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    84 FBGA THERMAL Search Results

    84 FBGA THERMAL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    84 FBGA THERMAL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    M378T5663FB3

    Abstract: No abstract text available
    Text: Rev. 1.0, Jul. 2010 M378T2863FBS M378T5663FB3 M391T2863FB3 M391T5663FB3 240pin Unbuffered DIMM based on 1Gb F-die 60 & 84 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND


    Original     		PDF M378T2863FBS M378T5663FB3 M391T2863FB3 M391T5663FB3 240pin K4T1G084QF M378T5663FB3/M391T5663FB3 128Mbx8 128Mx72

    K4N1G164QF

    Abstract: K4N1G164QF-BC20
    Text: Rev. 1.1, Sep. 2010 K4N1G164QF 1Gb F-die gDDR2 SDRAM 84 FBGA with Lead-Free & Halogen-Free RoHS Compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed


    Original     		PDF K4N1G164QF 6-10per) 11-50per) K4N1G164QF K4N1G164QF-BC20

    K4N1G164QE

    Abstract: k4n1g164qe-hc20
    Text: Rev. 1.33, Apr.2010 K4N1G164QE 1Gb E-die gDDR2 SDRAM 84 FBGA with Lead-Free & Halogen-Free RoHS Compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed


    Original     		PDF K4N1G164QE 6-10per) 11-50per) K4N1G164QE k4n1g164qe-hc20

    C6426

    Abstract: asus U6052 C6599 R5538 k 355k c10501 SW251 M38857 isl6227caz
    Text: 5 4 3 2 1 CLOCK GEN. ICS954310 W7J: YONAH/CALISTOGA-PM/G72M BLOCK DIAGRAM PAGE 6 FAN + Thermal ADT7473 DDR2 VRAM*4 D PAGE 5 Yonah POWER ON SEQUENCE 478 uFCPGA 84 FBGA ON BOARD 512MB DDR2 PAGE 20,21 PAGE 2,3,4 HOST BUS 133/166MHz LVDS PAGE 23 nVIDIA G72M CRT


    Original     		PDF YONAH/CALISTOGA-PM/G72M ICS954310 ADT7473 133/166MHz 512MB 945PM 533/667MHz 100MHz RTL8111B 802WLAN C6426 asus U6052 C6599 R5538 k 355k c10501 SW251 M38857 isl6227caz

    ICS954310

    Abstract: U6042 CR6338 U6020 G547B2 R5538 C6138 ICS954310BGLFT R6660 U6041
    Text: 5 4 3 2 1 CLOCK GEN. ICS954310 T76J: YONAH/CALISTOGA-PM/G72M BLOCK DIAGRAM PAGE 6 FAN + Thermal ADT7473 DDR2 VRAM*4 84 FBGA D PAGE 5 Yonah 478 uFCPGA ON BOARD 512MB DDR2 PAGE 20,21 PAGE 2,3,4 HOST BUS 133/166MHz LVDS PAGE 23 nVIDIA G72M CRT PAGE 24 PCIE 533 BGA


    Original     		PDF YONAH/CALISTOGA-PM/G72M ICS954310 ADT7473 133/166MHz 512MB 945PM 533/667MHz 100MHz RTL8111B M38857 ICS954310 U6042 CR6338 U6020 G547B2 R5538 C6138 ICS954310BGLFT R6660 U6041

    ITE8511

    Abstract: asus ITE 8511 U6042 L5792 C6550 U6052 R8700 L1042B C6352
    Text: 5 4 3 2 1 T76S: MEROM/965-PM/ICH8-M/NB8M-SE BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T GDDR2 VRAM*4 16X16 D Merom PAGE 21 D 478B uFCPGA FAN + Thermal sensor 84 FBGA PAGE 51 PAGE 36 PAGE 3,4,5 FSB 800 MHz LVDS nVIDIA NB8M-SE PAGE 34 CRT PAGE 35 533 BGA POWER


    Original     		PDF MEROM/965-PM/ICH8-M/NB8M-SE 16X16) ICS9LPR363CGLF-T 965PM 667MHz RTL8111B ALC660D PMN45EN FDW2501 MAX8632 ITE8511 asus ITE 8511 U6042 L5792 C6550 U6052 R8700 L1042B C6352

    ITE 8511

    Abstract: ITE8511 C6290 U606-3 C-6533 C6384 asus u6042 B C6113 U6048
    Text: 5 4 3 2 1 T76S: MEROM/965-PM/ICH8-M/NB8M-SE BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T GDDR2 VRAM*4 16X16 D Merom PAGE 21 D 478B uFCPGA FAN + Thermal sensor 84 FBGA PAGE 51 PAGE 3,4,5 PAGE 36 FSB 800 MHz LVDS nVIDIA NB8M-SE PAGE 34 CRT PAGE 35 533 BGA POWER


    Original     		PDF MEROM/965-PM/ICH8-M/NB8M-SE 16X16) ICS9LPR363CGLF-T 965PM 667MHz RTL8111B ALC660D PMN45EN FDW2501 MAX8632 ITE 8511 ITE8511 C6290 U606-3 C-6533 C6384 asus u6042 B C6113 U6048

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    ddr2 laptop pin

    Abstract: DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333
    Text: Product Information 2004 MEMORY DRAM Modules Including DDR2 Modules w w w. i n f i n e o n . c o m / m e m o r y Never stop thinking. Introduction One-Stop-Shopping for DRAM Modules J U N E 2 0 0 4 . As a leading memory products supplier, we offer an extensive range of leading-edge DRAM modules.


    Original     		PDF B166-H8412-X-X-7600 ddr2 laptop pin DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333

    IS43DR16320B

    Abstract: IS43DR16320B-37CBLI IS43DR86400B37CBLI IS43DR16320 IS43DR16320B-3DBLI IS46DR86400B3DBLA2 46DR86400B 400B 800E IS46DR16320B-3DBLA2
    Text: IS43/46DR86400B, IS43/46DR16320B PRELIMINARY INFORMATION MARCH 2010 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6


    Original     		PDF IS43/46DR86400B, IS43/46DR16320B 512Mb 400MHz cycles/64 84ball IS46DR16320B3DBLA2 IS43DR16320B IS43DR16320B-37CBLI IS43DR86400B37CBLI IS43DR16320 IS43DR16320B-3DBLI IS46DR86400B3DBLA2 46DR86400B 400B 800E IS46DR16320B-3DBLA2

    Untitled

    Abstract: No abstract text available
    Text: IS43/46DR86400B, IS43/46DR16320B AUGUST 2010 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6 Programmable Additive Latency: 0, 1, 2, 3, 4 and 5


    Original     		PDF IS43/46DR86400B, IS43/46DR16320B 512Mb 400MHz cycles/64 60ball 84ball

    Untitled

    Abstract: No abstract text available
    Text: IS43/46DR86400B, IS43/46DR16320B JUNE 2010 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6 Programmable Additive Latency: 0, 1, 2, 3, 4 and 5


    Original     		PDF IS43/46DR86400B, IS43/46DR16320B 512Mb 400MHz cycles/64 60ball 84ball

    SAMSUNG 834

    Abstract: No abstract text available
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STD131 SAMSUNG 834

    SAMSUNG 834

    Abstract: pcb design 0,5 mm pitch STD130
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STD130 SAMSUNG 834 pcb design 0,5 mm pitch STD130

    pcb design 0,5 mm pitch

    Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STDL130 pcb design 0,5 mm pitch SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance

    MS-026

    Abstract: MT55L128L18P1 MT55L128L18P1T-10 MT55L64L32P1 MT55L64L36P1 MT55L128
    Text: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization


    Original     		PDF MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 June/21/00 x32/36 165-Pin May/23/00 MT55L128L18P1 MS-026 MT55L128L18P1T-10 MT55L64L32P1 MT55L64L36P1 MT55L128

    Untitled

    Abstract: No abstract text available
    Text: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization


    Original     		PDF June/21/00 x32/36 165-Pin May/23/00 MT55L128L18P1

    Untitled

    Abstract: No abstract text available
    Text: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization


    Original     		PDF MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 June/21/00 x32/36 165-Pin May/23/00 MT55L128L18P1