and Stock

    Infineon Technologies AG BGA420H6327XTSA1

    IC RF AMP GPS 0HZ-3GHZ SOT343-3D
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA420H6327XTSA1 Digi-Reel 776 1
    • 1 $1.1
    • 10 $0.838
    • 100 $0.6488
    • 1000 $0.52101
    • 10000 $0.52101
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    BGA420H6327XTSA1 Cut Tape 776 1
    • 1 $1.1
    • 10 $0.838
    • 100 $0.6488
    • 1000 $0.52101
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    BGA420H6327XTSA1 Reel 3,000
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    Mouser Electronics BGA420H6327XTSA1 2,026
    • 1 $1.1
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    • 100 $0.592
    • 1000 $0.477
    • 10000 $0.381
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    Verical BGA420H6327XTSA1 30,000 3,000
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    BGA420H6327XTSA1 2,950 813
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    BGA420H6327XTSA1 2,788 16
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    BGA420H6327XTSA1 2,248 813
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    BGA420H6327XTSA1 1,601 97
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    • 1000 $0.26
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    Arrow Electronics BGA420H6327XTSA1 Cut Strips 2,788 8 Weeks 1
    • 1 $0.5633
    • 10 $0.4791
    • 100 $0.4273
    • 1000 $0.3787
    • 10000 $0.3787
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    Newark BGA420H6327XTSA1 Cut Tape 2,000 1
    • 1 $0.457
    • 10 $0.457
    • 100 $0.419
    • 1000 $0.419
    • 10000 $0.419
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    BGA420H6327XTSA1 Reel 3,000
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    • 10000 $0.465
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    Bristol Electronics BGA420H6327XTSA1 232
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    Quest Components BGA420H6327XTSA1 185
    • 1 $0.595
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    • 100 $0.357
    • 1000 $0.2975
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    BGA420H6327XTSA1 185
    • 1 $0.595
    • 10 $0.595
    • 100 $0.357
    • 1000 $0.2975
    • 10000 $0.2975
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    Rochester Electronics BGA420H6327XTSA1 5,584 1
    • 1 $0.4101
    • 10 $0.4101
    • 100 $0.3855
    • 1000 $0.3486
    • 10000 $0.3486
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    Chip1Stop BGA420H6327XTSA1 Cut Tape 1,601
    • 1 -
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    • 100 $0.149
    • 1000 $0.146
    • 10000 $0.146
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    EBV Elektronik BGA420H6327XTSA1 9 Weeks 3,000
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    Win Source Electronics BGA420H6327XTSA1 14,999
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    • 100 $0.566
    • 1000 $0.377
    • 10000 $0.377
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    Rochester Electronics LLC BGA420E6433

    IC RF AMP GPS 0HZ-3GHZ SOT343-4
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA420E6433 Bulk 1,154
    • 1 -
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    • 10000 $0.26
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    Rochester Electronics LLC BGA420H6327

    IC RF AMP GPS SOT343-4
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    DigiKey BGA420H6327 Bulk
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    Rochester Electronics LLC BGA420H6433XTMA1

    IC RF AMP GPS 0HZ-3GHZ SOT343-3D
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    DigiKey BGA420H6433XTMA1 Bulk 720
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    • 1000 $0.42
    • 10000 $0.42
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    Infineon Technologies AG BGA420H6433XTMA1

    IC RF AMP GPS 0HZ-3GHZ SOT343-3D
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA420H6433XTMA1 Reel 10,000
    • 1 -
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    • 100 -
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    • 10000 $0.34564
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    Verical BGA420H6433XTMA1 119,220 832
    • 1 -
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    • 100 -
    • 1000 $0.4259
    • 10000 $0.4259
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    Rochester Electronics BGA420H6433XTMA1 119,220 1
    • 1 $0.4008
    • 10 $0.4008
    • 100 $0.3768
    • 1000 $0.3407
    • 10000 $0.3407
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    Find more BGA 420 price and stock on Findchips.com

    BGA 420 Datasheets (16)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA 420 Infineon Technologies Si-MMIC-Amplifier in SIEGET 25-Technologie Original PDF
    BGA420 Infineon Technologies CATV/ Broadband Amplifiers; Package: PG-SOT343-4; Frequency (f): DC-3 GHz; Gain (typ): 13.0 dB; F (typ): 2.2 dB; P-1dB (in): -1; I (typ): 6.7 mA; Original PDF
    BGA420 Infineon Technologies in SIEGET 25-Technologie Si-MMIC-Amplifier Original PDF
    BGA420 Infineon Technologies 20dB LNA, 0...3GHz, 50 ?, SOT343 Original PDF
    BGA420 Siemens RF-Transistors, MMICs, RF-Diodes, AF-Diodes, AF-Schottky Diodes and RF-Schottky Diodes Guide Original PDF
    BGA420 Siemens Si-MMIC-Amplifierin SIEGET 25-Technologie (Cascadable 50 ?-gain block Unconditionally stable) Original PDF
    BGA420 Siemens Silicon MMIC Amplifier Original PDF
    BGA420E6327 Infineon Technologies RF Amplifiers, RF/IF and RFID, AMP SI-MMIC 6V 15MA SOT-343 Original PDF
    BGA420E6327 Infineon Technologies RF Amplifier, LNA, 1.8GHz Operating Frequancy, Tape And Reel Original PDF
    BGA420E6327BTSA1 Infineon Technologies RF/IF and RFID - RF Amplifiers - IC RF AMP GP 0HZ-3GHZ SOT343-4 Original PDF
    BGA420E6359 Infineon Technologies IC RF AMP CHIP SINGLE CASCADABLE 1800MHZ 6V 4SOT343 T/R Original PDF
    BGA420E6433 Infineon Technologies IC RF AMP CHIP SINGLE CASCADABLE 1800MHZ 6V 4SOT343 T/R Original PDF
    BGA420H6327 Infineon Technologies RF Amplifiers, RF/IF and RFID, IC AMP SI-MMIC 6V 15MA SOT343 Original PDF
    BGA420H6327XTSA1 Infineon Technologies RF/IF and RFID - RF Amplifiers - IC RF AMP GP 0HZ-3GHZ SOT343-4 Original PDF
    BGA420H6433 Infineon Technologies RF Amplifiers, RF/IF and RFID, IC AMP SI-MMIC 6V 15MA SOT343 Original PDF
    BGA420H6433XTMA1 Infineon Technologies RF/IF and RFID - RF Amplifiers - IC RF AMP GP 0HZ-3GHZ SOT343-4 Original PDF

    BGA 420 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)


    Original     		PDF BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)


    Original     		PDF BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P

    BGA-420P-M03

    Abstract: BGA-420P
    Text: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)


    Original     		PDF BGA-420P-M03 420-pin BGA-420P-M03) BGA420003SC-2-1 BGA-420P-M03 BGA-420P

    BGA-420P

    Abstract: BGA-420P-M01
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ


    Original     		PDF BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 BGA-420P BGA-420P-M01

    BGA-420P

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ


    Original     		PDF BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 BGA-420P

    BGA-420P

    Abstract: No abstract text available
    Text: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ


    Original     		PDF BGA-420P-M03 420-pin BGA-420P-M03) BGA420003SC-2-1 BGA-420P

    C1995

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE 420 PIN PLASTIC BGA-420P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Plastic mold 420-pin plastic BGA BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ Note: The actual shape of corners may differ from the dimension.


    Original     		PDF BGA-420P-M01 50mil 420-pin BGA-420P-M01) BGA420001SC-2-1 C1995 BGA-420P

    C1995

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE 420 PIN PLASTIC BGA-420P-M02 Lead pitch 50mil Pin matrix 26 Sealing method Plastic mold 420-pin plastic BGA BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ Note: The actual shape of corners may differ from the dimension.


    Original     		PDF BGA-420P-M02 50mil 420-pin BGA-420P-M02) BGA420002SC-2-1 C1995 BGA-420P

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07

    FDZ27296

    Abstract: FDZ7296
    Text: FDZ7296 30V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced PowerTrench process with state-of-the-art BGA packaging, the FDZ7296 minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		PDF FDZ7296 FDZ27296 FDZ7296

    Untitled

    Abstract: No abstract text available
    Text: FDZ7296 tm 30V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced PowerTrench process with state-of-the-art BGA packaging, the FDZ7296 minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		PDF FDZ7296 FDZ7296

    FDZ7296

    Abstract: bga Junction-to-Case
    Text: FDZ7296 tm 30V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced PowerTrench process with state-of-the-art BGA packaging, the FDZ7296 minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		PDF FDZ7296 FDZ7296 bga Junction-to-Case

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ [email protected] 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


    Original     		PDF EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PDF PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    tray bga

    Abstract: BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray
    Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 NEC 38.00 76.0 BGA 35×35ESP 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 35.35 35.00 (5.57) (6.35) 7.62 SECTION A-A' Applied Package 313-pin Plastic BGA (35×35) 352-pin Plastic BGA (35×35)


    Original     		PDF 35ESP 313-pin 352-pin 388-pin 396-pin 420-pin 456-pin 480-pin 484-pin 544-pin tray bga BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray

    C10943X

    Abstract: No abstract text available
    Text: Mounting pad of tape BGA The drawings of tape BGA mounting pads are shown in Figure 1-15, followed by Table 1-9, which provides detailed information of these pads. Figure 1-15. Mounting Pad Dimensions of Tape BGA 352 pins 35 x 35 1.27 x 25 = 31.75 1.27 x 19 = 24.13


    Original     		PDF S256N7-B6 P352N2-F6 S352N7-F6 P420N2-F6 S420N7-F6 S500N7-H6 S576N7-H6 S696N7-H9 C10943X) C10943X

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    XC95216-20PQG160I

    Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
    Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but


    Original     		PDF XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500

    Altera Flip Chip BGA warpage

    Abstract: thick bga die size crack flip chip ajinomoto Flip Chip Substrate DSASW0010612 ansys BGA cte underfill with or without underfill
    Text: Accurate Predictions of Flip Chip BGA Warpage Yuan Li Altera Corporation 101 Innovation Dr, M/S 4202 San Jose, CA 95134 [email protected], 408 544-7508 Abstract Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and


    Original     		PDF

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


    Original     		PDF 1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576

    schematic usb to lan cable adapter

    Abstract: SHARP I A05 8930E-100-178MS-F BGA-420 BGA-420P
    Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71070-1E DSU-FR EMULATOR BGA-420P ADAPTER TYPE2 MB2198-140 OPERATION MANUAL PREFACE Thank you for purchasing the DSU-FR emulator BGA-420P adapter type 2 model number: MB2198-140 . The MB2198-140 is a development support tool for developing and evaluating application products


    Original     		PDF SS01-71070-1E BGA-420P MB2198-140 MB2198-140) MB2198-140 PB6/AN22 PB3/AN19 PB1/AN17 schematic usb to lan cable adapter SHARP I A05 8930E-100-178MS-F BGA-420