IPC-SM-7525A
Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
Text: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its
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AN-9048
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDMF6700,
FDMF6704,
FDMF6704A,
FDMF6704V,
FDMF6730
IPC-SM-7525A
ipc 610D
IPC-7525
J-STD-001C
IPC-4101B
entek ht plus
JSTD001D
7525A smt
j-std-001d
IPC610D
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vo3120
Abstract: igbt induction stove 40v diode 6260 thermal MSS1P3U SMPS Solar Battery chargers VO3150A military passive component Vishay MKP 1848 VO3150
Text: Vishay Intertechnology, Inc. Super 12 Featured Products www.vishay.com/landingpage/super12/2010 S12 Super 12 Featured Products 597D and T97 Multi-Anode Tantalum Capacitors Industry’s First 75-V-Rated Tantalum Capacitors DrMOS 6x6 – SiC769 Industry-Best Power Density for Mainstream
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com/landingpage/super12/2010
SiC769
VMN-MS6398-1002
vo3120
igbt induction stove
40v diode
6260 thermal
MSS1P3U
SMPS Solar Battery chargers
VO3150A
military passive component
Vishay MKP 1848
VO3150
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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QFN leadframe
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
QFN leadframe
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AK08D300-CLCC
Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
AK08D300-CLCC
AK08D300-LFCSP2X3 .5mm
AK08D300-LFCSP3x3 .5mm
AK08D300-MLP.65mm
AK10D300-8SON .65mm
MLP 3X3
MLP 4X4
AK22D300-DFN
AK24D300-LLP
MLP 5X5
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SiC762CD
Abstract: SiC769 SiC769CD 300khz mosfet driver IC SiC762 SiC769A ISL6336A drMOs intel drMOS 2.0
Text: V i sh ay I n t e r t e ch n o l o g y, I n c . DrMOS The new Vishay Siliconix SiC769, SiC769A, and SiC762 integrated DrMOS solutions provide high-side and low-side n-channel MOSFETs plus a full-featured MOSFET driver IC, all in a single PowerPAK MLF6x6 package.
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SiC76
9/SiC76
/SiC762
SiC769,
SiC769A
SiC762
VMN-PT0172-1002
SiC762CD
SiC769
SiC769CD
300khz mosfet driver IC
ISL6336A
drMOs
intel drMOS 2.0
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TGA2517
Abstract: TGA2540-FL TGA2573 TQM7M5013 TQP6M9002 tga2540 tqp340003 TQM726018 QFN28 6x6 TQM679002A
Text: May 2010 Product Selection Guide Amplifiers Control Products Filters Integrated Products Optical Components Connecting the Digital World to the Global Network Table of Contents ABOUT TRIQUINT SEMICONDUCTOR .2 GUIDE BY MARKET Automotive . 4
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Abstract: No abstract text available
Text: 36 Pin to 40 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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6MM-40
AK40D600-TSOP
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ferite
Abstract: MLX80103 Melexis LIN Slave ICs LIN protocol J2602 J2602 Melexis LIN Melexis MLX80103
Text: Automotive ICs MLX80103 LIN Switch Slave Hall ICs This IC is a fully integrated LIN Slave for matrix switch or single switch Applications in automotive environment. It is suitable for bus systems according to LIN 2.0. Intelligent Drivers and Actuators The combination of physical layer LIN transceiver and LIN protocol
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MLX80103
J2602
ferite
MLX80103
Melexis LIN Slave ICs
LIN protocol J2602
J2602
Melexis LIN
Melexis MLX80103
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Untitled
Abstract: No abstract text available
Text: 28 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK28DW600-PLCC
AK28DWS600-PLCC
AK28DWS600-32PLCC-M
AK28DW600-32PLCC-M
AK28D600-32PLCC
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ISL6336
Abstract: SiC762CD intel drMOS 2.0 intel drMOS 1.0
Text: V I S H AY I N T E R T E C H N O L O G Y, I N C . Power ICs - DrMOS Solutions in a Single PowerPAK MLF6x6 Package AND TEC I INNOVAT O L OGY DrMOS N HN POWER ICs O 19 62-2012 SiC769/SiC769A/SiC762 Integrated DrMOS Power Stage The new Vishay Siliconix SiC769, SiC769A, and SiC762 integrated DrMOS solutions provide high-side
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SiC769/SiC769A/SiC762
SiC769,
SiC769A
SiC762
ISL6336A
VMN-PT0172-1202
SiC769
ISL6336
SiC762CD
intel drMOS 2.0
intel drMOS 1.0
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Untitled
Abstract: No abstract text available
Text: 30 Pin to 32 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK32D600-QFN/MLP
6MM-32
7MM-32
AK32D600-QFN
DA26A)
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Untitled
Abstract: No abstract text available
Text: 30 Pin to 32 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK32D600-QFN/MLP
6MM-32
7MM-32
AK32D600-QFN
DA26A)
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ultra fast diode 5a 84v
Abstract: FDMF6730 MO-220 6X6 mlp SPM 1000 plus
Text: FDMF6730 Driver plus FET Multi-chip Module Features General Description Over 95% efficiency The FDMF6730 is a high efficiency Driver plus MOSFET power stage solution optimized for Ultra Mobile PC UMPC system power voltage supplies. It is fully compliant with the Intel UltraMobile Driver MOS (uDrMOS) Specification. The MOSFETs and
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FDMF6730
FDMF6730
V-16V
ultra fast diode 5a 84v
MO-220
6X6 mlp
SPM 1000 plus
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sky77528
Abstract: sky77534 SKY77526 SKY77705 SKY77548 SKY77542 SKY65404-21 SKY77544 SKY77701 AX508
Text: Product Selection Guide Fall 2010 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high reliability analog and mixed signal semiconductors. Leveraging core technologies, Skyworks offers diverse standard and custom linear products supporting automotive, broadband, cellular infrastructure, energy management,
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BRO254-10A
sky77528
sky77534
SKY77526
SKY77705
SKY77548
SKY77542
SKY65404-21
SKY77544
SKY77701
AX508
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sky77528
Abstract: SKY77344 SKY77531 sky77534 srf 3417 SKY77526 SKY73009-11 SKY77518 sky77524 SKY77519
Text: Product Selection Guide Fall 2009 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high reliability analog and mixed signal semiconductors. Leveraging core technologies, Skyworks offers diverse standard and custom linear products supporting automotive, broadband, cellular infrastructure, energy management,
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BRO254-09B
sky77528
SKY77344
SKY77531
sky77534
srf 3417
SKY77526
SKY73009-11
SKY77518
sky77524
SKY77519
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AS3693B
Abstract: AS3693B1 as3992 AS3430 AS3693A AS3501 as3665 AS3900 AS3693 AS3931
Text: High Performance Analog IC Portfolio Overview June 2010 Product Portfolio austriamicrosystems is a global leader in the design and manufacture of high performance analog ICs, combining over 27 years of analog design capabilities and system know-how with its own state-of-the-art manufacturing
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AS3977
QFN-16
AS3693B
AS3693B1
as3992
AS3430
AS3693A
AS3501
as3665
AS3900
AS3693
AS3931
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Untitled
Abstract: No abstract text available
Text: FDMF6704 - XSTM DrMOS tm The Xtra Small, High Performance, High Frequency DrMOS Module Benefits General Description 1 Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages. The XSTM DrMOS family is Fairchild’s next-generation fullyoptimized, ultra-compact, integrated MOSFET plus driver power
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FDMF6704
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Untitled
Abstract: No abstract text available
Text: FDMF6704A - XSTM DrMOS The Xtra Small, High Performance, High Frequency DrMOS Module tm Benefits General Description 1 Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages. 1 Skip mode SMOD [low side gate turn off] input.
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FDMF6704A
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LIN bus can gateway
Abstract: TH8100 diode matrix rom KL15 diode matrix rom 4 x 4 20 KV capacitor bank wiring
Text: TH8100 LIN Slave Controller for Switches Features o LIN-Protocol Controller based upon the LIN protocol specification 1.3 - o MLX4 Dual Task MCU LIN-Transceiver based on the LIN protocol specification 1.3 - Slew rate control - Transmission speed up to 20kb/s
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TH8100
20kb/s
QS9000,
ISO14001
LIN bus can gateway
TH8100
diode matrix rom
KL15
diode matrix rom 4 x 4
20 KV capacitor bank wiring
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s2083
Abstract: PQFN IPC-SM-782 MO-220
Text: Surface Mount Instructions for PQFN Packages S2083 V6 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil
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S2083
s2083
PQFN
IPC-SM-782
MO-220
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IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
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Untitled
Abstract: No abstract text available
Text: FDMF6730 Driver plus FET Multi-chip Module Features General Description 1 Over 95% efficiency The FDMF6730 is a high efficiency Driver plus MOSFET power stage solution optimized for Ultra Mobile PC UMPC system power voltage supplies. It is fully compliant with the Intel UltraMobile Driver MOS (uDrMOS) Specification. The MOSFETs and
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FDMF6730
FDMF6730
V-16V
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