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    MR18R326GAG0 Search Results

    MR18R326GAG0 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MR18R326GAG0 Samsung Electronics Original PDF
    MR18R326GAG0-CM8 Samsung Electronics Original PDF
    MR18R326GAG0-CT9 Samsung Electronics Original PDF

    MR18R326GAG0 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MARKING CODE 11gb

    Abstract: No abstract text available
    Text: MR18R326GAG0 Preliminary Change History Version 0.1 September 2003 - Preliminary * First copy. * Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM Datasheet Page 0 Version 0.1 Sept. 2003 MR18R326GAG0 Preliminary (32Mx18)*16pcs RIMMTM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V


    Original
    PDF MR18R326GAG0 256/288Mbit 32Mx18) 16pcs 576Mb 32K/32ms MARKING CODE 11gb

    marking A45

    Abstract: a80 marking code marking a86 B14 marking code B58 468 diagram marking A32 marking code B38 MR18R326GAG0 MR18R326GAG0-CM8 MR18R326GAG0-CT9
    Text: MR18R326GAG0 Change History Version 1.0 Mar. 2004 * First copy. * Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM Module Datasheet Page 0 Version 1.0 Mar. 2004 MR18R326GAG0 (32Mx18)*16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V


    Original
    PDF MR18R326GAG0 256/288Mbit 32Mx18) 16pcs 576Mb 32K/32ms marking A45 a80 marking code marking a86 B14 marking code B58 468 diagram marking A32 marking code B38 MR18R326GAG0 MR18R326GAG0-CM8 MR18R326GAG0-CT9