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    e78996 india

    Abstract: IRFK4H250 DIODE 3L2 E78996 rectifier module LS-108 hex-pak IRFK4J250 E271
    Text: Bulletin E27105 International ^ R e c tifie r IRFK4H250,IRFK4J250 Isolated Base Power HEX-pak Assembly - Parallel Chip Configuration • • ■ • High Current Capability. UL recognised E78996. Electrically Isolated Base Plate. Easy Assembly into Equipment.


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    PDF E27105 IRFK4H250 IRFK4J250 E78996. T0-240 f5/336 S-162 CH-8032ZURICH, IL60067. NJ07650. e78996 india DIODE 3L2 E78996 rectifier module LS-108 hex-pak IRFK4J250 E271

    irfk4h250 rectifier module

    Abstract: IRFK4H250
    Text: INTERNATIONAL RECTIFIER bS E » • 4ÛSS452 DQltiS7S 17û ■ INR Bulletin E27105 International iïôRlRertififtr IRFK4H250,IRFK4J250 Isolated Base Power HEX-pak Assembly - Parallel Chip Configuration • • • • High Current Capability. UL recognised E78996.


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    PDF SS452 E27105 IRFK4H250 IRFK4J250 E78996. irfk4h250 rectifier module

    1RFK4H250

    Abstract: ior e78996 IRFK4H250 IRFK4J250 E27105
    Text: Bulletin E27105 • ■■ ■ international 1 jr M a i / M - A l r “| / J* ir t f -Ä Isolated Base Power HEX-pak Assembly - Parallel Chip Configuration • nign ourreni uapaointy. • UL recognised E78996. • Electrically Isolated Base Plate. • Easy Assembly into Equipment


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    PDF E27105 1RFK4H250 IRFK4J250 E78996. T0-240 IRFK4H250 ior e78996