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Cirrus Logic CK49X-497024 EVAL BOARD FOR CS497024
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CK49X-497024	Bulk	6		1	1 $406.25 10 $406.25 100 $406.25 1000 $406.25 10000 $406.25	Buy Now
Cirrus Logic CK49X-49530 EVAL BOARD FOR CS495304
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CK49X-49530	Bulk			1	1 $453.29 10 $453.29 100 $453.29 1000 $453.29 10000 $453.29	Buy Now
Avnet Americas	CK49X-49530	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Cirrus Logic CK49X-49531 EVAL BOARD FOR CS495314
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CK49X-49531	Bulk			1	1 $453.29 10 $453.29 100 $453.29 1000 $453.29 10000 $453.29	Buy Now
Avnet Americas	CK49X-49531	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Cirrus Logic CK49X-49834 EVAL BOARD FOR CS49834
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CK49X-49834	Bulk			1	1 $453.29 10 $453.29 100 $453.29 1000 $453.29 10000 $453.29	Buy Now
Avnet Americas	CK49X-49834	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Cirrus Logic CK49X-495314 EVAL BOARD FOR CS495314
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CK49X-495314	Box			1	1 $453.29 10 $453.29 100 $453.29 1000 $453.29 10000 $453.29	Buy Now
Avnet Americas	CK49X-495314	Box			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote

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49X49 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
thermal conductive pressure sensitive adhesive Abstract: adhesive 8815 k WU-M-392 Vossloh-Schwabe Text: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling devices	Original	PDF	297x23 297x23 thermal conductive pressure sensitive adhesive adhesive 8815 k WU-M-392 Vossloh-Schwabe
x1011 Abstract: 19X19 34x34 X101-1 Text: Wärmeleitende Transferklebebänder für LED-Module TM 3M Typ 8810 und Bergquist Bond-Ply 100 LED-Module Detaillierte Informationen und Anwendungsrichtlinien finden Sie auf dem 3M oder Bergquist Datenblatt für wärmeleitende Transferklebebänder 8805; 8810;	Original	PDF	x1011 297x23 x1011 19X19 34x34 X101-1
650NM photodiode Abstract: 650nm 940NM PD-0066 photodiode 940nm Text: SILICON PHOTODIODE CHIPS DEVICE NO. : PD-0066 1. Scope : This specification applies to PIN silicon photodiode chips, Device No. PD-0066 2. Structure : 2-1. Planar type : PIN diode. 2-2. Electrodes : Top side Anode : Aluminum alloy . Back side ( Cathode ) : Gold alloy.	Original	PDF	PD-0066 038mm) 940nm 880nm 650nm 650NM photodiode 650nm 940NM PD-0066 photodiode 940nm
WU-M-294 Abstract: 8810 WU-M-291 WU-M-292 Text: Wärmeleitende Transferklebebänder für High Performance Module TM 3M Typ 8810 Wärmeleitende Transferklebebänder wurden dazu entwickelt, einen bevorzugten Wärmeübertragungsweg zwischen wärmeerzeugenden Bauteilen und Kühlkörpern oder anderen Kühlbaugruppen z. B. Heat Spreader zu schaffen.	Original	PDF	34x34 WU-M-294 x1011 49x49 WU-M-295 306x11 WU-M-291 WU-M-294 8810 WU-M-291 WU-M-292
RFSA-61B Abstract: RFSA-11B AC124 KU-68 Text: RF приёмник: Включатель RFSA-11B, RFSA-61B ! ! ! ! ! ! ! RFSA-11B Технические параметры Напряжение питания: Мощность: Допуск напряжения питания: Выход Кол-во контактов:	Original	PDF	RFSA-11B, RFSA-61B RFSA-11B RFSA-11B: RFSA-61B: KU-68) 3x107 RFSA-61B RFSA-11B AC124 KU-68
X1011 Abstract: Vossloh-Schwabe 19X19 Text: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling devices	Original	PDF	x1011 297x23 297x23 X1011 Vossloh-Schwabe 19X19
250VA Abstract: No abstract text available Text: RF приёмник: Регулятор освещения RFDA-11B, RFDA-71B радиоуправляемый регулятор освещения предназначенный для создания световых сцен, управление одним или группой светильников	Original	PDF	RFDA-11B, RFDA-71B RFDA-11B: RFDA-71B: RFDA-11B 49x49x21 426/2000Sb( 250VA
650NM photodiode Abstract: 3066 650nm 880nm 940nm 880nm photodiode 940nm Text: SILICON PHOTODIODE CHIPS DEVICE NO. : PD-3066 1. Scope : This specification applies to PIN silicon photodiode chips, Device No. PD-3066 2. Structure : 2-1. Planar type : PIN diode. 2-2. Electrodes : Top side Anode : Aluminum alloy . Back side ( Cathode ) : Gold alloy.	Original	PDF	PD-3066 038mm) 49X49 940nm 880nm 650nm 650NM photodiode 3066 650nm 880nm 940nm 880nm photodiode 940nm
thermal conductive pressure sensitive adhesive Abstract: 320x35 Text: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling	Original	PDF	320x35 320x35 thermal conductive pressure sensitive adhesive
8815 k Abstract: 8810 WU-M-392 WU-M vossloh Text: Wärmeleitende Transferklebebänder für LED-Module TM 3M Typ 8810 und Bergquist Bond-Ply 100 Durch die weiche Oberflächenbeschaffenheit können sich die Klebefolien auch unebenen Substraten anpassen und bieten eine große Klebkraft und Wärmekopplung. Die besondere	Original	PDF	297x23 8815 k 8810 WU-M-392 WU-M vossloh
16X16 Abstract: bga 576 socket bga 24x24 576 Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00	OCR Scan	PDF	16X16 C-1640240 bga 576 socket bga 24x24 576
F100163 Abstract: No abstract text available Text: Ggl National Æm Semiconductor F100183 2 x 8-Bit Recode Multiplier General Description F100183 perform s parallel m ultiplication o f tw o signed num bers in tw os com ple m e nt form to produce a signed tw os com plem ent product. All inputs have 50 k ft pull-dow n resis	OCR Scan	PDF	F100183 F100182 F100179 F100180 1111L 111it F100193 F100U3 F100163
F100179 Abstract: F100180 F100182 F100183 987510 5 bit binary multiplier using adders Text: E g National æ ü Semiconductor F100183 2 x 8-Bit Recode Multiplier General Description The F100183 is a 2 x 8 -bit recode multiplier designed to perform high-speed hardware multiplication. In conjunction with the F100182 Wallace Tree Adder, the F100179 Carry	OCR Scan	PDF	F100183 F100183 F100182 F100179 F100180 01110101q 1101001j 0010110J lfM1010010\| 987510 5 bit binary multiplier using adders
wallace tree multiplier Abstract: PC30 Bi 3101 A M 3101 KB 100180 Text: 100183 NATIONAL SEPIICOND LOGIC bSDUES blE D National Semiconductor 007bD05 ^OS « N S C l N o t In ten d ed For N ew Designs T - V 0 7 f - 100183 2 x 8-Bit Recode Multiplier General Description T he 100183 is a 2 x 8 -bit recode m ultiplier designed to per	OCR Scan	PDF	007bD05 tl/f/9875-12 5D1122 S21S11â P100179 tl/f/9875-13 wallace tree multiplier PC30 Bi 3101 A M 3101 KB 100180

710018 Abstract: ae gp 735 wallace tree 5 bit binary multiplier using adders ay 5 1011 FBTAL Bi 3101 A Text: LOGIC blE J> 100183 NATIONAL SEMICOND 3-90 • bSQUSE G 0 7 b 0 G 5 ÌOS « N S C l NATIONAL SEMICOND E a k_ O) <0 Q '5 > o o a> 3 _ 1- ° + + + TC\l CM I I HIGH Voltage Level LOW Voltage Level (LOGIC) blE î ■ b5Q1122 007b00b B41 «NSC1 100183 lu. i-	OCR Scan	PDF	G07b0G5 24-Pin GG7b014 TL/F/9875-12 bS0112S 007b01b 710018 ae gp 735 wallace tree 5 bit binary multiplier using adders ay 5 1011 FBTAL Bi 3101 A
Untitled Abstract: No abstract text available Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]	OCR Scan	PDF	16X16 17X17