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    Vishay Intertechnologies RLR07C1000FSB14

    Metal Film Resistors - Through Hole 100 OHM 1% ERL-07
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    TTI RLR07C1000FSB14 Box 9,000 100
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    • 100 $1.1
    • 1000 $0.84
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    Vishay Intertechnologies RN55D5112FB14

    Metal Film Resistors - Through Hole 1/8watt 51.1Kohms 1% 100ppm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI RN55D5112FB14 Box 6,200 100
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    • 100 $0.101
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    Vishay Intertechnologies RN65C2500BB14

    Metal Film Resistors - Through Hole 1/2watt 250ohms .1% 50ppm
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    TTI RN65C2500BB14 Box 3,600 100
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    • 100 $1.03
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    Vishay Intertechnologies RWR81S4990FRB12

    Wirewound Resistors - Through Hole 499 OHM 1% EGS-1-80
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    TTI RWR81S4990FRB12 Box 1,205 5
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    • 10 $7.07
    • 100 $4.82
    • 1000 $4.5
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    Vishay Intertechnologies 376D475X9010A2BRZ

    Tantalum Capacitors - Solid Leaded 4.7UF 10V 10% A R-FR
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    TTI 376D475X9010A2BRZ Tray 1,091 1
    • 1 $5.33
    • 10 $5.02
    • 100 $4.92
    • 1000 $4.92
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    34MIL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Mobile Intel 945 Express Chipset Family Datasheet April 2006 Document Number: 309219-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    PDF 945GMS

    MAX3970

    Abstract: No abstract text available
    Text: Application Note: HFAN-8.0.1 Rev.1; 04/08 Understanding Bonding Coordinates and Physical Die Size Maxim Integrated Products Understanding Bonding Coordinates and Physical Die Size MAX3970 3 1 Introduction When calculating pad coordinates, there is often confusion between the die size specified in the data


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    PDF MAX3970 HF98Z MAX3970

    Untitled

    Abstract: No abstract text available
    Text: User's Guide SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM This user's guide describes the characteristics, operation, and use of the TPS6125xEVM-766 evaluation module EVM . This EVM enables test and evaluation of the Texas Instruments' TPS61253, TPS61258,


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    PDF SLVU744 TPS6125xEVM-766, TPS6125xEVM-766 TPS61253, TPS61258, TPS61259

    TB245

    Abstract: No abstract text available
    Text: M March 5, 20155 T TB245 Frequenccy=760-960MHz Pout=140W Gaain=13dB Vd ds=28Vdc Id dq=0.8A Efficciency=40% % L LB2501 PH: 8805 484-4210 FAX:(805)48 84-3393 1110 Avenida Acasso, Camarillo CA C 93012 ww ww.polyfet.com m March 5, 2015 160.0 16.0 120.0 15.0 80.0


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    PDF TB245 760-960MHz 28Vdc LB2501 TB245 28Vdc, 1111P102JP500X 1111N200GW501X

    MIP 2F4

    Abstract: 940GML intel 943gml 1466 ball FCBGA 945GMS LE1A pci express x16 graphics bga ballout 943G CEF H32 str w 6251
    Text: Mobile Intel 945 Express Chipset Family Datasheet July 2007 Document Number: 309219-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    PDF 945GMS 945GU 593-mm 893-mm. 82945GU MIP 2F4 940GML intel 943gml 1466 ball FCBGA LE1A pci express x16 graphics bga ballout 943G CEF H32 str w 6251

    a13 sot23-5

    Abstract: sine wave generator using LM358 EME-7351 A14* marking sot23-5 SOT23 M7 simple LM324 COMPARATOR CIRCUIT a13 marking sot23 Analog devices marking Information PACKAGE SOIC eme marking sot23 LMV321M5
    Text: t s e all r o t a r a p m o C & SPRING p m Sm SI SC7 NGLE 0-5/ SOT +IN 1 23-5 Op A in D l r o W e h t s ’ e s On thi for V- 2 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 LMV824 A UT O • Rail-to-Rail Output 50% Smaller than SOT-23 Supply Operation build an we


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    PDF LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 OT-23 a13 sot23-5 sine wave generator using LM358 EME-7351 A14* marking sot23-5 SOT23 M7 simple LM324 COMPARATOR CIRCUIT a13 marking sot23 Analog devices marking Information PACKAGE SOIC eme marking sot23 LMV321M5

    TB230

    Abstract: a/SMD resistor 805
    Text: July 16, 2014 TB230 Frequency = 20-1000MHz Pout = 100W Gain = 15dB Typical Vds = 28Vdc Idq = 0.8A Efficiency = 30-50% LB2401 PH: 805 484-4210 FAX:(805)484-3393 1110 Avenida Acaso, Camarillo CA 93012 www.polyfet.com July 16, 2014 PH:(805)484-4210 FAX:(805)484-3393


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    PDF TB230 20-1000MHz 28Vdc LB2401 484-33R6 85mil 100nF TB230 a/SMD resistor 805

    TB234

    Abstract: 1111X104KW500
    Text: May 27, 2014 TB234 Frequency = 500-1000MHz Pout = 100W Gain = 16dB Vds = 28Vdc Idq = 0.8A Efficiency = 40% LB2401 PH: 805 484-4210 FAX:(805)484-3393 1110 Avenida Acaso, Camarillo CA 93012 www.polyfet.com May 27, 2014 PH:(805)484-4210 FAX:(805)484-3393 1110 Avenida Acaso, Camarillo CA 93012


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    PDF TB234 500-1000MHz 28Vdc LB2401 200pF 85mil 70mil 100nF TB234 1111X104KW500

    TB229

    Abstract: amidon BN-61-202
    Text: March 19, 2014 TB229 Frequency = 100-1000MHz Pout = 80W Gain = 14dB Vds = 28Vdc Idq = 0.8A Efficiency = 30 to 50% LB2401 PH: 805 484-4210 FAX:(805)484-3393 1110 Avenida Acaso, Camarillo CA 93012 www.polyfet.com March 19, 2014 PH:(805)484-4210 FAX:(805)484-3393


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    PDF TB229 100-1000MHz 28Vdc LB2401 UT-085 16AWG FT-82-43 UT-070C-10 100nF UT-034 TB229 amidon BN-61-202

    MIP 2F4

    Abstract: intel 943gml ic MIP 2F4 generation of PWM for inverter pic 18f 940GML 945PM 1466 ball FCBGA 945GM 945GT 82801GBM ICH7M
    Text: Mobile Intel 945 Express Chipset Family Datasheet June 2008 Document Number: 309219-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    PDF 945GMS/GSE 945GU 593-mm 893-mm. 82945GU MIP 2F4 intel 943gml ic MIP 2F4 generation of PWM for inverter pic 18f 940GML 945PM 1466 ball FCBGA 945GM 945GT 82801GBM ICH7M

    MAX3970

    Abstract: No abstract text available
    Text: Application Note: HFAN-8.0.1 Rev 0; 7/01 Understanding Bonding Coordinates and Physical Die Size MAXIM High-Frequency/Fiber Communications Group Maxim Integrated Products 2hfan801.doc 08/03/01 Understanding Bonding Coordinates and Physical Die Size MAX3970


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    PDF 2hfan801 MAX3970 HF98Z MAX3970

    TB219

    Abstract: lq801
    Text: August 17, 2012 TB219#3 Frequency=30-512MHz Pout=20W Gain=12dB Vds=28Vdc Idq=200mA Efficiency=35-40% LQ801 PH: 805 484-4210 FAX:(805)484-3393 1110 Avenida Acaso, Camarillo CA 93012 www.polyfet.com August 17, 2012 25.0 50 22.5 45 20.0 40 17.5 35 15.0 30 12.5


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    PDF TB219 30-512MHz 28Vdc 200mA LQ801 28Vdc, 200mA, LQ801

    TTL 7400 national semiconductor

    Abstract: sine wave generator using LM358 a13 marking sot23 eme marking sot23 lm358 sum LMV321 LMV321M5 LMV324 MAL LM393 LMV339
    Text: t s e l mal r o t a r a p m o C & SPRING p m S SI SC7 NGLE 0-5/ SOT +IN 1 23-5 Op A in D l r o the W s ’ e n s O thi for V- 2 Click Here For Web Info LMV321 LMV331 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 LMV824 1 SOT-23 + 8 V TB 6 IN B 7 OU A – + A - 2


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    PDF LMV321 LMV331 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 OT-23 TTL 7400 national semiconductor sine wave generator using LM358 a13 marking sot23 eme marking sot23 lm358 sum LMV321M5 MAL LM393 LMV339

    MIP 2F4

    Abstract: 940GML 943GML ic MIP 2F4 generation of PWM for inverter pic 18f intel 943gml 82801gb 943gml cpu 945GM C30-A38
    Text: Mobile Intel 945 Express Chipset Family Datasheet November 2006 Document Number: 309219-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    PDF 945GMS MIP 2F4 940GML 943GML ic MIP 2F4 generation of PWM for inverter pic 18f intel 943gml 82801gb 943gml cpu 945GM C30-A38