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    BGA 23X23 Search Results

    BGA 23X23 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 23X23 Price and Stock

    Fischer Elektronik GmbH & Co KG ICK BGA 23X23

    Heat Sink, 22.5°C/W, Alum, Bga/Plcc; Thermal Resistance:22.5°C/W; Packages Cooled:Bga, Plcc; External Width - Metric:23Mm; External Height - Metric:6.1Mm; External Length - Metric:23Mm; External Diameter - Metric:-; Product Range:- Rohs Compliant: Yes |Fischer Elektronik ICK BGA 23X23
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark ICK BGA 23X23 Bulk 624 1
    • 1 $1.24
    • 10 $1.18
    • 100 $0.988
    • 1000 $0.988
    • 10000 $0.988
    		Buy Now
    TME ICK BGA 23X23 199 1
    • 1 $1.25
    • 10 $1.12
    • 100 $0.88
    • 1000 $0.88
    • 10000 $0.88
    		Buy Now

    Fischer Elektronik GmbH & Co KG ICK BGA 23X23X10

    Heat Sink, Bga, 21 C/W, 10 Mm, 23 Mm, 23 Mm Rohs Compliant: Yes |Fischer Elektronik ICK BGA 23X23X10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark ICK BGA 23X23X10 Bulk 598 1
    • 1 $2.07
    • 10 $2.04
    • 100 $1.8
    • 1000 $1.64
    • 10000 $1.64
    		Buy Now

    Fischer Connectors ICKBGA23X23

    Heatsink, BGA,22.5 to 6.5K/W,23x23x6mm, Conductive Adhesive, Conductive Foil Mount | Fischer ICKBGA23X23
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS ICKBGA23X23 Bulk 1
    • 1 $1.2
    • 10 $1.14
    • 100 $0.96
    • 1000 $0.96
    • 10000 $0.96
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    Fischer Elektronik GmbH & Co KG ICK BGA 23 X 23 X 10

    Heatsink: extruded; black; L: 23mm; W: 23mm; H: 10mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 23 X 23 X 10 1
    • 1 $1.33
    • 10 $1.2
    • 100 $0.92
    • 1000 $0.92
    • 10000 $0.92
    		Get Quote
    Avnet Abacus ICK BGA 23 X 23 X 10 13 Weeks 50
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
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    Fischer Elektronik GmbH & Co KG ICK BGA 23 X 23

    Heat Sink Passive BGA Pin Array Adhesive Mount 22.5K/W to 6.5K/W Aluminum (Alt: 10037026)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Abacus ICK BGA 23 X 23 13 Weeks 50
    • 1 -
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    BGA 23X23 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ [email protected] 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    BG329

    Abstract: BGA 27X27 pitch
    Text: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines


    Original     		PDF CS128 CS180 BG272 BG313 BG329 FG144 FG256 FG484 FG676 FG896 BGA 27X27 pitch

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PDF PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877

    bga solder ball shear

    Abstract: JESD22-B111 JESD22B111 23X23 JESD97 bga thermal cycling reliability
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/05/1015 SUBSTRATE METALLISATION AND LEAD FREE SOLDER BALLS CHANGE FOR BGA PACKAGES WITH SIZE EQUAL OR BELOW 23X23 Table 1. Change Identification Product Family / Commercial Product All BGA Packages with size equal or below 23x23


    Original     		PDF CRP/05/1015 23X23 bga solder ball shear JESD22-B111 JESD22B111 23X23 JESD97 bga thermal cycling reliability

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original     		PDF BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    SG-BGA-6045

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm micro16/09, 863mm 025mm 725mm SG-BGA-6045 125mm.

    NP276-11904-3

    Abstract: 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327
    Text: NP276 Series Open Top Ball Grid Array (BGA) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 100V DC 100V AC for 1 minute 30m Ω max. at 10mA/20mV max.


    Original     		PDF NP276 10mA/20mV NP276-11904-x Positioni45 NP276-11904-3 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327

    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


    Original     		PDF 00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432

    SG-BGA-6055

    Abstract: BGA 23X23 0.8
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection 30.50mm Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		PDF 600mm 000mm 100mm 025mm SG-BGA-6055 125mm BGA 23X23 0.8

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    NET2272REV1A-LF

    Abstract: pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s
    Text: Issue No. 29 PEX 8114 Key Features Application: ♦ Transparent and NonTransparent Modes ♦ Forward and Reverse Modes ♦ Low Power Consumption 2W ♦ Small Footprint 17 x 17 mm BGA Package ♦ Lead Free Available ♦ Supports PCI and PCI-X 33MHz thru 133MHz


    Original     		PDF 33MHz 133MHz 9056-BA66BI 9054-AC NET2272REV1A-LF; NET2272REV1A-LF pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s

    AC-27621

    Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
    Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C


    Original     		PDF NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842

    EA-190-H125-T710

    Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
    Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow


    Original     		PDF UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710

    xxxxx

    Abstract: 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR
    Text: PGA／BGA／PLCC 插座 PGA／BGA／PLCC插座 快速选择表 PGA／BGA／PLCC插座 网址：WWW.PRECIDIP.COM 电话：＋41 32 421 04 00 电子信箱：[email protected] 间隔 PGA 2.54 mm 填隙式 插座 焊尾 BGA 1.27 mm 1.27 mm PLCC 1 mm 参见页码


    Original     		PDF 100VRMS150VDC Preci-DipULE174442 3NMIL-DTL-83734, EIA481 500VAC10 540PLCC PPS-GF30-FR UL94V-O 600VRMS 540PCB xxxxx 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR

    23X23

    Abstract: BGA 23X23 BGA 23X23 1 BGA zif socket 22X22 DT-BGA505A-P-Z-01
    Text: 2.618" 2.600" BGA A1 PGA 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G 2 4 6 8 10 12 14 16 18 20 22 1 3 5 7 9 11 13 15 17 19 21 23 A B C D E F G H J K L M N P R T U V W Y AA AB AC 2.606" H J K L M 2.600" N P R T U V W Y AA AB 0.100"Typ.


    Original     		PDF FR4/G10 finish10µ 23X23 22X22 DT-BGA505A-P-Z-01 BGA 23X23 BGA 23X23 1 BGA zif socket

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 15X15

    Untitled

    Abstract: No abstract text available
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]


    OCR Scan     		PDF 16X16 17X17

    16X16

    Abstract: bga 576 socket bga 24x24 576
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00


    OCR Scan     		PDF 16X16 C-1640240 bga 576 socket bga 24x24 576