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Panasonic Electronic Components EHD-RD3371 DC DC CONVERTER 12V 5W
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RD3371 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
AC200V Abstract: ta225 Text: 1/8 Issue No. A00NAD3371 Date of issue 15-Oct-02 Classification New Change Renewal PRODUCT SPECIFICATION FOR INFORMATION Product Description Product Part Number Classification of Spec Applications DC/DC Converter EHD RD3371 Individual Product Spec Term of Validity	Original	PDF	A00NAD3371 15-Oct-02 RD3371 2030mm AC200V ta225
Panasonic capacitors Abstract: No abstract text available Text: Part Name DC-DC Converter Part No. [External FormDimensions] RD3371A 3 - 1 7.0max. 4.7typ. 57.0max. (55.5typ.) Side of marking 24.5max. (22.5typ.) RD3371A lot No. 5P 2P P 2P P 2P 3.5±0.7 MADE IN JAPAN P 10.0 Terminal No. φ0.5 10.0 1 6 8 9 11 13 14	Original	PDF	EHDRD3371A RD3371A 15pin) UL94V-0) AC200V ELC12D102E) 50/60Hz) 338VDC Panasonic capacitors
INTEL 28F640 Abstract: Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3 Text: E µBGA* Package Mechanical and Shipping Media Specifications August 1998 Revision 3.11 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in	Original	PDF	28F640J5 RD33708SW RD33716SW NP291-04002-G4-BF-P 28F160B3 28F008S3 28F160F3 CBG060-044A INTEL 28F640 Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3
CBG064-052A Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability	Original	PDF
ic 6116 datasheet from texas instruments Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	PDF
BGA PACKAGE TOP MARK intel Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	PDF	28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
INTEL 28F640 Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	PDF	12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
intel 04195 Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3 Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel	Original	PDF	paC/85 intel 04195 BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
INTEL 28F640 Abstract: 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram Text: E µBGA* Package Mechanical and Shipping Media Specifications November 1998 Revision 3.12 11/12/98 2:37 PM REV3_12.doc INTEL CONFIDENTIAL until publication date Information in this document is provided in connection with Intel products. No license, express or implied, by	Original	PDF	RD33708SW 28F640J5 28F160F3 RD33716SW INTEL 28F640 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram
8275 intel Abstract: intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 Text: E µBGA* Package Mechanical and Shipping Media Specifications June 1998 Revision 3.9 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in	Original	PDF	28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 8275 intel intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3
intel i5 block diagram Abstract: INTEL 56BALL intel C4 package 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5 Text: E Micro Ball Grid Array Package Mechanical Specifications and Media Information December 1997 Revision 3.6 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in	Original	PDF	28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 intel i5 block diagram INTEL 56BALL intel C4 package 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5
INTEL 28F640 Abstract: transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 Text: E µBGA* Package Mechanical and Shipping Media Specifications March 1999 Revision 3.15 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in	Original	PDF	RD33704SW RD33708SW 28F800B3 28F160B3 CBG060-044A 28F160B3 28F016B3 28F160C3 CBG048-035C INTEL 28F640 transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016S3
rd33708 Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3 Text: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	PDF	28F1602C3 US048631 28F1604C3 28F3202C3 28F3204C3 US048681 rd33708 BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3