PN28338
Abstract: 337DC HARD DISC REPAIR
Text: 3M Industrial Business 3M Abrasives for Stainless Steel Finishing Systems for Stainless Steel Finishing The Efficient and Economical Way to Produce Exceptional Finishes. 3M™ Stainless Steel Finishing System — Wel Step 1 – Leveling the Weld Using the following products for weld leveling helps
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947D/747D
223-6N-02
PN28338
337DC
HARD DISC REPAIR
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Untitled
Abstract: No abstract text available
Text: wiSTARTM Occupancy Sensor Ceiling Mounted TITLE 24 PROJECT INFORMATION COMPLIANT CALIFORNIA WIRELESS LIGHTING CONTROLS Project Name Catalog No. Date TM Saving energy without sacrificing comfort can be effortless with occupancy based controls. Hubbell Building Automation’s wiSTAR Ceiling Mounted
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SZV-EOSC05
5713-EOSC05
F6-02-02)
F6-04-01)
F6-10-00)
D5-00-01)
A5-02-05)
A5-07-01)
A5-30-01)
A5-38-08)
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optically clear adhesive
Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746
Text: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.
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225-3S-06
7193HB
optically clear adhesive
ecg master replacement guide
1115b
silver conductive ink resins
QTM-500
MGC 7805
CONDUCTIVE INK FOR FLEX CIRCUITS
3m 7815
8880-S7
UL-746
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Untitled
Abstract: No abstract text available
Text: wiSTARTM Occupancy Sensor Wall Mounted TITLE 24 PROJECT INFORMATION COMPLIANT CALIFORNIA WIRELESS LIGHTING CONTROLS Project Name Catalog No. Date TM Saving energy without sacrificing comfort can be effortless with occupancy based controls. Hubbell Building Automation’s wiSTAR Wall-Mounted
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SZV-EOSC05
5713-EOSC05
F6-02-02)
F6-04-01)
F6-10-00)
D5-00-01)
A5-02-05)
A5-07-01)
A5-30-01)
A5-38-08)
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Untitled
Abstract: No abstract text available
Text: ER2AF SERIES SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE 50-600 Volts 2 Amperes CURRENT FEATURES • • • • • For surface mounted applications High temperature metallurgically bonded-no compression Built-in strain relief Easy pick and place Plastic package has Underwriters Laboratory Flammability
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2002/95/EC
IEC61249
MIL-STD-750
2012-REV
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100MHZ
Abstract: 20MHZ 60MHZ PLL2127X PLL 100Mhz
Text: 20MHZ ~ 100MHZ FSPLL PLL2127X PRELIMINARY GENERAL DESCRIPTION The pll2127x is a Phase Locked Loop (PLL) frequency synthesizer. The PLL provide frequency multiplication capabilities. Its output clock frequency FOUT is related to the input clock frequency FIN by the following
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20MHZ
100MHZ
PLL2127X
pll2127x
20MHZ
60MHZ
PLL 100Mhz
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100MHZ
Abstract: 20MHZ 60MHZ PLL2126X 2p2s
Text: 20MHZ ~ 100MHZ FSPLL PLL2126X PRELIMINARY GENERAL DESCRIPTION The pll2126x is a Phase Locked Loop (PLL) frequency synthesizer. The PLL provide frequency multiplication capabilities. Its output clock frequency FOUT is related to the input clock frequency FIN by the following
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20MHZ
100MHZ
PLL2126X
pll2126x
20MHZ
60MHZ
2p2s
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100MHz FREQUENCY DIVIDER
Abstract: 100MHZ 20MHZ 60MHZ PLL2128X
Text: 20MHZ ~ 100MHZ FSPLL PLL2128X PRELIMINARY GENERAL DESCRIPTION The pll2128x is a Phase Locked Loop (PLL) frequency synthesizer. The PLL provide frequency multiplication capabilities. Its output clock frequency FOUT is related to the input clock frequency FIN by the following
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20MHZ
100MHZ
PLL2128X
pll2128x
100MHz FREQUENCY DIVIDER
20MHZ
60MHZ
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20MHZ
Abstract: 300MHZ PLL2099X
Text: 0.18µ µm 20MHZ ~ 300MHZ FSPLL PLL2099X GENERAL DESCRIPTION The pll299x is a Phase-Locked Loop PLL frequency synthesizer constructed in CMOS on single monolithic structure. The PLL macro-functions provide frequency multiplication capabilities. The output clock frequency
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20MHZ
300MHZ
PLL2099X
pll299x
pll2099x
20MHZ
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MT3329
Abstract: IC 74147 MTK MT3329 Mediatek Gps Mt3329 mediatek MT3329 gps MTK command Mediatek MT3329 chip 74147 ic 74147 parity mtk RTCM
Text: FGPMMOPA6B Datasheet Rev.A01 66-channel GPS Engine Board Antenna Module with MTK Chipset FGPMMOPA6B [Fully pin compatible with FGPMMOPA6] The document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, or any other format without prior
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66-channel
temperature20
temperature250
MT3329
IC 74147
MTK MT3329
Mediatek Gps Mt3329
mediatek MT3329
gps MTK command
Mediatek MT3329 chip
74147 ic
74147 parity
mtk RTCM
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XR1468CN
Abstract: 1468cn XR-1468CN xr-1568
Text: EXAR CORP 3422618 EXAR De | CORP 9 1D 0 4 7 6 2 XR-G100 Master-Chip Chip Size: 90 x 90 mils NPN Transistors Total Components: 327 Small Signal: 58 Bonding Pads; 18 High Current: 2 Max. Operating Voltage: 20V PNP Transistors: 18 Schottky Diodes: None 00047b2
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XR-G100
00047b2
266kfl
XR-G100
XR-1488/1489A
XR-1488
XR-1568M
XR-1568/XR-1468C
XR-1468/1568
XR1468CN
1468cn
XR-1468CN
xr-1568
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Untitled
Abstract: No abstract text available
Text: EXAR 3 4 2 2 6 18 EXAR CORP CORP de| BMEEblfi 0004 757 E 9 1D 0 4 7 5 7 XR-B100 Master-Chip Chip Size: 85 x 85 mils NPN Transistors Total Components: 318 Small Signal: 69 Bonding Pads: 16 High Current: None Max. Operating Voltage: 20V Dual PNP Transistors: 12
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XR-B100
30kfl:
450ii:
266kil
XR-B100
XR-1488/1489A
XR-1568M
XR-1568/XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR CORP TI 3422618 EXAR 9 1D 0 4 7 6 5 CORP XR-L100 Master-Chip Chip Size: 102 x 85 mils NPN Transistors Small Signal: 76 Total Components: 448 Medium: 2 Bonding Pads: 24 Max. Operating Voltage: 20V Large: 2 PNP Transistors Lateral: 22 Quad Collector: 4
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XR-L100
60kil:
200fl:
348kfl
XR-L100
XR-1488/1489A
XR-1568M
XR-1568/XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR I 3422618 CORP 11 ~Ï>Ë 3 M 2 S b l ö GDD477D 9 1 D 04770 EXAR CORP XR-X100 Master-Chip Chip Size: 115 x 95 mils NPN Transistors Total Components: 293 Small Signal: 30 Bonding Pads: 18 High Current: 4 Max. Operating Voltage: 75V PNP Dual Collector
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GDD477D
XR-X100
100kiÃ
234kil
XR-X100
XR-1488/1489A
Driver/Re-55Â
XR-1568/XR-1468C
XR-1468/1568
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR 3422618 EXAR CORP CORP Tl •ii| 34E2blfi GGG47bl 4 9 1 D 04761 XR-F100 Master-Chip Chip Size: 98 x 115 mils NPN Transistors Small Signal: 93 Total Components: 462 High Current: 4 Bonding Pads: 24 Max. Operating Voltage: 20V Dual PNP Transistors: 36 TM
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34E2blfi
GGG47bl
XR-F100
30kft:
433kO
XR-F100
XR-1488/1489A
XR-1488
XR-1568/XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR 3422618 CORP EXAR CORP D e | 342Eblfi " 91D XR-H100 Master-Chip Chip Size: 95 x 80 mils NPN Transistors Total Components: 424 Small Signal: 73 Bonding Pads: 18 Medium: 2 Max. Operating Voltage: 20V PNP Transistors Lateral: 22 Pinch Resistors 60kfi: 8
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342Eblfi
XR-H100
60kfi:
356kil
XR-H100
XR-1488/1489A
XR-1488
XR-1568/XR-1468C
XR-1468/1568
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: 3 4 2 2 6 1 8 EXAR CORP XR-400 I2L Master-Chip Chip Size: 119 * 149 mils 5-Output l2L Gates: 256 Bonding Pads: 40 Max. Operating Voltage: 7Y NPN Transistors: 45 4-Collector PNP Transistors: 12 Schottky-Blpolar I/O Interfaces: 18 910 04771 7"* ~ / .3 ' - V
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XR-400
3422bia
DD0M771
XR-400
XR-1488/1489A
XR-1488
XR-1568/XR-1468C
XR-1468/1568
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: D Ë | 3M22blfl □□D47tfl 7 E X AR CORP Tl S 3422618 EXAR CORP 9 1D 0 4 7 6 8 XR-V100 Master-Chip Chip Size: 113 x 146 mils NPN Transistors Total Components: 740 Small Signal: 140 Bonding Pads: 28 Large: 4 Max. Operating Voltage: 36V PNP Transistors Lateral: 56
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3M22blfl
D47tfl
XR-V100
443kO
XR-1568M
XR-1568/XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR 3422618 CORP 11 EXAR CORP □ □ □ 4 7 b c] =| 91D 04769 XR-W100 Master-Chip Chip Size: 163 x 133 mils NPN Transistors Small Signal: 196 Total Components: 882 Bonding Pads: 40 Supermatched Small Signal: 16 Max. Operating Voltage: 36V Large: 4 PNP Transistors
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XR-W100
342Eblfl
900il:
559kil
50kil:
20kil:
10kii:
XR-W100
XR-1568/XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR 3422618 CORP 11 d £ | 342Eblö GD0M7b0 D 91D 04760 EXAR CORP XR-E100 Master-Chip Chip Size: 82 x 82 mils NPN Transistors Small Signal: 48 Total Components: 224 Bonding Pads: 18 Dual PNP Transistors: 15 Max. Operating Voltage: 20V S TM r - n Pinch Resistors
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342EblÃ
XR-E100
30kii:
200fl:
206kfl
XR-E100
XR-1488/1489A
XR-1488
XR-1568/XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EX A R 3422618 CORP TI De J EXAR CORP 34E2ti]jö Q0047bM 91D 04764 XR-J100 Master-Chip Linear, bipolar NPN Transistors Chip Size: 80 x 75 mils Small Signal: 36 Medium: 2 Total Components: 188 Dual PNP Transistors: 12 Bonding Pads: 18 Max. Operating Voltage: 20V
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34E2ti
Q0047bM
XR-J100
60kft:
450il:
900ft:
159kil
XR-J100
XR-1488/1489A
XR-1488
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Untitled
Abstract: No abstract text available
Text: EXAR CORP "il 3 4 EEb 10 000475b 0 T . T - V S - S i .TM XR-A100 Master-Chip1 Chip S iz e : 73 x 83 mils Total Components: 276 Bonding Pads: 16 Max. Operating Voltage: 20V NPN Transistors Small Signal: 58 High Current: 2 200 mA PN P Transistors: 18 Schottky Diodes: 15
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000475b
XR-A100
XR-A100
XR-148XR-1468C
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: EXAR CORP TI 3422618 D E | 3M2Eblfi □ □QM7L.7 S 91D 04767 EXAR CORP XR-U100 Master-Chip Itanslstors Total Components: 577 NPN, small: 94 NPN, 100 mA: 2 J-FET P-channel : 4 PNP, dual collector: 40 PNP, med. vertical: 2 PNP, vertical: 8 Implant Resistors
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XR-U100
10kft:
20kft:
50kft:
900ft:
305kii
110x110
XR-1568/XR-1468C
XR-1468/1568
XR-1468/1568
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Untitled
Abstract: No abstract text available
Text: y . h> u ! . u w ^ i p ! i p u w B ] •m i.iw in y ì ' l ' H- MEGOHM THIN-FILM CHIP RESISTOR FEATURES This custom -m ade tapped m egohm re sisto r chip extends th e resistan ce values tange to 10 M fl while maintaining a relatively small size.
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M1L-STD-883.
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