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    AN10343

    Abstract: No abstract text available
    Text: AN10343 MicroPak soldering information Rev. 01 — 19 April 2005 Application note Document information Info Content Keywords MicroPak, footprint, Fairchild, BGA Abstract The recommended solder land pattern for mounting the MicroPak package AN10343 Philips Semiconductors


    Original     		PDF AN10343 AN10343

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		PDF AN10343 Solder Paste, Indium 5.8 SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U