Untitled
Abstract: No abstract text available
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72PBG
32Mx72
AS4DDR232M72PBG
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ACT-D16M96S
Abstract: BSA1 BS-B1
Text: Standard Products ACT-D16M96S High Speed 16MegaBit x 96 3.3V Synchronous DRAM Multichip Module May 29, 2007 FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ Six 6 low power 4M x 16 x 4 banks Synchronous Dynamic Random Access Memory chips in one MCM
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ACT-D16M96S
16MegaBit
50-MHz
192-cycle
SCD3370
BSA1
BS-B1
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Untitled
Abstract: No abstract text available
Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp
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AS4DDR232M64PBG
32Mx64
AS4DDR232M64PBG
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AS4DDR264M72PBG
Abstract: AS4DDR232M72APBG
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72APBG
32Mx72
AS4DDR264M72PBG
AS4DDR232M72APBG
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M39P0R1080E4
Abstract: M39P0R9080E4 M58PR001LE M58PR512LE M39P0R09080E4 BCAS SD
Text: M39P0R9080E4 M39P0R1080E4 512 Mb or 1 Gb x16, multiple bank, multilevel, burst Flash memory 256 Mbit low power SDRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 512 Mbit (32 Mb x16) or 1 Gbit (64 Mb ×16) multiple bank, multilevel, burst)
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M39P0R9080E4
M39P0R1080E4
TFBGA165
64-bit
M39P0R1080E4
M39P0R9080E4
M58PR001LE
M58PR512LE
M39P0R09080E4
BCAS SD
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AS4DDR232M64PBG
Abstract: No abstract text available
Text: iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M64PBG
32Mx64
AS4DDR232M64PBG
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AS4DDR232M64PBG
Abstract: No abstract text available
Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp
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AS4DDR232M64PBG
32Mx64
AS4DDR232M64PBG
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AS4DDR232M72PBG
Abstract: AS4DDR264M72PBG
Text: i PEM 2.4 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp
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Original
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AS4DDR232M72PBG
32Mx72
AS4DDR232M72PBG
AS4DDR264M72PBG
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AS4DDR232M64PBG
Abstract: No abstract text available
Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp
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Original
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AS4DDR232M64PBG
32Mx64
AS4DDR232M64PBG
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AS4DDR232M72APBG
Abstract: No abstract text available
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72APBG
32Mx72
AS4DDR232M72APBG
2010Preliminary
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AS4DDR232M64PBG
Abstract: No abstract text available
Text: iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M64PBG
32Mx64
AS4DDR232M64PBG
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Untitled
Abstract: No abstract text available
Text: Standard Products ACT-D16M96S High Speed 16MegaBit x 96 3.3V Synchronous DRAM Multichip Module www.aeroflex.com/Avionics September 9, 2009 FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ Six 6 low power 4M x 16 x 4 banks Synchronous Dynamic Random Access Memory chips in one MCM
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ACT-D16M96S
16MegaBit
50-MHz
SCD3370
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Untitled
Abstract: No abstract text available
Text: i PEM 2.4 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES DDR2 Data rate = 667, 533, 400 Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72PBG
32Mx72
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SDRAM aeroflex micron die
Abstract: CKE 2009 4164 dram 524,288-word x 16-bit MT48LC16M16A2 Y16Y BA1182 DQ86 BA872
Text: Standard Products ACT-D16M96S High Speed 16MegaBit x 96 3.3V Synchronous DRAM Multichip Module www.aeroflex.com/Avionics September 9, 2009 FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ Six 6 low power 4M x 16 x 4 banks Synchronous Dynamic Random Access Memory chips in one MCM
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ACT-D16M96S
16MegaBit
50-MHz
192-cycle
SCD3370
SDRAM aeroflex micron die
CKE 2009
4164 dram
524,288-word x 16-bit
MT48LC16M16A2
Y16Y
BA1182
DQ86
BA872
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72PBG
32Mx72
AS4DDR232M72PBG
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HM62256LP
Abstract: DS5000FP 8051 opcode Cu-56 OPCODE SHEET FOR 8051 MICROCONTROLLER DS2250 DS5000
Text: b4E 2L14130 0007472 74fl D DALLAS SEMI CONDUCT OR D AL CORP DALLAS SEMICONDUCTOR DS5000FP Soft M icrocontroller Chip FEATURES PIN ASSIGNMENT • 8051 compatible uC adapts to its task - § Accesses between SK and 64K of nonvolatile SRAM In-system programming via on-chip serial port
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2L14130
00D7472
ds5000fp
DS5000FP
HM62256LP
8051 opcode
Cu-56
OPCODE SHEET FOR 8051 MICROCONTROLLER
DS2250
DS5000
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DPS41129-1201
Abstract: 2712B 27128 eprom ci 2764 DPS41129 DPS40128-100C
Text: DENSE-PAC MICROSYSTEMS 07E D | 275^415 □□□0120 M | - 8KX8 BASED Dense-Pac m . / r Microsystems, Inc. CM O S SRAM FAMILY DESCRIPTION: The Dense-Pac 8 K X 8 Based Family of Static Random A ccess M em ories SRAM , com plete w ith memory •interface logic and on-board capacitors are available in
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DPS1124
DPS40128
DPS41129
DPS40192
DPS41193
DPS40256
DPS41257
128KX
DPS91288
DPS41129-1201
2712B
27128 eprom
ci 2764
DPS40128-100C
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Untitled
Abstract: No abstract text available
Text: DPS1124 64K X 16 C M O S SRAM MODULE NOT RECOMENDED FOR NEW DESIGNS DESCRIPTION: The DPS1124 is a buffered and decoded 64K X 16 C M O S SRAM module built with sixteen 8K X 8 SRAMs. The address and data l/Os are buffered with high-speed C M O S logic devices. All pins are TTL compatible and
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DPS1124
DPS1124
PS1124
200ns
TTL-compatibleI/07
TA0-TA12
A13-A15
I/00B
TA0-TA12,
BA0-BA12,
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Untitled
Abstract: No abstract text available
Text: Vfc.// 8KX8T BASED Dense-Pac Microsystems>Inc. CM OS EEPROM FAMILY DESCRIPTION: The DPE8KX8T family consists o f Electrically Eraseable and Reprogrammable Read-Only Memories EEPROMs with popular, easy to use features. DPE1124T These memories are accessed like static RAM for the
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DPE1124T
DPE8M628T-55M
DPE8M628T-70M
DPE8M628T-90M
DPE8M656T-55C
DPE8M656T-70C
DPE8M656T-90C
DPE8M656T-55I
DPE8M656T-70I
DPE8M656T-90I
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Untitled
Abstract: No abstract text available
Text: DS5000FP DALLAS SEMICONDUCTOR DS5000FP Soft Microcontroller Chip FEATURES PIN ASSIGNMENT • 8051 compatible uC adapts to its task - 8 < Accesses between 8K and 64K of nonvolatile SRAM In-system programming via on-chip serial port Can modifying its own program or data memory
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DS5000FP
80crystal
DS5000FP
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICRO SYSTEMS D7E D | 575^415 □□□□17b T 8KX8T BASED Dense-Pac Microsystems, inc. CMOS EEPROM FAMILY DESCRIPTION: The DPE8KX8T family consists of Electrically Eraseable and Reprogrammable Read-Only Memories EEPROMs with popular, easy to use features.
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57ST415
detect55C
DPE8M628T-70C
DPE8M628T-90C
DPE8M628T-55I
DPE8M628T-70I
DPE8M628T-90I
DPE8M628T-55M
DPE8M628T-70M
DPE8M628T-90M
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Untitled
Abstract: No abstract text available
Text: DS5000FP DALLAS D S5000FP Soft Microprocessor Chip SEMICONDUCTOR PIN ASSIGNMENT FEATURES • 8051 compatible microprocessor adapts to its task - —“Iicy h- qj <olUmr~ UJ C QLm <O Ui|< 0-1 Qolo CO OO0 4. C O 2 0CL.lo Q-lolu J0 ZC Q< c .D Q O Accesses between 8K and 64K bytes of nonvol
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DS5000FP
S5000FP
DS5000FP
F62501)
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS D7E D | 575^415 □□□□17b ‘i f~ 8KX8T BASED Dense-Pac Microsystems, Inc. CMOS EEPROM FAMILY 7 D ESCRIPTIO N : The DPE8KX8T family consists of Electrically Eraseable and Reprogrammable Read-Only Memories EEPROMs with popular, easy to use features.
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d8T-90C
DPE8M628T-55I
DPE8M628T-70I
DPE8M628T-90I
DPE8M628T-55M
DPE8M628T-70M
DPE8M628T-90M
DPE8M656T-55C
DPE8M656T-70C
DPE8M656T-90C
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Untitled
Abstract: No abstract text available
Text: b4E 2L14130 0007472 74fl D DALLAS SEMI CONDUCT OR D AL CORP DALLAS SEMICONDUCTOR DS5000FP Soft M icrocontroller Chip FEATURES PIN ASSIGNMENT • 8051 compatible uC adapts to its task - Accesses between SK and 64K of nonvolatile SRAM - In-system programming via on-chip serial port
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OCR Scan
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2L14130
DS5000FP
fi/A14
5/A13
DS5000FP
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