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    CG717 Price and Stock

    Honeywell Sensing and Control 2450RCG71740950

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    Honeywell Sensing and Control 2450RCG71740951

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    Seiko Epson Corporation SG-8018CG-71.734681M-TJHPA0

    XTAL OSC XO 71.734681MHZ CMOS SM
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    Seiko Epson Corporation SG-8101CG-71.734681M-TCHPA0

    SG-8101CG 71.734681M-TCHPA0: OSC
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    Seiko Epson Corporation SG-8101CG-71.734681M-TCHSA0

    SG-8101CG 71.734681M-TCHSA0: OSC
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    CG717 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CG717

    Abstract: No abstract text available
    Text: R Ceramic Column Grid Array CG717 Package PK086 (v1.0) January 18, 2006 27X27-COLUMN CERAMIC CGA, 1.27MM PITCH (CG717) 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF CG717) PK086 27X27-COLUMN CG717

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XQR2V3000-4CG717V

    Abstract: XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000
    Text: R < B L QPro Virtex-II 1.5V Radiation-Hardened QML Platform FPGAs DS124 v1.2 December 4, 2006 Product Specification Summary of Radiation Hardened QPro Virtex-II Features • • • • • • • • • • • • • Industry First Radiation Hardened Platform FPGA


    Original     		PDF DS124 MIL-PRF-38535 XQR2V3000-4CG717V XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000

    XQ2V1000-4FG456N

    Abstract: XQ2V1000 Virtex Qpro xq2v1000-4bg575n CG717 CF1144 matrix m21 vhdl code for carry select adder using ROM XQ2V1000-4BG XQ2V3000
    Text: ds122_1_1.fm Page 1 Wednesday, January 7, 2004 9:15 PM QPro Virtex-II 1.5V Military QML Platform FPGAs R DS122 v1.1 January 7, 2004 Product Specification Summary of QPro Virtex™-II Features • • • • • • • • Industry First Military Grade Platform FPGA Solution


    Original     		PDF DS122 MIL-PRF-38535 CF1144 XQ2V1000-4FG456N XQ2V1000 Virtex Qpro xq2v1000-4bg575n CG717 matrix m21 vhdl code for carry select adder using ROM XQ2V1000-4BG XQ2V3000

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XCV100 TQ144

    Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
    Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116

    camera-link to hd-SDI converter

    Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
    Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    XC3S250E TQ144 STARTER KIT BOARD

    Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
    Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    XQR2V3000-4CG717V

    Abstract: No abstract text available
    Text: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — R 1 2 3 QPro Virtex-II 1.5V Radiation-Hardened QML Platform FPGAs DS124 v2.0 April 7, 2014 Product Specification Summary of Radiation-Hardened QPro Virtex-II FPGA Features • • • • • • •


    Original     		PDF DS124 MIL-PRF-38535 XQR2V3000-4CG717V

    Untitled

    Abstract: No abstract text available
    Text: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — 187 QPro Virtex-II 1.5V Platform FPGAs DS122 v3.0 April 7, 2014 Product Specification Summary of QPro Virtex™-II Features • High-performance clock management circuitry • Industry’s first military-grade platform FPGA solution


    Original     		PDF DS122 MIL-PRF-38535

    CB228

    Abstract: CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300
    Text: QPRO Logic Cells RAMbus MULTs DLLs Flip-Flops Max I/Os 64 PG84, CB100 XQR4013XL 3.3 10-30K 1368 18K 393632 – – 1536 192 CB228 60 360 80 PG84 XQR4036XL 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – –


    Original     		PDF CB100 XQR4013XL 10-30K CB228 XQR4036XL 22-65K XC3042* PG132, CB228 CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300

    XQR2V3000-4CG717V

    Abstract: XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V3000-4BG728R XQR2V3000-4BG728 CG717 XQR2V1000-4BG575N XQR2V1000-4BG575 CF1144
    Text: ds124.fm Page 1 Tuesday, January 20, 2004 6:23 PM QPro Virtex-II 1.5V Radiation Hardened QML Platform FPGAs R DS124 v1.1 January 8, 2004 Product Specification Summary of Radiation Hardened QPro Virtex™-II Features • Industry First Radiation Hardened Platform FPGA


    Original     		PDF ds124 DS124 MIL-PRF-38535 CF1144 XQR2V3000-4CG717V XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V3000-4BG728R XQR2V3000-4BG728 CG717 XQR2V1000-4BG575N XQR2V1000-4BG575

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    Untitled

    Abstract: No abstract text available
    Text: QPRO DLLs 10-30K 1368 18K 393632 – – 1536 192 CB228 60 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – – 480 96 PG84, PG132, CB100 XQR4062XL 3.3 40-130K 5472 74K 1433864 – – 5376 384 CB228 60 XC3064*


    Original     		PDF 10-30K CB228 22-65K XC3042* PG132, CB100 XQR4062XL 40-130K

    XQ2V6000-4CF1144M

    Abstract: XQ2V3000-4CG717M XQ2V1000-4FG456N XQ2V3000-4BG728N XQ2V1000-4BG575N IO-L93N XQ2V300 XQ2V1000 XQ2V3000-4BG
    Text: QPro Virtex-II 1.5V Military QML Platform FPGAs R DS122 v1.2 November 30, 2006 Product Specification Summary of QPro Virtex™-II Features • • • • • • • • • • • • • • • • • Industry’s First Military Grade Platform FPGA Solution


    Original     		PDF DS122 MIL-PRF-38535 UG002, XAPP623, XAPP689, BG575 XQ2V6000-4CF1144M XQ2V3000-4CG717M XQ2V1000-4FG456N XQ2V3000-4BG728N XQ2V1000-4BG575N IO-L93N XQ2V300 XQ2V1000 XQ2V3000-4BG

    ULVDS25

    Abstract: QPro Virtex-II EF957 IO-L93N
    Text: R DS122 v2.0 December 12, 2007 QPro Virtex-II 1.5V Platform FPGAs Product Specification Summary of QPro Virtex™-II Features • • Industry’s first military-grade platform FPGA solution • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)


    Original     		PDF DS122 MIL-PRF-38535 BG575 XQ2V6000-5EF957I, XQ2V6000-4EF1152I, XQ2V6000-5EF1152I. CG717 CF1144 ULVDS25 QPro Virtex-II EF957 IO-L93N

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    XC6SLX45t-fgg484

    Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
    Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XC6SLX45t-fgg484 XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow