Zurich E2
Abstract: b50c laser diode bar Bookham bookham LASER
Text: Data sheet 50W 806nm High Power Bare Laser Diode Bar B50C-806-01 Features • Bare 10mm x 1.2mm laser bar • 50W operating power • Highly reliable single quantum well MBE structure • Excellent solderability The Bookham Technology B50C-806-01 bare laser bar
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806nm
B50C-806-01
B50C-806-01
Zurich E2
b50c
laser diode bar
Bookham
bookham LASER
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B60C-806-01
Abstract: bookham diode 60W
Text: Data sheet 60W 806nm High Power Bare Laser Diode Bar Features • Bare 10mm x 1.2mm laser diode bar • 60W operating power B60C-806-01 • Highly reliable single quantum well MBE structure The Bookham Technology B60C-806-01 bare laser diode bar series has been designed to provide the
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806nm
B60C-806-01
B60C-806-01
21CFR
bookham diode 60W
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Untitled
Abstract: No abstract text available
Text: 120W 9xx nm High Power Bare Laser Diode Bar Features • Bare 10mm x 2.4mm laser diode bar • 120W operating power B120C-9xx-01 • Highly reliable single quantum well MBE structure The Bookham B120C-9xx-01 bare laser diode bar series has been designed to provide the increased brightness
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B120C-9xx-01
B120C-9xx-01
915nm,
940nm,
980nm
21CFR
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B80C
Abstract: bare diode bookham diode
Text: Data sheet 80W 9xx nm High Power Bare Laser Diode Bar Features • Bare 10mm x 1.2mm laser diode bar • 80W operating power B80C-9xx-01 • Highly reliable single quantum well MBE structure The Bookham Technology B80C-9xx-01 bare laser diode bar series has been designed to provide the
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B80C-9xx-01
B80C-9xx-01
915nm,
940nmllustrative
21CFR
B80C
bare diode
bookham diode
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Selector Guide
Abstract: do-218ab DO218AB
Text: V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Products in Several Versions to Accommodate a Wide Variety of Assembly Techniques and Applications TABLE OF CONTENTS
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VMN-SG2163-1312
Selector Guide
do-218ab
DO218AB
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laser diode bar
Abstract: bookham diode
Text: Data sheet 40W 806nm 30% Fill Factor High Power Bare Laser Diode Bar Features • Bare 10mm x 1.2mm laser diode bar • 30% Fill Factor 150µm emitter / 500µm pitch • 40W operating power B40C-806-01 • Highly reliable single quantum well MBE structure
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806nm
B40C-806-01
B40C-806-01
B40C806-01
21CFR
laser diode bar
bookham diode
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 256M bits SDRAM Bare Chip ECS2532AACN-A 8M words x 32 bits Features • Density: 256M bits • Organization ⎯ 2M words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS2532AACN-A
133MHz
cycles/64ms
M01E0107
E0416E50
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 256M bits SDRAM Bare Chip ECS2532JECN-A 8M words x 32 bits Features • Density: 256M bits • Organization 2M words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 2.5V ± 0.2V • Clock frequency: 133MHz (max.)
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ECS2532JECN-A
133MHz
cycles/64ms
M01E0107
E0698E50
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 256M bits SDRAM Bare Chip ECS2532EECN-A 8M words x 32 bits Features • Density: 256M bits • Organization 2M words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 1.8V ± 0.1V • Clock frequency: 111MHz (max.)
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ECS2532EECN-A
111MHz
cycles/64ms
M01E0107
E0697E50
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 256M bits SDRAM Bare Chip ECS2532CACN-A 8M words x 32 bits Features • Density: 256M bits • Organization ⎯ 2M words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 2.5V ± 0.2V • Clock frequency: 133MHz (max.)
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ECS2532CACN-A
133MHz
cycles/64ms
M01E0107
E0551E30
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 128M bits SDRAM Bare Chip ECS1216AACN-A 8M words x 16 bits Features • Density: 128M bits • Organization 2M words × 16 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS1216AACN-A
133MHz
cycles/64ms
M01E0107
E0572E20
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 128M bits SDRAM Bare Chip ECS1216AACN-A 8M words x 16 bits Specifications Features • Density: 128M bits • Organization 2M words × 16 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS1216AACN-A
133MHz
cycles/64ms
M01E0107
E0572E20
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E0743E20
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 64M bits SDRAM Bare Chip ECS6432AFCN-A 2M words x 32 bits Features • Density: 64M bits • Organization 512K words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS6432AFCN-A
133MHz
cycles/64ms
M01E0107
E0743E20
E0743E20
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 128M bits SDRAM Bare Chip ECS1232JCCN-A 4M words x 32 bits Features • Density: 128M bits • Organization 1M words × 32 bits × 4 banks Package: Bare chip • Power supply: VDD, VDDQ = 2.5V ± 0.2V • Clock frequency: 133MHz (max.)
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ECS1232JCCN-A
133MHz
cycles/64ms
M01E0107
E0779E20
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 256M bits SDRAM Bare Chip ECS2532CACN-A 8M words x 32 bits Specifications Features • Density: 256M bits • Organization ⎯ 2M words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 2.5V ± 0.2V • Clock frequency: 133MHz (max.)
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ECS2532CACN-A
133MHz
cycles/64ms
M01E0107
E0551E30
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AX12
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 256M bits SDRAM Bare Chip ECS2516ADCN-A 16M words x 16 bits Features • Density: 256M bits • Organization 4M words × 16 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS2516ADCN-A
133MHz
cycles/64ms
M01E0107
E0661E20
AX12
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 64M bits SDRAM Bare Chip ECS6416AHCN-A 4M words x 16 bits Features • Density: 64M bits • Organization 1M words × 16 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS6416AHCN-A
133MHz
cycles/64ms
M01E0107
E0742E20
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 128M bits SDRAM Bare Chip ECS1232ECCN-A 4M words x 32 bits Features • Density: 128M bits • Organization 1M words × 32 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 1.8V ± 0.1V • Clock frequency: 111MHz (max.)
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ECS1232ECCN-A
111MHz
cycles/64ms
M01E0107
E0780E20
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AX12
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 256M bits SDRAM Bare Chip ECS2516AFCN-A 16M words x 16 bits Features • Density: 256M bits • Organization 4M words × 16 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS2516AFCN-A
133MHz
cycles/64ms
M01E0107
E0986E20
AX12
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AX12
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 256M bits SDRAM Bare Chip ECS2516ADCN-A 16M words x 16 bits Specifications Features • Density: 256M bits • Organization 4M words × 16 bits × 4 banks • Package: Bare chip • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 133MHz (max.)
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ECS2516ADCN-A
133MHz
cycles/64ms
M01E0107
E0661E20
AX12
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 128M bits SDRAM Bare Chip ECS1232ABCN-A 4M words x 32 bits Features The ECS1232ABCN is a 128M bits SDRAM organized as 1,048,576 words × 32 bits × 4 banks. All inputs and outputs are synchronized with the positive edge of the clock. This product is Bare Chip.
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ECS1232ABCN-A
ECS1232ABCN
133MHz
M01E0107
E0486E30
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AN-1061
Abstract: Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter
Text: Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes By Richard Clark Table of Contents Page Introduction .1 Storage and Handling .2
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AN-1061
AN-1061
Ultrasonic welding circuit
centrifuge machine for acceleration
epoxy adhesive paste cte table
soft solder die bonding
ultrasonic flow meter
ultrasonic transducer circuit
ultrasonic generator
ultrasonic bond
Ultrasonic Transducer for gas meter
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U-CP-80C0055-preliminary
Abstract: 808nm 300mw laser diode laser diode 300mw TO-CAN 808nm 300mW TO18 Laser 808nm 300 mw 808nm laser diode laser diode bare chip
Text: U-CP-80C0055-preliminary UNION OPTRONICS CORP. 808nm Laser Diode Chips 808nm IR Laser Diode Chips U-CP-80C0055-preliminary •Specifications 1 Size : (2) Device: (3) Structure 300*400*100 m Laser diode bare chip Single ridge waveguide ■External dimensions(Unit : μm)
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U-CP-80C0055-preliminary
808nm
886-3-g
U-CP-80C0055-preliminary
808nm 300mw laser diode
laser diode 300mw
TO-CAN
808nm 300mW
TO18 Laser 808nm 300 mw
808nm laser diode
laser diode bare chip
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10g DFB
Abstract: dfb 10g dfb laser 1300 nm bare die DFB 1300 rise time laser diode bare chip DFB laser bare die
Text: PRELIMINARY DATASHEET | MAY 21, 2004 Uncooled 4 Gb/s CWDM DFB Bare Die The 4 Gb/s CWDM DFB laser diode chip is designed to facilitate extended temperature operation. Target applications include LX4 transceivers, SONET OC-48, and SDH STM-16. Performance Highlights
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OC-48,
STM-16.
OC-48
STM-16
10g DFB
dfb 10g
dfb laser 1300 nm
bare die
DFB 1300 rise time
laser diode bare chip
DFB laser bare die
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