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    SIGC57T120R3E Price and Stock

    Infineon Technologies AG SIGC57T120R3EX1SA4

    Trans IGBT Chip N-CH 1200V 50A DIE Waffle - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC57T120R3EX1SA4)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC57T120R3EX1SA4 Waffle Pack 20 Weeks 4,122
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    Infineon Technologies AG SIGC57T120R3EX1SA3

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC57T120R3EX1SA3)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC57T120R3EX1SA3 Waffle Pack 64
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    SIGC57T120R3E Datasheets Context Search

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    Abstract: No abstract text available
    Text: SIGC57T120R3E IGBT3 Power Chip Features: • 1200V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives G


    Original     		PDF SIGC57T120R3E L7667M, L7667T, L7667E,