C2121M cts
Abstract: bdn10-3cba01 BDN21-3CB
Text: CTS Series BND Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel
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bga 7x7
Abstract: BDN21-3CB C2121M cts T412 0.3mm qfp
Text: CTS Series BDN Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel
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9707K
Abstract: No abstract text available
Text: Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9707 is a pressure sensitive adhesive (PSA) transfer tape with isotropic electrical conductivity. The PSA matrix is filled with conductive fillers that allow interconnection
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9707K
225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data May 2011 3M Electrically Conductive Adhesive Transfer Tape 9704 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9704 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection
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ACF msds
Abstract: NASA SP-R-0022 CONDUCTIVE INK FLEX CIRCUITS D33-30 dupont kapton rohs CONDUCTIVE INK FOR FLEX CIRCUITS glass filled polyester physical properties ASTM-D3330 ideas
Text: Technical Data April 2011 3M Electrically Conductive Adhesive Transfer Tape 9703 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape 9703 is a pressure sensitive adhesive PSA transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection between
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225-3S-06
ACF msds
NASA SP-R-0022
CONDUCTIVE INK FLEX CIRCUITS
D33-30
dupont kapton rohs
CONDUCTIVE INK FOR FLEX CIRCUITS
glass filled polyester physical properties
ASTM-D3330
ideas
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Untitled
Abstract: No abstract text available
Text: Technical Data June 2011 3M Electrically Conductive Adhesive Transfer Tape 9706 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9706 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection
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225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data June 2011 3M Electrically Conductive Adhesive Transfer Tape 9705 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection
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225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data October, 2009 3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709S / 9709 SL Product Description 3M™ Electrically Conductive Adhesive Transfer Tape 9709S is a pressure sensitive adhesive PSA transfer tape with isotropic electrical conductivity. The PSA matrix is filled with conductive fillers which allow interconnection between
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9709S
225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data May 2011 3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709 Product Description 3M™ XYZ/Isotropic Electrically Conductive Adhesive Transfer Tape 9709 is a pressure sensitive adhesive PSA transfer tape with Isotropic electrical conductivity. The PSA matrix is filled with conductive fillers which allow
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225-3S-06
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Ablecube
Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ATM-0089 ablebond ablestik ablestik ablebond
Text: PILOT TECHNICAL DATASHEET ABLEBOND 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC
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8200C
8200C
RP-751
Ablecube
ATM-0018
Ablestik
ATM-0087
ablebond
ablebond technical
ATM-0089
ablebond ablestik
ablestik ablebond
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Ablebond
Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Text: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.
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Abstract: No abstract text available
Text: Technical Data May 2012 3M XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9723 Product Description 3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape ECATT 9723 is an isotropically conductive pressure sensitive adhesive tape. 3M ECATT 9723 conducts electricity through the thickness (Z-axis) and in the plane of the
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wafer frame
Abstract: No abstract text available
Text: Standard 4” Wafer Adhesive Tape Specification Standard Adhesive Tape Parameters Material Tape Thickness Ring Height Ring Diameter Elongation at Breaking Point Shape Light Blue Anti-Static Plastic Tape/Plastic Grip Rings 0.055mm ±0.085mm 6mm ±0.010mm 21.03cm ±0.013cm
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055mm
085mm
010mm
013cm
0kg/20mm
TN2524NJ)
HV57708XJ)
wafer frame
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General Wafer Specification
Abstract: wafer frame
Text: Standard 6” Wafer Adhesive Tape Specification Standard Adhesive Tape Parameters Material Tape Thickness Ring Height Ring Diameter Elongation at Breaking Point Shape Light Blue Anti-Static Plastic Tape/Plastic Grip Rings 0.055mm ±0.085mm 6mm ±0.010mm 21.03cm ±0.013cm
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055mm
085mm
010mm
013cm
0kg/20mm
TN2524NJ)
HV57708XJ)
General Wafer Specification
wafer frame
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LTN141W
Abstract: HAINAN2 VK-2120 MX25L8005 C327 W70 HED5 T60H928 R5538 BA75-01862A C557
Text: Mat.Number Std.Name 0201-000160 ADHESIVE-TS;D520,NTR,0201-001002 ADHESIVE-TS;8380,SIL,9000CPS,10cc 0202-001461 SOLDER-CREAM;NP303-LD155-GQ,-,D38~10UM,9 0202-001499 SOLDER-WIRE FLUX;SR34 SUPER LFM-48,-,D0. 0203-000223 PAPER-CARBON;BARCODE GEN,T0.25,W60,L300,
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9000CPS
NP303-LD155-GQ
LFM-48
SUPANUKE-20
MMBD7000LT1
200mA
BA97-02658A
BA99-00100L
BA99-07565A
LTN141W
HAINAN2
VK-2120
MX25L8005
C327 W70
HED5
T60H928
R5538
BA75-01862A
C557
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LE82PM965
Abstract: NH82801HB 216PWAVA12FG Q51-5 Q533 le82pm BA39-00621A NP303 NH82801HBM NH82801
Text: Mat.Number 0201-000160 0201-001002 0202-001461 0202-001499 0202-001520 Std.Name SOLDER-CREAM;NP303-LD155-GQ,-,D38~10UM,9 SOLDER-WIRE FLUX;SR34 SUPER LFM-48,-,D0. SOLDER-CREAM;LFM-48X TM-HP,-,D25-45um,96
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9000CPS
NP303-LD155-GQ
LFM-48
LFM-48X
D25-45um
BA97-02556G
BA97-02600A
BA97-02601A
BA97-02611A
LE82PM965
NH82801HB
216PWAVA12FG
Q51-5
Q533
le82pm
BA39-00621A
NP303
NH82801HBM
NH82801
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Dome
Abstract: adhesive matrix
Text: Ultra-low Profile Dome Array B3DA Ultra-low Profile Dome Array with DustProof Construction and Crisp Clicking Action • ■ ■ ■ Attach directly to PCB to make tactile switch. Matrix adhesive used to create highly dust-proof construction with good ventilation.
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A121-E1-2
75-344-7096/Fax:
Dome
adhesive matrix
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B3DA-0000
Abstract: A121E ib3da
Text: Ultra-low Profile Dome Array B3DA Ultra-low Profile Dome Array with DustProof Construction and Crisp Clicking Action • ■ ■ ■ Attach directly to PCB to make tactile switch. Matrix adhesive used to create highly dust-proof construction with good ventilation.
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A121-E1-2
75-344-7096/Fax:
0401-1M
B3DA-0000
A121E
ib3da
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PDL-7557-1
Abstract: PDL-76 PDL-401 PDL-288
Text: PAN-CODE Dot-Matrix Labels by Material Blank Labels by Material cont. GMC Vinyl Cloth - Indoor Applications (cont.) Part Number Electronic Labeling • Ideal for temporary marking of chips, boards or IC’s • Label is removable without leaving any adhesive residue
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PDL-19-1
PDL-19
PDL-19-10
PDL-288
PDL-291
PDL-253
PDL-253-10
PDL-264
PDL-264-10
PDL-181
PDL-7557-1
PDL-76
PDL-401
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Dome
Abstract: dome array adhesive matrix touch switch with pcb layout
Text: Ultra-low Profile Dome Array – B3DA Ultra-low Profile Dome Array with Dust-Proof Construction and Crisp Clicking Action • ROHS compliant. ■ No soldering required. ■ Attach directly to PCB to make tactile switch. ■ Matrix adhesive used to create highly dust-
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dome array
Abstract: No abstract text available
Text: Ultra-low Profile Dome Array B3DA Ultra-low Profile Dome Array With Dust-Proof Construction and Crisp Clicking Action • No soldering required. Attach directly to PCB to make an ultra-low profile tactile switch. • Matrix adhesive used to create highly dust-proof construction
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B3DA-0010-A
B3DA-0000-A
X303-E-1
dome array
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Dome
Abstract: B3DA-0000-A MODEL 157 B3DA-0010-A
Text: Ultra-low Profile Dome Array B3DA Ultra-low Profile Dome Array With Dust-Proof Construction and Crisp Clicking Action • No soldering required. Attach directly to PCB to make an ultra-low profile tactile switch. • Matrix adhesive used to create highly dust-proof construction
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B3DA-0010-A
B3DA-0000-A
X303-E-1
Dome
B3DA-0000-A
MODEL 157
B3DA-0010-A
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3x4 keypad 9 pin
Abstract: 3x4 keypad 8 pin 3x4 matrix keypad keypad 3x4 8 pin
Text: Standard Keypads SERIES 84B Backlit with Self Adhesive Legends DIMENSIONS Keyboards and Keypads FEATURES • Backlit for Low Light Applications • Waterproof Silicone Rubber • Audible, Tactile Contacts • Low Contact Resistance • Optional RFI/EMI Shielding
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84AC5012-X
84BN-AB1-022AN
3x4 keypad 9 pin
3x4 keypad 8 pin
3x4 matrix keypad
keypad 3x4 8 pin
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THERMISTORS nsp 037
Abstract: Thyristor TAG 9118 ICA 0726 0148 Transformer a1273 y k transistor AM97C11CN transistor SK A1104 PM7A2Q B8708 bzy79 yh 5032
Text: INDEX OF COMPONENTS A Section/Page No. A.C. Adaptor. Adaptor Kits BNC e tc . Adhesive Tapes. Adhesives, Various. Aerosols.
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200X300X360m
THERMISTORS nsp 037
Thyristor TAG 9118
ICA 0726 0148 Transformer
a1273 y k transistor
AM97C11CN
transistor SK A1104
PM7A2Q
B8708
bzy79
yh 5032
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