CMBA023535
Abstract: BGA 15X15 35x35 bga
Text: Model : CMBA023535 Series For 35x35 Chip set BGA Heat Sink CMBA023535 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 35x35mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: Black Anodize 4.Chip set package thickness and clip color
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CMBA023535
35x35
CMBA023535
35x35mm
UL94-V0)
15x15
BGA 15X15
35x35 bga
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CU1100
Abstract: MBA35002
Text: Model : MBA35002 Series For 35x35 Chip set BGA Heat Sink MBA35002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 35x35mm Part no. Height Fin shape Base MBA35002MBA35002MBA35002MBA35002- 12
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MBA35002
35x35
CU1100
UL94-V0)
35x35mm
MBA35002MBA35002MBA35002MBA35002-
MBA35002-12PCU/2
MBA35002-15PCU/2
MBA35002-20PCU/2
CU1100
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Untitled
Abstract: No abstract text available
Text: 313 PIN PLASTIC BGA 35x35 A S B B A C D P Index mark J I R A H S T E G F L φM φN M S A B M S *1 *2 detail of A part ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008 B 30.0 1.181 C 30.0 1.181 D E 35.00±0.20 2.26 1.378±0.008 0.089 F 2.54 (T.P.) 0.100 (T.P.)
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35x35)
Y313S1-F5
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Untitled
Abstract: No abstract text available
Text: 420 PIN TAPE BGA HEAT SPREADER TYPE (35x35) A A B Q A1 R S T B W A2 D X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 35.00±0.20 INCHES 1.378±0.008 A1 20.50 MAX. 0.807 MAX. A2 20.50 MAX. 0.807 MAX. B 34.60±0.15 1.362 +0.007
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35x35)
S420N7-F6
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Untitled
Abstract: No abstract text available
Text: 420 PIN TAPE BGA 35x35 A U B B W A A1 A2 V D X C Y Index mark J A S H B G F L M P M M detail of A part (Z) E S A B *1 S *2 detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.
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35x35)
P420N2-F6
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P-BGA769-35x35-1
Abstract: PRBG0769FB-A P-BGA769
Text: JEITA Package Code P-BGA769-35x35-1.00 RENESAS Code PRBG0769FB-A Previous Code 769F7T D MASS[Typ.] 4.0g A D1 b A e y S 1pin corner S ZE AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B S AB ZD A1 1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930313233
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P-BGA769-35x35-1
PRBG0769FB-A
769F7T
PRBG0769FB-A
P-BGA769
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35x35 bga
Abstract: No abstract text available
Text: 396-PIN PLASTIC BGA 35x35 A S B C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P NM L K J HG F E D C B A P Index mark J I H R S K L φM S F E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.
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396-PIN
35x35)
P396S1-150-F1-1
35x35 bga
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Untitled
Abstract: No abstract text available
Text: 352 PIN TAPE BGA 35x35 A U B A B W A1 A2 V D X C Y Index mark J S A H B G F L M P M M E S A B *1 *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.
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35x35)
P352N2-F6
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C0016
Abstract: 35x35 bga
Text: 352 PIN TAPE BGA HEAT SPREADER TYPE (35x35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K L detail of A part φM φP S M M F E S A B S ∗2 ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008 A1 A2 23.00 MAX. 23.00 MAX.
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35x35)
S352N7-F6-1
C0016
35x35 bga
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PBGA516
Abstract: PRBG0516DD-A
Text: JEITA Package Code P-BGA516-35x35-1.27 RENESAS Code PRBG0516DD-A D MASS[Typ.] 4.3g A A D1 B Previous Code 516F7X-E ZD b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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P-BGA516-35x35-1
PRBG0516DD-A
516F7X-E
PBGA516
PRBG0516DD-A
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PRBG0352DA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA352-35x35-1.27 RENESAS Code PRBG0352DA-A D MASS[Typ.] 3.6g A A D1 ZD A1 b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 352F7X-A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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P-BGA352-35x35-1
PRBG0352DA-A
352F7X-A
PRBG0352DA-A
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35x35 bga
Abstract: No abstract text available
Text: 396-PIN PLASTIC BGA 35x35 A S B C Index mark 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P NM L K J HG F E D C B A P J I H R S K L φ M S F E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.
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396-PIN
35x35)
P396S1-150-F11-1
35x35 bga
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313-PIN
Abstract: No abstract text available
Text: 313-PIN PLASTIC BGA 35x35 A B S C Index mark 24 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D AE AC AA W U R N L J G E C A AD AB Y V Y P M K H F D B P J R I H L K S φM M T E S G F NOTE Each ball centerline is located within φ 0.3 mm of
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313-PIN
35x35)
S313S1-127-F5-2
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P609
Abstract: 609-PIN
Text: 609-PIN PLASTIC BGA 35x35 w S B D D1 ZE ZD B 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A E1 E φ 2.5 w S A INDEX MARK AN AL AJ AG AE AC AA W U R N L J G E C A AM AK AH AF AD AB Y V T P M K H F D B (UNIT:mm)
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609-PIN
35x35)
P609F1-100-RNC
1-100-RNC
P609
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352-PIN
Abstract: No abstract text available
Text: 352-PIN PLASTIC BGA 35x35 A B A B S 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B P Index mark J I R H S K L S F φM M S A B φN M S E G ITEM A B MILLIMETERS 35.00±0.20
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352-PIN
35x35)
Y352S1-127-F6-4
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35x35 bga
Abstract: No abstract text available
Text: 352 PIN PLASTIC BGA 35x35 A B A B S 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B P Index mark J I R H S K L φM φN S F M S A B M *3 S E G *2 NOTES 1. Controlling dimension
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35x35)
Y352S1-F6-1
35x35 bga
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PRBG0456DA-A
Abstract: PBGA456
Text: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DA-A B D Previous Code 456F7X-B A D1 MASS[Typ.] 5.0g A ZD b S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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P-BGA456-35x35-1
PRBG0456DA-A
456F7X-B
PRBG0456DA-A
PBGA456
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PRBG0953FC-A
Abstract: P-BGA953-35x35-1
Text: JEITA Package Code P-BGA953-35x35-1.00 RENESAS Code PRBG0953FC-A B D Previous Code 953F7X-C A D1 MASS[Typ.] 4.2g A ZD b S AB e y S AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
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P-BGA953-35x35-1
PRBG0953FC-A
953F7X-C
PRBG0953FC-A
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35x35 bga
Abstract: No abstract text available
Text: 352-PIN PLASTIC BGA 35x35 A S B C Index mark 25 23 21 19 17 15 13 11 9 7 5 3 1 D 26 24 22 20 18 16 14 12 10 8 6 4 2 AE AC AA W U R N L J G E C A AF AD AB Y V Y P M K H F D B P J I R H L K S φM M F E S G NOTE Each ball centerline is located within φ 0.30 mm of
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352-PIN
35x35)
P352S1-127-F6-1
35x35 bga
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P-BGA-456
Abstract: PBGA456 PRBG0456DD-A PBGA-456 bga456
Text: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DD-A D A D1 B Previous Code 456F7A MASS[Typ.] 4.1g A b ZD S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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P-BGA456-35x35-1
PRBG0456DD-A
456F7A
P-BGA-456
PBGA456
PRBG0456DD-A
PBGA-456
bga456
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PBGA516
Abstract: PRBG0516DE-A
Text: JEITA Package Code P-BGA516-35x35-1.27 RENESAS Code PRBG0516DE-A Previous Code 516F7X-F B D A MASS[Typ.] 4.3g A A1 ZD b S AB e y S 1pin corner S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e D1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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P-BGA516-35x35-1
PRBG0516DE-A
516F7X-F
PBGA516
PRBG0516DE-A
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PRBG0681FA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA681-35x35-1.00 RENESAS Code PRBG0681FA-A MASS[Typ.] 3.9g Previous Code 681F7T D A D1 φb A AB e y S 1pin corner S ZE AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B φx M S ZD A1 1 2 3 4 5 6 7 8 9 1011121314151617181920212223242526 27 28 29 30 31 32 33
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P-BGA681-35x35-1
PRBG0681FA-A
681F7T
PRBG0681FA-A
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tray bga
Abstract: BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray
Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 NEC 38.00 76.0 BGA 35×35ESP 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 35.35 35.00 (5.57) (6.35) 7.62 SECTION A-A' Applied Package 313-pin Plastic BGA (35×35) 352-pin Plastic BGA (35×35)
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35ESP
313-pin
352-pin
388-pin
396-pin
420-pin
456-pin
480-pin
484-pin
544-pin
tray bga
BGA package tray
jedec bga tray
bga 388
35-609
materials for BGA
tray datasheet bga
609-PIN
933p
bga 13.5 package tray
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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