Untitled
Abstract: No abstract text available
Text: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications
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In008
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MARKING H9
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking
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D-25578
MARKING H9
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SMD marking 1N3
Abstract: 4033n HP 4504 multilayer GHz
Text: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications
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06eheated
SMD marking 1N3
4033n
HP 4504
multilayer GHz
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Untitled
Abstract: No abstract text available
Text: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications
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Untitled
Abstract: No abstract text available
Text: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications
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mhl 3.0
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION TYPE COATING COLOR MARKING MHL xx C Black MHL 1E K White None Polarity mark
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56n j 400
Abstract: No abstract text available
Text: MINIATURE SMD CHIP INDUCTORS SMDCHGR 0402S/0603/0805/1008/1210/TYPE Shape and Size : Dimensions are in mm Features : Ordering Information : .Miniature SMD chip inductors have been designed SMD CH G especially for the need of today's high frequency (1)
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0402S/0603/0805/1008/1210/TYPE
56n j 400
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2n2 j 100
Abstract: nh33 marking 68N KL73
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking
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tech50
2n2 j 100
nh33
marking 68N
KL73
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n68 j 250
Abstract: TE56N OF 22 nH INDUCTOR TP-2N2 Inductor 0.5 nH TE10N
Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE
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HP4291B
D-25578
n68 j 250
TE56N
OF 22 nH INDUCTOR
TP-2N2
Inductor 0.5 nH
TE10N
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Untitled
Abstract: No abstract text available
Text: HIGH FREQUENCY CHIP INDUCTORS New miniature 0603 and 0805 size inductor chips feature monolithic ceramic construction allowing low cost manufacturing methods. The high-Q ceramic material exhibits self resonant frequencies up to 17 GHz. APPLICATIONS • CELL/PCS RF Modules
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SMD marking 1N3
Abstract: SMD MARKING CODE 201 LCMC0201
Text: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications
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06eheated
SMD marking 1N3
SMD MARKING CODE 201
LCMC0201
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AML1005H
Abstract: 56N10 AML1005H10NJTS AML1005H56NJTS AML1005H1N0STS AML1005H1N5STS AML1005H18NJTS AML1005H2N2STS AML1005H82NJTS FDK 004
Text: MD-MDJ001-0709 AML1005H タイプ電気特性一覧 Q Min Part number L[nH] Toler 100MHz -ance DC Q Typ S.R.F. Rated Resistance 100 100 800 1000 2000 [MHz] [MHz] [MHz] [MHz] [MHz] [MHz] current [ohm] Typ [mA] Typ AML1005H1N0STS 1.0 S 8 10 30 35 46 >10000 0.04
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MD-MDJ001-0709
AML1005H
100MHz
AML1005H1N0STS
AML1005H1N2STS
AML1005H1N5STS
AML1005H1N8STS
AML1005H2N2STS
AML1005H2N7STS
AML1005H3N3STS
AML1005H
56N10
AML1005H10NJTS
AML1005H56NJTS
AML1005H18NJTS
AML1005H82NJTS
FDK 004
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Untitled
Abstract: No abstract text available
Text: MINIATURE SMD CHIP INDUCTORS SMDCHGR 0402S/0603/0805/1008/1210/TYPE Shape and Size : Dimensions are in mm Features : Ordering Information : .Miniature SMD chip inductors have been designed SMD CH G especially for the need of today's high frequency (1)
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0402S/0603/0805/1008/1210/TYPE
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Untitled
Abstract: No abstract text available
Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE
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HP4291B
D-25578
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marking TB
Abstract: 8 tb 08 Marking code H6 TE 56 -ATC
Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE
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E4991A
HP4291B
D-25578
marking TB
8 tb 08
Marking code H6
TE 56 -ATC
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FDK 004
Abstract: AML1005H1N5STS
Text: MD-MDE001-0709 AML1005H ELECTRICAL CHARACTERISTICS Q Min Part number L[nH] Toler 100MHz -ance DC Q Typ S.R.F. Rated Resistance 100 100 800 1000 2000 [MHz] [MHz] [MHz] [MHz] [MHz] [MHz] current [ohm] Typ [mA] Typ AML1005H1N0STS 1.0 S 8 10 30 35 46 >10000 0.04
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MD-MDE001-0709
AML1005H
100MHz
AML1005H1N0STS
AML1005H1N2STS
AML1005H1N5STS
AML1005H1N8STS
AML1005H2N2STS
AML1005H2N7STS
AML1005H3N3STS
FDK 004
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CTPR10
Abstract: 2n2 j 1600 1n5 j 1600
Text: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION TYPE COATING COLOR MARKING MHL xx C Black MHL 1E K White None Polarity mark
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D-25578
CTPR10
2n2 j 1600
1n5 j 1600
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2n2 j 100
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking
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E4991A
HP4291B
D-25578
2n2 j 100
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1008WL
Abstract: No abstract text available
Text: AIR CORE INDUCTORS KQ 空芯チップインダクタ Air-Core Chip Inductors •構造図 Construction 0402 0603, 0805, 1008 ① W W LL L ② Ht Ht H ② H インダクタ Inductor ① W ④ ④ ⑤ ③ Wt W P ① フラットトップフィルム ② セラミックコア
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KQT0402
KQ0603
270nH
180nH
KQ0805
KQ1008
150nH
1008WL
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aircore inductor
Abstract: 202F HP4291A KQ0603 KQ0805 KQ1008 KQT0402 1040 marking inductor
Text: AIR CORE INDUCTORS KQ 空芯チップインダクタ Air-Core Chip Inductors •構造図 Construction ① ② ③ ④ ① フラットトップフィルム Flat top film ② セラミックコア Ceramic core ③ 電極 Electrode
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KQ0805
aircore inductor
202F
HP4291A
KQ0603
KQ0805
KQ1008
KQT0402
1040 marking inductor
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code 8r2
Abstract: No abstract text available
Text: AIR CORE INDUCTORS KQ 空芯チップインダクタ Air-Core Chip Inductors •構造図 Construction 0402 0603, 0805, 1008 ① W W LL L ② Ht Ht H ② H インダクタ Inductor ① W ④ ④ ⑤ ③ Wt W P ① フラットトップフィルム ② セラミックコア
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KQT0402
KQ0603
270nH
180nH
KQ0805
KQ1008
150nH
code 8r2
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Untitled
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION BODY COLOR INDUCTORS MHL 1E MHL 1J MHL 2A MARKING Brown White with one black stripe
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D-25578
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MICro 5800
Abstract: diode 1n6 diode CODE 51n 36501E 36502A 36521J 8R-2-103
Text: Low Inductance, High Frequency Chip Inductor Type 3650 Series Type 3650 Series Characteristics - Electrical Type 36501E Series - 0402 Package Inductance Inductance Tolerance Code nH @ 250MHz (%) The 3650 Series is a new concept from Tyco, a range of inductors
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36501E
250MHz
4000pcs/reel
MICro 5800
diode 1n6
diode CODE 51n
36502A
36521J
8R-2-103
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Untitled
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking
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E4991A
HP4291B
D-25578
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