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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer	Original	PDF	AIC111 SLAS382A 32-Pin 32-Pad
hearing aid integrated circuits Abstract: 2808990 circuit diagram of hearing aid using transistors Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer	Original	PDF	AIC111 SLAS382A 108-dB 87-dB 73-dB 40kHz 55-dB hearing aid integrated circuits 2808990 circuit diagram of hearing aid using transistors
Untitled Abstract: No abstract text available Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer	Original	PDF	AIC111 SLAS382A 108-dB 87-dB 73-dB 40kHz 55-dB
Untitled Abstract: No abstract text available Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer	Original	PDF	AIC111 SLAS382A 32-Pin 32-Pad
2808990 Abstract: microphone tube Text: AIC111 www.ti.com SLAS382A − JUNE 2003 − REVISED JANUARY 2006 IC DESIGN SPECIFICATION 1.3ĆV microPower DSP/µC VOICE BAND AUDIO CODEC FEATURES D Single Channel Codec D Noise Shaped Delta Sigma ADC and DAC D D D Technology Low Supply Voltage and Current:	Original	PDF	AIC111 SLAS382A 108-dB 40-kHz 55-dB 2808990 microphone tube