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    Taiyo AUS-308

    Abstract: aus308 soldermask AUS308 TAIYO TAIYO soldermask CCL-HL832NX-A AUS308 SR CCL-HL832NB AUS-308 AUS308 SPIL BGA
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 27-Aug-2010 MEANS OF DISTINGUISHING CHANGED DEVICES:


    Original     		PDF A1008-04 27-Aug-2010 82P20516DBFG, 82P20516DBFG8 82P2916BFG, 82P2916BFG8 27-Nov-2010 JESD22-B100 JESD22-B101 J-STD-020C Taiyo AUS-308 aus308 soldermask AUS308 TAIYO TAIYO soldermask CCL-HL832NX-A AUS308 SR CCL-HL832NB AUS-308 AUS308 SPIL BGA

    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original     		PDF HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG