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    ABLEBOND 8200T Search Results

    ABLEBOND 8200T Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U77A1118200T Amphenol Communications Solutions SFP CAGE 1X1 NICKEL T&R Visit Amphenol Communications Solutions
    U10C438200T Amphenol Communications Solutions SlimSAS Right angle X4 30u\\ Gold plating, Latch pin length=1.5mm, 24G, T&R packing Visit Amphenol Communications Solutions
    U77A1618200T Amphenol Communications Solutions ExpressPort SFP+, High Speed Input Output Connectors, SFP PLUS CAGE. Visit Amphenol Communications Solutions
    LMD18200T Texas Instruments 3A, 55V H-Bridge 11-TO-220 -40 to 125 Visit Texas Instruments
    LMD18200T/LF14 Texas Instruments 3A, 55V H-Bridge 11-TO-220 Visit Texas Instruments Buy

    ABLEBOND 8200T Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    G770H

    Abstract: JESD22-B105 G770HC Sumitomo G770HC
    Text: 11/22/2005 PACKAGE RELIABILITY REPORT FOR NSEB, 2 SFN, 6x6x0.88um, Pb-Free Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


    Original     		PDF JESD22-B105, G770H JESD22-B105 G770HC Sumitomo G770HC

    JESD22-A118

    Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A1004-01 2-Apr-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT JESD22-A118 SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly

    JESD22-C101

    Abstract: JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115
    Text: 2/27/2008 RELIABILITY REPORT FOR DS1099, Rev A3 8" Maxim Integrated Products 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Maxim Integrated Products 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email: [email protected]


    Original     		PDF DS1099, MIL-STD-883-2011 JESD22-C101 JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115

    SUMITOMO CRM1076

    Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A1004-01R1 4-Jun-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT SUMITOMO CRM1076 sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H

    pd223

    Abstract: pd 223 PI3EQX6801 PI2EQX6811ZDEX PI3EQX6801ZDE PI3EQX5701 PI3EQX4951ST ABLEBOND 8200T PI3EQX6701AZDE PI3EQX6741STZDE
    Text: New Product Databrief PI3EQX6801 6.5Gbps, 1-port, 1.5V/3.3V SATA/SAS ReDriver with Analog/Digital Configuration Pericom Semiconductor’s PI3EQX6801 is a low power, 1.5V/3.3V, 6.5Gbps, SATA/SAS signal ReDriver™. The device provides programmable equalization, to optimize performance


    Original     		PDF PI3EQX6801 PI3EQX6801 PI2EQXDP101-AZFE PI2EQXDP101-AZFEX PI2EQXDP101ZFE PI2EQXDP101ZFEX PI3EQX3251BLZFE PI3EQX3251BLZFEX PI3EQX4951BZDE pd223 pd 223 PI2EQX6811ZDEX PI3EQX6801ZDE PI3EQX5701 PI3EQX4951ST ABLEBOND 8200T PI3EQX6701AZDE PI3EQX6741STZDE

    JESD22-B105

    Abstract: G600 mold compound unisem ablebond 8290 JESD22-A115 8200T J-STD-020 0647
    Text: 4/13/2007 RELIABILITY REPORT FOR DS1086H, Rev A2, 8" Fab, Automotive Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


    Original     		PDF DS1086H, JESD22-B105 G600 mold compound unisem ablebond 8290 JESD22-A115 8200T J-STD-020 0647

    CV-8710

    Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
    Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010


    Original     		PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy