32DIP
Abstract: 32-PIN 32TSOP LH538700A TAA 550
Text: PRELIMINARY LH538700A FEATURES • 1,048,576 words x 8 bit organization • Access time: 100 ns MAX. CMOS 8M (1M × 8) MROM PIN CONNECTIONS TOP VIEW 32-PIN DIP 32-PIN SOP • Power consumption: Operating: 550 mW (MAX.) Standby: 550 µW (MAX.) • Static operation
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LH538700A
32-PIN
32-pin,
600-mil
525-mil
400-mil
32TSOP400
32DIP
32TSOP
LH538700A
TAA 550
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32DIP
Abstract: 32-PIN LH532100B 277A5
Text: LH532100B CMOS 2M 256K x 8 MROM FEATURES DESCRIPTION • 262,144 words × 8 bit organization The LH532100B is a 2M-bit mask-programmable ROM organized as 262,144 × 8 bits. It is fabricated using silicon-gate CMOS process technology. PIN CONNECTIONS 32-PIN DIP
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LH532100B
LH532100B
32-PIN
32QFJ450
32-pin,
450-mil
600-mil
32DIP
277A5
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32DIP
Abstract: 32-PIN LH534
Text: LH534R00A CMOS 4M 512K x 8 Mask-Programmable ROM FEATURES • 524,288 words × 8 bit organization • Access time: 120 ns (MAX.) • Power consumption: Operating: 357.5 mW (MAX.) Standby: 550 µW (MAX.) PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW OE1/OE1/DC
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LH534R00A
32-PIN
32TSOP400
32-pin,
400-mil
600-mil
DIP032-P-0600)
32DIP
LH534
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538r
Abstract: 32DIP 32-PIN 32TSOP LH538
Text: LH538R00B CMOS 8M 1M x 8 Mask-Programmable ROM FEATURES • 1,048,576 words × 8 bit organization • Access time: 120 ns (MAX.) PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW A19 1 32 Vcc A16 2 31 A18 A15 3 30 A17 A12 4 29 A14 • Programmable output enable
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LH538R00B
32-PIN
32-pin,
600-mil
525-mil
400-mil
LH538R00B
538r
32DIP
32TSOP
LH538
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32DIP
Abstract: 32-PIN 32TSOP LH538700A TSOP032-P-0400
Text: LH538700A PRELIMINARY CMOS 8M 1M x 8 Mask-Programmable ROM FEATURES • 1,048,576 words × 8 bit organization • Access time: 100 ns (MAX.) PIN CONNECTIONS TOP VIEW 32-PIN DIP 32-PIN SOP • Power consumption: Operating: 550 mW (MAX.) Standby: 550 µW (MAX.)
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PDF
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LH538700A
32-PIN
32-pin,
600-mil
525-mil
400-mil
32TSOP400
32DIP
32TSOP
LH538700A
TSOP032-P-0400
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32DIP
Abstract: 32-PIN LH532100B-1 532100B1-6 timing DIAGRAM OF ROM
Text: LH532100B-1 FEATURES • 262,144 words x 8 bit organization • Access time: 120 ns MAX. • Static operation CMOS 2M (256K × 8) Mask-Programmable ROM PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW OE1/OE1/DC 1 32 VCC A16 2 31 DC • TTL compatible I/O
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LH532100B-1
32-PIN
32QFJ450
32-pin,
450-mil
LH532100B
600-mil
DIP032-P-0600)
32DIP
LH532100B-1
532100B1-6
timing DIAGRAM OF ROM
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32DIP
Abstract: 32-PIN LH532100B CE-2212
Text: LH532100B CMOS 2M 256K x 8 Mask-Programmable ROM FEATURES DESCRIPTION • 262,144 words × 8 bit organization The LH532100B is a 2M-bit mask-programmable ROM organized as 262,144 × 8 bits. It is fabricated using silicon-gate CMOS process technology. PIN CONNECTIONS
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LH532100B
LH532100B
32-PIN
32QFJ450
32-pin,
450-mil
600-mil
32DIP
CE-2212
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32DIP
Abstract: 32-PIN LH532100B-1
Text: LH532100B-1 FEATURES • 262,144 words x 8 bit organization • Access time: 120 ns MAX. • Static operation CMOS 2M (256K × 8) MROM PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW OE1/OE1/DC 1 32 VCC A16 2 31 DC • TTL compatible I/O A15 3 30 A17 4 29
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LH532100B-1
32-PIN
32QFJ450
32-pin,
450-mil
LH532100B
600-mil
DIP032-P-0600)
32DIP
LH532100B-1
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LH538300CD
Abstract: 32DIP 32-PIN 32TSOP LH538
Text: LH538300C CMOS 8M 1M x 8 Mask-Programmable ROM FEATURES • 1,048,576 words × 8 bit organization • Access time: 150 ns (MAX.) PIN CONNECTIONS 32-PIN DIP 32-PIN SOP • Low-power consumption: Operating: 275 mW (MAX.) Standby: 550 µW (MAX.) • Static operation
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LH538300C
32-PIN
32-pin,
600-mil
525-mil
400-mil
32TSOP400
LH538300CD
32DIP
32TSOP
LH538
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Untitled
Abstract: No abstract text available
Text: CMOS 4M 512K x 8 Mask-Programmable ROM PIN CONNECTIONS • 524,288 words x 8 bit organization TOP VIEW f 1• O E^Ô Ë/D C E • Power consumption: Operating: 357.5 mW (MAX.) A ie E 2 31 E a 18 A15E 3 30 □ a 17 A12E 4 29 □ a 14 A7E 5 28 □ a 13 A0 e
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OCR Scan
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PDF
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32-PIN
32-pin,
600-mil
525-mil
400-mil
32TSOP400
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