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A5616 Price and Stock

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Signal Transformer Inc 14A-56-16 PWR XFMR LAMINATED 56VA TH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	14A-56-16	Box			20	1 - 10 - 100 $19.21 1000 $19.21 10000 $19.21	Buy Now
Master Electronics	14A-56-16					1 $33.54 10 $32.54 100 $22.32 1000 $22.32 10000 $22.32	Buy Now
Sager	14A-56-16				40	1 - 10 - 100 $20.19 1000 $16.56 10000 $16.56	Buy Now
TE Connectivity FDBA-56-16-21-PN-K FDBA 56-16-21 PN-K
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FDBA-56-16-21-PN-K	Bulk			52	1 - 10 - 100 $94.375 1000 $94.375 10000 $94.375	Buy Now
TE Connectivity FDBA-56-16-26-PN-K FDBA 56-16-26 PN-K
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FDBA-56-16-26-PN-K	Bulk			108	1 - 10 - 100 - 1000 $50.48269 10000 $50.48269	Buy Now
TE Connectivity FDBA-56-16-21-SN-K FDBA 56-16-21 SN-K
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FDBA-56-16-21-SN-K	Bulk			96	1 - 10 - 100 $95.52156 1000 $95.52156 10000 $95.52156	Buy Now
TE Connectivity FDBA-56-16-8-PN-K-090 FDBA 56-16-8 PN-K 090
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FDBA-56-16-8-PN-K-090	Bulk			87	1 - 10 - 100 $45.02299 1000 $45.02299 10000 $45.02299	Buy Now

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A5616 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
tungsten slug glass diode Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original		PDF
A5620 Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original		PDF
A5625-01 Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original		PDF
LDG-A5616RI Abstract: 1480I Text: UNCONTROLLED DOCUMENT REV, A E.C.N. PART NUMBER REV. LDG -A5616RI A NUMBER AND REVISION COMMENTS 0 3 .2 0 .0 7 E L E C T R O -O P T IC A L CHARACTERISTICS Ta = 2 5 'C PARAM ETER MIN T YP PEAK W AVELENGTH 2 .3 l r =1 OOfiA 1f = 1 OmA Vr jjc d 12ÜOO EMITTED COLOR:	OCR Scan	LDG-A5616RI LDG-A5616RI 1480I	PDF
LDG-A5616RI Abstract: No abstract text available Text: PART NUMBER UNCONTROLLED DOCUMENT REV. LDG -A5616RI PIN 10 PIN 15 4.50 [0.177] 8.00 CO.315] ELECTRO-OPTICAL CHARACTERISTICS Ta = 2 5 X PARAMETER MIN TYP PEAK WAVELENGTH 15.24 [0.600] PIN 9 TEST COND nm 1.8 REVERSE VOLTAGE 2.3 Vf 4.0 AXIAL INTENSITY PIN UNITS	OCR Scan	LDG-A5616RI 100juA LDG-A5616RI	PDF