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Catalog Datasheet	MFG & Type	PDF	Document Tags
DOD Handbook 263 Abstract: chapter 5.3 preventive maintenance Electrostatic Discharge Damage and Control EOS ESD S 61.1 ZIF socket design guidelines manpower profile Text: 2 6 Component Handling Precaution 1/22/97 10:16 AM CH06WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 6 COMPONENT HANDLING PRECAUTION 6.1. 6.1.1. ESD Electrostatic Discharge (ESD) Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in	Original	PDF	CH06WIP DOD Handbook 263 chapter 5.3 preventive maintenance Electrostatic Discharge Damage and Control EOS ESD S 61.1 ZIF socket design guidelines manpower profile
a5657 Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame EOS ESD S 61.1 ZIF socket design guidelines Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD	Original	PDF
a5657 Abstract: EOS ESD S 61.1 A5655 transistor databook st 2000 Packaging Text: ESD/EOS 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD can occur in the manufacturing, shipping, receiving, and field handling of integrated circuits or	Original	PDF
a5657 Abstract: DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD	Original	PDF	yo980. a5657 DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology