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    B1340

    Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
    Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC


    Original     		PDF Q1-2004-MICREL- MIC2027 MIC2527 MIC2177 MIC1700B SY69952ZC SY87701V B1340 sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E

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    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE COMPLETE: 5/23/2003 QUALITY ENG : PART NUMBER : Herb Grimm MIC94060/61 408 435-3476 PROJECT : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS 6L SC-70 Unisem 0216 2A05490MEC FORTUNE MP8000 CSI .5 22007-6 0222 2A12413MNC 22175-1


    Original     		PDF MIC94060/61 SC-70 2A05490MEC MP8000 2A12413MNC 2A05490MEL 2A5490MEE 2A47054MNB 3035A-3 3A08045MLL