512X16 sram
Abstract: SRAM timing static SRAM single port
Text: d110001 512X16, Mux 8, Drive 3, Non-Pipelined High-Speed Single-Port Synchronous SRAM Features Memory Description • Precise Optimization for Infineon’s C9DD1 0.20µm The 512X16 SRAM is a high-performance, synchronous single-port, 512-word by 16-bit memory designed to
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d110001
512X16,
512X16
512-word
16-bit
61mm2
HS300-SS
99Q3P0
512X16 sram
SRAM timing
static SRAM single port
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SECDED
Abstract: sram 16k8 EP3SE50
Text: 4. TriMatrix Embedded Memory Blocks in Stratix III Devices SIII51004-1.1 Introduction TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes 640-bit memory logic array blocks
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SIII51004-1
640-bit
144-Kbit
M144K
SECDED
sram 16k8
EP3SE50
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SECDED
Abstract: EP3SE50
Text: 4. TriMatrix Embedded Memory Blocks in Stratix III Devices SIII51004-1.8 Introduction TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes 640- in ROM mode only or 320-bit memory logic array blocks (MLABs),
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SIII51004-1
320-bit
144-Kbit
M144K
SECDED
EP3SE50
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dual port ram
Abstract: EP2AGX260 A123 C789 EP2AGX125 EP2AGX190 EP2AGX45 EP2AGX65 shiftregister
Text: 3. Memory Blocks in Arria II GX Devices AIIGX51003-2.0 Arria II GX memory blocks include 640-bit memory logic array blocks MLABs and 9-Kbit M9K blocks. You can configure each embedded memory block independently to be a single- or dual-port RAM, FIFO, ROM, or shift register with the Quartus ® II
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AIIGX51003-2
640-bit
dual port ram
EP2AGX260
A123
C789
EP2AGX125
EP2AGX190
EP2AGX45
EP2AGX65
shiftregister
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SAE-AS5652
Abstract: EBR-1553 AS5652 fifo vhdl 1553 VHDL 1553b VHDL fifo memory vhdl code for fifo and transmitter vhdl code for asynchronous fifo EBR1553B
Text: Standard Products Enhanced Bit Rate MIL-STD-1553B Remote Terminal IP Advanced Datasheet August, 2008 INTRODUCTION MIL-STD-1553 has long been the standard in HiRel distributed serial communication for aerospace and defense applications. This standard has been updated and is now controlled by the
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MIL-STD-1553B
MIL-STD-1553
AS15531
AS5652
10Mbps
RS-485
MIL-STD-1553B
SAE-AS15531)
SAE-AS5652
EBR-1553
EBR-1553
fifo vhdl
1553 VHDL
1553b VHDL
fifo memory
vhdl code for fifo and transmitter
vhdl code for asynchronous fifo
EBR1553B
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K6F8016R6B
Abstract: K6F8016R6B-F
Text: Preliminary CMOS SRAM K6F8016R6B Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark July 25, 2001 Preliminary The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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K6F8016R6B
58/Typ.
32/Typ.
K6F8016R6B-F
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Untitled
Abstract: No abstract text available
Text: Preliminary CMOS SRAM K6F8016U6D Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft April 26, 2004 Preliminary 0.1 Revised - Updated DC parameters ICC1, ICC2, ISB1, IDR
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K6F8016U6D
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K6X8016T3B-UF55
Abstract: K6X8016T3B-UF70 K6X8016T3B K6X8016T3B-F K6X8016T3B-Q K6X8016T3B-TF55
Text: K6X8016T3B Family CMOS SRAM 512Kx16 bit Low Power Full CMOS Static RAM FEATURES GENERAL DESCRIPTION • Process Technology: Full CMOS • Organization: 512K x16 • Power Supply Voltage: 2.7~3.6V • Low Data Retention Voltage: 1.5V Min • Three state outputs
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K6X8016T3B
512Kx16
44-TSOP2-400F
K6X8016T3B-F
K6X8016T3B-Q
K6X8016T3B-UF55
K6X8016T3B-UF70
K6X8016T3B-F
K6X8016T3B-Q
K6X8016T3B-TF55
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K6X8016T3B-UF55
Abstract: K6X8016T3B K6X8016T3B-F K6X8016T3B-Q k6x8016t3btf55
Text: K6X8016T3B Family CMOS SRAM Document Title 512Kx16 bit Low Power Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft October 31, 2002 Preliminary 0.1 Revised - Deleted 44-TSOP2-400R package type. December 11, 2002
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K6X8016T3B
512Kx16
44-TSOP2-400R
K6X8016T3B-UF55
K6X8016T3B-F
K6X8016T3B-Q
k6x8016t3btf55
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K6F8016R6C
Abstract: No abstract text available
Text: K6F8016R6C Family CMOS SRAM Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft February 7, 2003 Preliminary 1.0 Finalize July 3, 2003 Final The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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K6F8016R6C
58/Typ.
32/Typ.
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K6F8016U6C
Abstract: No abstract text available
Text: Preliminary CMOS SRAM K6F8016U6C Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark May 1, 2003 Preliminary The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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K6F8016U6C
58/Typ.
32/Typ.
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Untitled
Abstract: No abstract text available
Text: Preliminary CMOS SRAM K6F8016U6B Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark July 24, 2001 Preliminary The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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K6F8016U6B
32/Typ.
58/Typ.
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K6F8016R6D
Abstract: K6F8016R6D-F
Text: Preliminary CMOS SRAM K6F8016R6D Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft April 26, 2004 Preliminary 0.1 Revised - Updated DC parameters ICC1, ICC2, ISB1, IDR
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K6F8016R6D
K6F8016R6D
K6F8016R6D-F
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K6F8016U6D-XF70
Abstract: K6F8016U6D
Text: CMOS SRAM K6F8016U6D Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft April 26, 2004 Preliminary 0.1 Revised - Updated DC parameters ICC1, ICC2, ISB1, IDR
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K6F8016U6D
K6F8016U6D-XF70
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Untitled
Abstract: No abstract text available
Text: Advance CMOS SRAM KM616FU8110 Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark June 23, 1999 Advance The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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KM616FU8110
80/Typ.
25/Typ.
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Untitled
Abstract: No abstract text available
Text: Preliminary KM616FS8110 Family CMOS SRAM Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark July 30, 1999 Preliminary The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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KM616FS8110
85/Typ.
25/Typ.
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CS-102
Abstract: K6F8016T6C
Text: Preliminary CMOS SRAM K6F8016T6C Family Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark July 30, 2003 Preliminary The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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K6F8016T6C
58/Typ.
32/Typ.
CS-102
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Untitled
Abstract: No abstract text available
Text: Preliminary K6F8016S6A Family CMOS SRAM Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft August 14, 2000 Preliminary 0.1 Revise - Change package type from FBGA to TBGA
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K6F8016S6A
55/Typ.
35/Typ.
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512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM
Abstract: No abstract text available
Text: Preliminary KM616FV8110 Family CMOS SRAM Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial draft Draft Date Remark July 23, 1999 Preliminary The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
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KM616FV8110
85/Typ.
25/Typ.
512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM
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K6X8016T3B-F
Abstract: K6X8016T3B-TQ70 K6X8016T3B K6X8016T3B-Q K6X8016T3B-TF55
Text: Preliminary CMOS SRAM K6X8016T3B Family Document Title 512Kx16 bit Low Power Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft October 31, 2002 Preliminary 0.1 Revised - Deleted 44-TSOP2-400R package type. December 11, 2002
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K6X8016T3B
512Kx16
44-TSOP2-400R
K6X8016T3B-F
K6X8016T3B-TQ70
K6X8016T3B-Q
K6X8016T3B-TF55
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48-PIN
Abstract: No abstract text available
Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead
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PS128M
PS3232V
DPS128X16CJ3/BJ3
PS128X16CH
DPS128X16Y3
PS128X16H
PS128X24BH
PS512S8BN
PS512S8N
48-PIN
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Untitled
Abstract: No abstract text available
Text: Preliminary KM6164002A CMOS SRAM 256Kx 16 Biit High-Speed CMOS Static RAM FEATURES GENERAL DESCRIPTION • Fast Access Time 12,15,20 ns Max. • Low Power Dissipation Standby (TTL) : 50 mA(Max.) (C M O S): 10 mA(Max.) Operating KM6164002A-12 : 260 mA(Max.)
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KM6164002A
256Kx
KM6164002A-12
164002A
KM6164002A-20
KM6164002AJ
44-SOJ-4QO
KM6164002A
304-bit
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Untitled
Abstract: No abstract text available
Text: BiCMOS SRAM KM616B4002 256K x 16 Bit High-Speed BiCMOS Static RAM FEATURES GENERAL DESCRIPTION • Fast Access Time 12,13,15 ns Max. • Low Power Dissipation Standby (TTL) : 60 mA(Max.) (CMOS): 30 mA(Max.) Operating KM616B4002-12 : 270 mA(Max.) KM616B4002-13:265 mA(Max.)
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KM616B4002
KM616B4002-12
KM616B4002-13
KM616B4002-15
KM616B4002J
44-SQJ-400
KM616B4002
304-bit
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY BiCMOS SRAM KM616BV4002 25 6K x 16 Bit High-Speed BiCMOS Static RAM 3.3V Operating FEATURES GENERAL DESCRIPTION • Fast Access Time 12,15,20 ns(Max.) • Low Power Dissipation Standby (TTL) : 60 mA(Max.) (CMOS):30 mA(Max.) Operating KM 616BV4002J-12 : 240m A (M ax.)
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KM616BV4002
616BV4002J-12
KM616BV4002J-15
4002J-20:
KM616BV4002J
44-SOJ-400
KM616BV4002
304-bit
0031fc
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