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Catalog Datasheet	MFG & Type	PDF	Document Tags
R/ULM850-05-TT-C0101D Abstract: No abstract text available Text: 5 Gbps VCSEL 850 nm 1x1/1x4/12 chip    For flip chip stud bump and wire bond Unsealed 85% r.H./85°C certified 1, 4, or 12 channel array configuration INVISIBLE LASER RADIATION AVOID BEAM EXPOSURE CLASS 3B LASER PRODUCT Preliminary ELECTRO-OPTICAL CHARACTERISTICS	Original	PDF	1x1/1x4/12 ULM850-05-TT-C0101D ULM850-05-TT-C0104D ULM850-05-TT-C0112D 235x335x150 985x335x150 2985x335x150 R/ULM850-05-TT-C0101D

Catalog Datasheet

MFG & Type

PDF

Document Tags

R/ULM850-05-TT-C0101D

Abstract: No abstract text available
Text: 5 Gbps VCSEL 850 nm 1x1/1x4/12 chip    For flip chip stud bump and wire bond Unsealed 85% r.H./85°C certified 1, 4, or 12 channel array configuration INVISIBLE LASER RADIATION AVOID BEAM EXPOSURE CLASS 3B LASER PRODUCT Preliminary ELECTRO-OPTICAL CHARACTERISTICS

Original

PDF

1x1/1x4/12 ULM850-05-TT-C0101D ULM850-05-TT-C0104D ULM850-05-TT-C0112D 235x335x150 985x335x150 2985x335x150 R/ULM850-05-TT-C0101D