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    NX20P3000UK Search Results

    NX20P3000UK Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    NX20P3000UK NXP Semiconductors Wafer level chip-size package; 16 bumps Original PDF

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    Abstract: No abstract text available
    Text: Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.96 x 0.54 mm A B D NX20P3000UK ball A1 index area A2 E A A1 detail X e1 C e C A B C Øv Øw b y D e C e2 B A ball A1 index area 1 2 3 4 X 2 mm scale Dimensions mm are the original dimensions


    Original     		PDF WLCSP16: NX20P3000UK nx20p3000uk