ssop14
Abstract: SSOP14 package ssop-14 4402
Text: PACKAGE DIMENSIONS SSOP14 +0.3 5.0 -0.1 0 ~ 10º 0.5±0.2 4.4±0.2 6.4±0.3 8 14 7 1 0.65 +0.1 0.67MAX 0.1±0.1 1.15±0.1 0.15-0.05 0.1 0.22±0.1 0.1 M UNIT : mm
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SSOP14
67MAX
ssop14
SSOP14 package
ssop-14
4402
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ssop14p
Abstract: No abstract text available
Text: SSOP14-P-44-0.65-K Mirror Finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.066 TYP. 1 版/98.9.18
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SSOP14-P-44-0
ssop14p
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SSOP14 package
Abstract: SSOP14
Text: SSOP14 Adapter shrink small outline package RE931-01 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 14 - hole dia 1.00 mm - pitch 0.65 mm
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SSOP14
RE931-01
SSOP14 package
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SSOP14 package
Abstract: jedec MO-150 SSOP14 SOT337 MO-150
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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SSOP14:
OT337-1
MO-150
SSOP14 package
jedec MO-150
SSOP14
SOT337
MO-150
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SSOP14
Abstract: ssop-14
Text: パッケージ外形図 SSOP14 +0.3 5.0 -0.1 0 ~10ﾟ 0.5±0.2 4.4±0.2 6.4±0.3 8 14 7 1 0.65 +0.1 0.67MAX 0.1±0.1 1.15±0.1 0.15-0.05 0.1 0.22±0.1 0.1 M 単位 : mm
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SSOP14
67MAX
SSOP14
ssop-14
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74AHC14
Abstract: U22-C BKLVMAIN
Text: 1 2 3 4 5 6 7 8 USB CONNECTOR VCC5 BATT_LED# L9 USB_OC#0 U22C 19 VCC3 14 14 C23 1000P 0603B U22A U22B R140 5 6 1M 0603B USB_GND GND 1 2 74AHC14_V SSOP14 7 7 A BEAD 0805C + 7 C9 100U/16V CPWX6.6 R5 470K 0603B VCC3 14 VCC3 GND 3 74AHC14_V SSOP14 4 7 F2 POLYSW_MINISMDC110
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MINISMDC110
0603B
100U/16V
0805C
74AHC14
SSOP14
1000P
0603B
HNHAIUSB6009
U22-C
BKLVMAIN
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SSOP14-P-44-0
Abstract: No abstract text available
Text: SSOP14-P-44-0.65-K Mirror Finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.066 TYP. 1/Sept. 18, 1998
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SSOP14-P-44-0
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PACKAGE DIMENSIONS
Abstract: SSOP10 SSOP14 SSOP20
Text: PACKAGE DIMENSIONS 3. PACKAGE DIMENSIONS SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M UNIT :mm SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3 4.4±0.2 8 7
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SSOP10
SSOP14
67MAX
SSOP20
45MAX
SSOP20-B2
FLP10-C1
PACKAGE DIMENSIONS
SSOP10
SSOP14
SSOP20
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SSOP10
Abstract: SSOP14 SSOP20 4402
Text: パッケージ外形図 3. パッケージ外形図 SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M 単位：ｍｍ SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3
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SSOP10
SSOP14
67MAX
SSOP20
45MAX
SSOP20-B2
FLP10-C1
SSOP10
SSOP14
SSOP20
4402
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jedec MO-150
Abstract: ssop14 SSOP14 package MO-150
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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SSOP14:
OT337-1
MO-150
jedec MO-150
ssop14
SSOP14 package
MO-150
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Untitled
Abstract: No abstract text available
Text: Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.
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SSOP14:
OT337-1
MO-150
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SSOP14 package
Abstract: JEP95 SSOP14 MO-150 QS-000761-HD-01
Text: ZMD-Standard July 2000 Package SSOP14 5,3 mm MDS 761 Dimensions in millimetres Based on JEDEC JEP95: MO-150 A2 X A 1 Dimensions View X 0,15 ° A1 bp e HE E 1 LP c 0,1 14 Z k x 45 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,99 Amin
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SSOP14
JEP95:
MO-150
QS-000761-HD-01
SSOP14 package
JEP95
SSOP14
MO-150
QS-000761-HD-01
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SSOP14 package
Abstract: SSOP14 SSOP14-P-44-0 ssop14p
Text: SSOP14-P-44-0.65-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SSOP14-P-44-0
SSOP14 package
SSOP14
ssop14p
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sot337
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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SSOP14:
OT337-1
OT337-1
MO-150AB
sot337
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21A1
Abstract: 74LV125DB 74HC125 74HCT125 74LV125 74LV125D 74LV125N 74LV125PW JESD22-A114E
Text: 74LV125 Quad buffer/line driver; 3-state Rev. 03 — 7 April 2009 Product data sheet 1. General description The 74LV125 is a low-voltage Si-gate CMOS device that is pin and function compatible with 74HC125 and 74HCT125. The 74LV125 provides four non-inverting buffer/line drivers with 3-state outputs. The
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74LV125
74LV125
74HC125
74HCT125.
21A1
74LV125DB
74HCT125
74LV125D
74LV125N
74LV125PW
JESD22-A114E
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CBT3126
Abstract: CBT3126D CBT3126DB CBT3126DS CBT3126PW JESD22-A114E JESD78 sot337-1and sot403-1and
Text: CBT3126 Quad FET bus switch Rev. 03 — 9 December 2008 Product data sheet 1. General description The CBT3126 is a quad FET bus switch with independent line switches. Each switch is disabled when the associated Output Enable OE input is LOW. The CBT3126 is characterized for operation from −40 °C to +85 °C.
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CBT3126
CBT3126
126-type
JESD78
JESD22-A114E
JESD22-A115-A
JESD22-C101C
CBT3126D
CBT3126DB
CBT3126DS
CBT3126PW
sot337-1and
sot403-1and
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prtr5v0u6s
Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Text: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years
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2002/95/EC.
PMBTA42
PMEG3005EL
PMEG6010EP
PMR780SN
PTVS12VS1UR
PZU13y
PMBTA42DS
PMEG3005ET
PMEG6010ER
prtr5v0u6s
csp1040
TSSOP20 FOOTPRINT
ip4065cx11
smd transistor GY sot89
IP4065CX11/LF
BV 9y transistor smd
IP4058CX8/LF
IP4280CZ10
smd transistor GY
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74hc080
Abstract: TC74LVX08FS
Text: INTEGRATED T O SH IB A CIRCUIT TECHNICAL TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT TC74LVX08F, TC74LVX08FN, TC74LVX08FS DATA SILICON MONOLITHIC QUAD 2-INPUT AND GATE The TC74LVX08 is a high speed CMOS 2-INPUT AND GATE fabricated with silicon gate C2MOS technology.
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TC74LVX08F,
TC74LVX08FN,
TC74LVX08FS
TC74LVX08
SOL14-P-150-1
TC74LVX08F-
74hc080
TC74LVX08FS
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Untitled
Abstract: No abstract text available
Text: TC74LCX08F/FN/FS-TENTATIVE DATA LOW -VOLTAGE QUAD 2-INPUT AND GATE WITH 5V TOLERANT INPUTS AND OUTPUTS T h e T C 7 4 LC X 0 8 is a h ig h p erform ance CM O S 2 -IN P U T TC74LCX08F A N D G A T E. D e sign e d fo r use in 3.3 V o lt systems, it achieves h ig h speed op e ra tio n w h ile m a in ta in in g the
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TC74LCX08F/FN/FS------TENTATIVE
TC74LCX08F/FN/FS
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Untitled
Abstract: No abstract text available
Text: INTEGRATED T O SH IB A QUAD 2 -INPUT CIRCUIT T E C H N IC A L AND T O S H IB A CM O S D IG IT A L IN TEG R A TED CIR C U IT TC74AC08P/F/FN/FS DATA SILICO N M O N O LITH IC GATE The TC74AC08 is an advanced high speed CMOS 2-INPUT AND GATE fabricated with silicon gate and double - layer
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TC74AC08P/F/FN/FS
TC74AC08
14PIN
14PIN
200mil
150mil
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TC74VHC08F/FN/FS/FT TO SHIBA CM OS D IG ITAL INTEGRATED CIRCUIT SILICON M ONOLITHIC TC74VHC08F, TC74VHC08FN, TC74VHC08FS, TC74VHC08FT QUAD 2 -INPUT AND GATE The TC74VHC08 is an advanced high speed CMOS 2-INPUT AND GATE fabricated with silicon gate C2MOS technology.
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TC74VHC08F/FN/FS/FT
TC74VHC08F,
TC74VHC08FN,
TC74VHC08FS,
TC74VHC08FT
TC74VHC08
14PIN
200mil
OP14-P-300-1
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TC74VHC1OF/FN/FS/FT TO SHIBA CM OS D IG ITAL INTEGRATED CIRCUIT SILICON M ONOLITHIC TC74VHC10F, TC74VHC10FN, TC74VHC10FS, TC74VHC10FT TRIPLE 3 -INPUT NAND GATE The TC74VHC10 is an advanced high speed CMOS 3-INPUT NAND GATE fabricated with silicon gate C2MOS technology.
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TC74VHC1OF/FN/FS/FT
TC74VHC10F,
TC74VHC10FN,
TC74VHC10FS,
TC74VHC10FT
TC74VHC10
14PIN
200mil
OP14-P-300-1
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Untitled
Abstract: No abstract text available
Text: INTEGRATED T O SH IB A QUAD 2 -INPUT CIRCUIT TECHNICAL OR TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT TC74ACT32P/F/FN/FS DATA SILICON MONOLITHIC GATE The TC74ACT32 is an advanced high speed CMOS 2-INPUT OR GATE fabricated with silicon gate and double - layer metal wiring C2MOS technology.
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TC74ACT32P/F/FN/FS
TC74ACT32
14PIN
14PIN
200mil
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Untitled
Abstract: No abstract text available
Text: INTEGRATED T O SH IB A TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT CIRCUIT TECHNICAL TC74AC74P/F/FN/FS DATA SILICON MONOLITHIC DUAL D -TYP E FLIP FLOP WITH PRESET AND CLEAR The TC74AC74 is an advanced high speed CMOS D - FLIP FLOP fabricated with silicon gate and double - layer metal
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TC74AC74P/F/FN/FS
TC74AC74
14PIN
14PIN
200mil
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