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    44 LEAD CERAMIC LEADLESS CHIP CARRIER Search Results

    44 LEAD CERAMIC LEADLESS CHIP CARRIER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    44 LEAD CERAMIC LEADLESS CHIP CARRIER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
    Text: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)


    Original     		PDF LCC-44C-F01 WQFN044-G-S650-1 50mil 650mil 44-pad LCC-44C-F01) C44001SC-2-2 LCC 44 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)


    Original     		PDF LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC 44 WQFN044-G-S650-1 LCC44

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal


    Original     		PDF LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44

    E44A

    Abstract: 44 Lead Ceramic Leadless Chip Carrier
    Text: 44 Lead Ceramic Leadless Chip Carrier Type C NS Package Number E44A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    9014 SOT 23

    Abstract: SSM-2139 AD6431 adxl 355 data sheet transistor 9012 AD 598, AD 698 AD-1377 9014 SOT23 9014 sot-23 MLT 22 805
    Text: Sheet1 MODEL PREFIX AMP CMP PKD REF SW TMP AMP CMP REF AMP BUF REF TMP AMP BUF CMP MLT SMP TMP ADXL AMP CMP REF SW OP CMP DAC MUX REF SMP DAC OP REF SMP TMP OP SMP OP TMP OP TMP SUFFIX 01 01 01 01 01 01 02 02 02 03 03 03 03 04 04 04 04 04 04 05 05 05 05 06


    Original     		PDF O-100, 9014 SOT 23 SSM-2139 AD6431 adxl 355 data sheet transistor 9012 AD 598, AD 698 AD-1377 9014 SOT23 9014 sot-23 MLT 22 805

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    87017 RESISTOR NETWORK

    Abstract: Model 7908
    Text: TaNFilm Chip Carrier Resistor Network Welwyn Components CCN Series • • • • • • Qualified DESC 87017 and 87018 Increased component density Best tolerances: ±0.02% absolute ±0.1% ratio Custom schematics readily available Meet JEDEC standard for type ‘C’ package


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    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: No abstract text available
    Text: HI-8020/HI-8120 February 2003 CMOS HIGH VOLTAGE DISPLAY DRIVER GENERAL DESCRIPTION PIN CONFIGURATION Top View S26 S25 S24 S23 S22 S21 S20 DOUT 32 BP S19 S18 The HI-8020 & HI-8120 high voltage display drivers are functional replacements for the AMI S5420 and


    Original     		PDF HI-8020/HI-8120 HI-8020 HI-8120 S5420 MIC8013/8014 HI-8010 HI-8020 64 CERAMIC LEADLESS CHIP CARRIER LCC

    HI-8020J-85

    Abstract: 8120S HI-8010 HI-8020 HI-8120 HI-8120J-85 S4520 S5420 64 CERAMIC LEADLESS CHIP CARRIER LCC DS8020
    Text: HI-8020/HI-8120 January 2001 GENERAL DESCRIPTION PIN CONFIGURATION Top View The HI-8020 & HI-8120 high voltage display drivers are functional replacements for the AMI S5420 and Micrel MIC8013/8014 series. These CMOS products are designed to drive liquid crystal displays by


    Original     		PDF HI-8020/HI-8120 HI-8020 HI-8120 S5420 MIC8013/8014 HI-8010 HI-8020 HI-8020J-85 8120S HI-8120J-85 S4520 64 CERAMIC LEADLESS CHIP CARRIER LCC DS8020

    Untitled

    Abstract: No abstract text available
    Text: HI-8020/HI-8120 October 2000 GENERAL DESCRIPTION PIN CONFIGURATION Top View The HI-8020 & HI-8120 high voltage display drivers are functional replacements for the AMI S5420 and Micrel MIC8013/8014 series. These CMOS products are designed to drive liquid crystal displays by


    Original     		PDF HI-8020/HI-8120 HI-8020 HI-8120 S5420 MIC8013/8014 HI-8010 HI-8020

    Untitled

    Abstract: No abstract text available
    Text: LC140, 141, 142 Vishay Electro-Films Hermetic Leadless Chip Carrier FEATURES Vishay Electro-Films EFI line of precision resistor networks in ceramic leadless chip carriers offer the designer flexibility and low cost in military, space or other harsh environmental


    Original     		PDF LC140, 07-Aug-01

    QT71

    Abstract: No abstract text available
    Text: LEADLESS CHIP CARRIER Q-TECH CRYSTAL CLOCK OSCILLATORS 1.8 to 15Vdc - 732.4Hz to 125MHz CORPORATION Description Q-Tech’s Leadless Chip Carrier crystal oscillators consist of a source clock square wave generator, logic output buffers and/or logic divider stages, and a round


    Original     		PDF 15Vdc 125MHz EAR99 M17677 MIL-PRF-55310/19 QT66T) QT62T) QT66HCD) 10kHz QT71

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 36 pin CERAMIC LEADLESS CHIP CARRIER LCC 8011 led display CERAMIC LEADLESS CHIP CARRIER LCC 44 Holt PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC TYPE 85.32 HI-8010
    Text: HI-8010/HI-8110 Series CMOS HIGH VOLTAGE DISPLAY DRIVER The HI-8010 & HI-8110 high voltage display drivers are constructed of MOS P Channel and N Channel enhancement mode devices in a single monolithic structure. They are designed to drive high voltage liquid crystal displays by converting low level input


    Original     		PDF HI-8010/HI-8110 HI-8010 HI-8110 HI-8010 HI-8110) 40-PIN 48-PIN 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 36 pin CERAMIC LEADLESS CHIP CARRIER LCC 8011 led display CERAMIC LEADLESS CHIP CARRIER LCC 44 Holt PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC TYPE 85.32

    MO-142

    Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,


    Original     		PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide

    HI-8020P-81

    Abstract: S5420
    Text: HI-8020 Series September 1999 GENERAL DESCRIPTION The HI-8020 high voltage display driver is a functional replacement for the AMI S5420 and Micrel MIC8013/8014 series. This CMOS product is designed to drive liquid crystal displays by converting 5 volt serial data to parallel segment


    Original     		PDF HI-8020 S5420 MIC8013/8014 HI-8010 48-PIN HI-8020P-81

    HI-8010

    Abstract: HI-8010PQI HI-8010PQT HI-8110 HI-8110PQI HI-8110PQT S4520 MIC8010 8010J
    Text: HI-8010/HI-8110 Series January 2001 GENERAL DESCRIPTION The HI-8010 & HI-8110 high voltage display drivers are constructed of MOS P Channel and N Channel enhancement mode devices in a single monolithic structure. They are designed to drive high voltage liquid crystal displays by converting low level input


    Original     		PDF HI-8010/HI-8110 HI-8010 HI-8110 HI-8010 HI-8110) 40-PIN 48-PIN HI-8010PQI HI-8010PQT HI-8110PQI HI-8110PQT S4520 MIC8010 8010J

    20P3

    Abstract: 40D6 MS-011 MS-018 MIL-STD-1835
    Text: Contents Section 8 Package Outlines Standard Package Outlines . 8-3 8-1 8-2 Contents Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the


    Original     		PDF

    MIL-STD-1835

    Abstract: 20P3 40D6 MS-011 MS-018
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).8-4


    Original     		PDF

    hi-8010j-85

    Abstract: No abstract text available
    Text: HI-8010/HI-8110 Series January 2001 GENERAL DESCRIPTION The HI-8010 & HI-8110 high voltage display drivers are constructed of MOS P Channel and N Channel enhancement mode devices in a single monolithic structure. They are designed to drive high voltage liquid crystal displays by converting low level input


    Original     		PDF HI-8010/HI-8110 HI-8010 HI-8110 HI-8010 HI-8110) 40-PIN 48-PIN hi-8010j-85

    Untitled

    Abstract: No abstract text available
    Text: HI-8010/HI-8110 Series October 2000 GENERAL DESCRIPTION The HI-8010 & HI-8110 high voltage display drivers are constructed of MOS P Channel and N Channel enhancement mode devices in a single monolithic structure. They are designed to drive high voltage liquid crystal displays by converting low level input


    Original     		PDF HI-8010/HI-8110 HI-8010 HI-8110 HI-8010 HI-8110) 40-PIN 48-PIN

    JEDEC type Leadless Chip Carriers

    Abstract: MR80C31BH MR80C31BH/B TS68483
    Text: INTRODUCTION A 1 \ Socket Socket for ceramic lead less chip carrier, assembly: Spring latch IF Heat sink 2 Amphenol Socapex DESCRIPTION • Will accept type A, B, C or D ceramic chip carrier in accordance with JEDEC standard. • Available in 28, 44, 52, 68, 84 and 124 way arrangements.


    OCR Scan     		PDF sold084 JEDEC type Leadless Chip Carriers MR80C31BH MR80C31BH/B TS68483