Untitled
Abstract: No abstract text available
Text: HANBit HMF51232J4 FLASH-ROM MODULE 2MByte 512K x 32-Bit – 68-Pin JLCC Part No. HMF51232J4 GENERAL DESCRIPTION The HMF51232J4 is a high-speed flash read only memory (FROM) module containing 524,288 words organized in a x32bit configuration. The module consists of four 512Kx 8 FROM mounted on a 68 -pin, JLCC FR4-printed circuit board.
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HMF51232J4
32-Bit)
68-Pin
HMF51232J4
x32bit
512Kx
HMF51232J4-55
32bit
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Untitled
Abstract: No abstract text available
Text: HANBit HMF51232J4V FLASH-ROM MODULE 2MByte 512K x32-Bit – 68-Pin JLCC Part No. HMF51232J4V GENERAL DESCRIPTION The HMF51232J4V is a high-speed flash read only memory (FROM) module containing 524,288 words organized in a x32bit configuration. The module consists of four 512Kx 8 FROM mounted on a 68-pin, JLCC FR4-printed circuit board.
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HMF51232J4V
x32-Bit)
68-Pin
HMF51232J4V
x32bit
512Kx
68-pin,
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68PIN
Abstract: max4860
Text: HANBit HMF4M16J4V Flash-ROM Module 8MByte 4Mx16bit , 68-pin JLCC type, 3.3V Design Part No. HMF4M16J4V GENERAL DESCRIPTION The HMF4M16J4V is a high-speed flash read only memory (FROM) module containing 2,097,152 words organized in an x16bit configuration. The module consists of four 2M x 8bit FROM mounted on a 68-pin, JLCC connector FR4-printed circuit
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HMF4M16J4V
4Mx16bit)
68-pin
HMF4M16J4V
x16bit
68-pin,
HMF4M16J4V-70
68PIN
max4860
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sram 1mbyte 3.3v
Abstract: HMS25632J2V 256KX
Text: HANBit HMS25632J2V SRAM MODULE 1Mbyte 256K x 32-Bit 3.3V, 68-Pin JLCC Packaging Part No. HMS25632J2V GENERAL DESCRIPTION The HMS25632J2V is a high-speed static random access memory (SRAM) module containing 262,144 words organized in a x32-bit configuration. The module consists of two 256K x 16 SRAMs mounted on a 68-pin, double-sided, FR4-printed circuit
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HMS25632J2V
32-Bit)
68-Pin
HMS25632J2V
x32-bit
68-pin,
HMS25632J2V-10
256KX
sram 1mbyte 3.3v
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HMS51232J4V
Abstract: marking HX 6 pin KXY 23
Text: HANBit HMS51232J4V HAN SRAM MODULE 2Mbyte 512Kx32Bit , 68-Pin JLCC Packaging,3.3V BIT Part No. HMS51232J4V GENERAL DESCRIPTION The HMS51232J4V is a static random access memory (SRAM) module containing 524,288 words organized in a x32-bit configuration. The module consists of four 512K x 8 SRAMs mounted on a 68-pin, single-sided, FR4printed circuit board.
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HMS51232J4V
512Kx32Bit)
68-Pin
HMS51232J4V
x32-bit
68-pin,
x32bit
32bit
marking HX 6 pin
KXY 23
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HMS51232J4
Abstract: No abstract text available
Text: HANBit HMS51232J4 SRAM MODULE 2Mbyte 512K x 32-Bit , 68-Pin JLCC Packaging Part No. HMS51232J4 GENERAL DESCRIPTION The HMS51232J4 is a static random access memory (SRAM) module containing 524,288 words organized in a x32-bit configuration. The module consists of four 512K x 8 SRAMs mounted on a 68-pin, single-sided, FR4-printed circuit board.
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HMS51232J4
32-Bit)
68-Pin
HMS51232J4
x32-bit
68-pin,
HMS51232J4-10
512KX
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HMS25632J2
Abstract: No abstract text available
Text: HANBit HMS25632J2 SRAM MODULE 1Mbyte 256K x 32-Bit , 5V, 68-Pin JLCC Design Part No. HMS25632J2 GENERAL DESCRIPTION The HMS25632J2 is a high-speed static random access memory (SRAM) module containing 262,144 words organized in a x32-bit configuration. The module consists of two 256K x 16 SRAMs mounted on a 68-pin, double-sided, FR4-printed circuit
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HMS25632J2
32-Bit)
68-Pin
HMS25632J2
x32-bit
68-pin,
HMS25632J2-10
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HMS51232J4A
Abstract: No abstract text available
Text: HANBit HMS51232J4A SRAM MODULE 2Mbyte 512K x 32-Bit , 68-Pin JLCC Packaging Part No. HMS51232J4A GENERAL DESCRIPTION The HMS51232J4A is a static random access memory (SRAM) module containing 524,288 words organized in a x32-bit configuration. The module consists of four 512K x 8 SRAMs mounted on a 68-pin, single-sided, FR4-printed circuit board.
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HMS51232J4A
32-Bit)
68-Pin
HMS51232J4A
x32-bit
68-pin,
HMS51232J4A-10
512KX
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CERAMIC LEADLESS CHIP CARRIER LCC 68
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad
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180Pin,
CERAMIC LEADLESS CHIP CARRIER LCC 68
CERAMIC LEADLESS CHIP CARRIER LCC 24
CERAMIC LEADLESS CHIP CARRIER LCC 44
CERAMIC LEADLESS CHIP CARRIER LCC 68 pad
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER
J-Lead, plcc
PLCC 44 leadless
quad flat j-leaded package
12 CERAMIC LEADLESS CHIP CARRIER LCC
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BC 1098
Abstract: EPM7384 ALTERA 68 PLCC t187
Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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232-pin
240-pin
100-pin
256-pin
484-pin
672-pin
BC 1098
EPM7384
ALTERA 68 PLCC
t187
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Yamaichi IC51-0804-808
Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
Text: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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LCS-68
Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
Text: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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100 PIN "PGA" ALTERA DIMENSION
Abstract: No abstract text available
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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altera ep610
Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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LCS-68
Abstract: 821575-1 LCS-84 1-382320-7 821574-1
Text: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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EP1210D
Abstract: EP320D ep1800g EP320P EP1800L EPS448D EP6000 EP900D
Text: EP ID PACKA6E PIHS MACRO CELLS IREGISTERS BURIED REGISTERS INPUTS I/O M Hz Imix Icc mA STANOBY Icc mA EP1800J EP1800L EP1800G JLCC PLCC PGA 68 68 68 48 48 48 16 16 16 16 16 16 48 48 48 25.0 25.0 25.0 30.0 30.0 30.0 0.15 0.15 0.15 EP1210D EP1210P EP1210J EP1210L
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EP1800J
EP1800L
EP1800G
EP1210D
EP1210P
EP1210J
EP1210L
EPB1400D
EPB1400P
EPB1400J
EP320D
EP320P
EPS448D
EP6000
EP900D
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128kx8
Abstract: EDI88130 32 PIN edi84256
Text: moi Selector Guide ELECTRONIC DESIGNS INC. Density Oraanization Part No. Speed ns Max Current (mAl Packaae Paae x32 Flash 4 Megabits 4 Megabits 128KX32 4 Megabits 4 Megabits 128KX32 128Kx32 EDI7C32128C-JM EDI7M32128C-GB 120-200 120-200 250 250 68 lead JLCC
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128KX32
EDI7C32128C-JM
EDI7M32128C-GB
EDI5C32128C-JM
EDI5M32128C-GB
64KX32
128KX32
128kx8
EDI88130
32 PIN
edi84256
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Untitled
Abstract: No abstract text available
Text: 512Kx32 3.3V SRAM MODULE ADVANCED* FEATURES • Commercial Temperature Range ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation: ■ TTL Compatible Inputs and Outputs • 3.3V ± 1 0% Po w er Supply ■ Fully Static Operation: ■ Packaging • 68-lead, JLCC/PLCC, Package 701
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512Kx32
68-lead,
512Kx32;
1Mx16
WS512K32BV-XCJC
300000Q
WS512K32BV-XCJC
512Kx32
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Untitled
Abstract: No abstract text available
Text: m WS512K32-XCJX M/HITE M IC R O E L E C T R O N IC S 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15,17, 20, 25ns Two pinout options ■ Packaging • Standard commercial pinout M aster W E • 68 Lead, JLCC (Package 701) • G2 p in o u t fo r upgrade path to m ilita ry grad e d ev ices
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WS512K32-XCJX
512Kx32
512Kx32
512K32
0Q020b3
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Untitled
Abstract: No abstract text available
Text: a WS512K32-XCJX WHITE /MICROELECTRONICS 512Kx32SRAM MODULE PRELIMINARY* FEATURES • ■ A ccess Tim es of 1 5 ,1 7 , 20, 25ns ■ T w o pino ut op tions Packaging • S tandard com m ercial pin o u t M a s te rW E • 68 Lead, JLCC (Package 701) • G2 pino ut fo r upgrade pa th to m ilita ry grade devices
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WS512K32-XCJX
512Kx32SRAM
512Kx32
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jlcc 32 R
Abstract: 68-JLCC package
Text: ^EDI EDI8C32128C ELECTRONIC DESIGNS INC. • High Performance Four Megabit SRAM 128Kx32 CMOS High Speed Static RAM Features The EDI8C32128C, a high speed, high performance, four megabit density Static RAM organized as 128Kx32 bits, contains four 128Kx8 SRAM mounted in a package.
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EDI8C32128C
128Kx32
EDI8C32128LP
EDI8C32128C,
128Kx8
EDI8C32128LP20GM
EDI8C32128LP25GM
EDI8C32128LP35GM
jlcc 32 R
68-JLCC package
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Untitled
Abstract: No abstract text available
Text: 22EDI EDI8C32128C ELECTRONIC DESIGNS INC. High Performance Four Megabit SRAM 128Kx32 CMOS High Speed Static RAM Features The EDI8C32128C, a high speed, high performance, four megabit density Static RAM organized as 128Kx32 bits, contains four 128Kx8 SRAMs mounted in a package.
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22EDI
EDI8C32128C
128Kx32
EDI8C32128C,
128Kx32
128Kx8
EDI8C32128C
040x45Â
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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44 pin jlcc socket
Abstract: QILE-84P-410T LCS-68 821575-1 84P-410T
Text: Selecting Sockets for J-Lead Packages A pplication Brief 46 M arch 1995, ver. 5 Introduction Altera offers ceramic and plastic J-lead chip carrier packages JLCC and PLCC for many devices to reduce the "real estate" demands of a system. These small packages are generally intended for surface mounting.
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