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    SA57-IHZ

    Abstract: No abstract text available
    Text: AN51 APEX – AN51 AN51 Thermal Modeling of Power Devices Product Innovation From in a Surface Mount Configuration Thermal Modeling of Power Devices in a Surface Mount Configuration Introduction This Application Note demonstrates how to develop a thermal model for power ICs. It then explains how the modeling of power ICs can be used to calculate the maximum power delivery possible during normal operation.


    Original     		PDF AN51U SA57-IHZ