Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    28KX16 Search Results

    28KX16 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    pw-2n

    Abstract: pw2n PS331 TMS 3748 LC723748 LC723732 LC723740 LC723756 LC723764 QIP100E
    Text: 注文コード No. N 5 9 3 1 A LC723732, 723740, 723748, 723756, 723764 N5931A 22003 半導体ニューズ No. ※ 5931 とさしかえてください。 LC723732, 723740 LC723748, 723756 LC723764 CMOS LSI ETR コントローラ LC723700 シリーズは命令実行時間 1.33µs を達成し、最大プログラム ROM 容量 64K バイト , RAM2K バイトま


    Original
    PDF LC723732, N5931A LC723748, LC723764 LC723700 BANK00 LC723732-ROM LC723740-ROM LC723748-ROM pw-2n pw2n PS331 TMS 3748 LC723748 LC723732 LC723740 LC723756 LC723764 QIP100E

    A934

    Abstract: No abstract text available
    Text: ^EDI EDI9F3420C ELECTRONIC DESIGNS INC.- Combination SRAM/FLASH/EEPROM Module Pin Configuration and Block Diagram Mixed Technology Memory Module 28Kx16 SRAM, 28Kx16 Flash and 32Kx16 EEPROM A0-A16 vss vcc Features Mixed Technology Memory Module with !28Kx16 bit CMOS SRAM,


    OCR Scan
    PDF EDI9F3420C 128Kx16 32Kx16 120ns 150ns EDI9F3420C A934

    Untitled

    Abstract: No abstract text available
    Text: A fS í *' î c DPMÍ D P Z 1 M W 1 6 A 3 a^nseHPac^Microsyítems, Inc. 0 _1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY D E SC R IP T IO N : The DPZ1MW16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan
    PDF DPZ1MW16A3 DPZ1MW16A3 200ns 250ns 30A067-00

    Untitled

    Abstract: No abstract text available
    Text: DPE6434 64K X 32 CMOS EEPROM MODULE DESCRIPTION: The DPE6434 is a high-performance Electrically Erasable and Programmable Read O nly M emory EEPRO M module and may be organized as 64K X 32, 128K X 16 or 256K X 8. The module is built with eight low-power C M O S 32K X 8


    OCR Scan
    PDF DPE6434 DPE6434 PE6434 16-bit 32-bit E6434 64-BW 500mV

    Untitled

    Abstract: No abstract text available
    Text: rrrinO^ DPS128X16AA3 • - T . P V * DenserPac M icro systems, Inc., 0 H IC H SPEED C ERA M IC 128K X 16 C M O S SRAM M O D U LE D ESCRIPTIO N : The DPS128X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'


    OCR Scan
    PDF P181A3 DPS128X16AA3 DPS128X16AA3 30A045-21

    ERL+35 BN3

    Abstract: No abstract text available
    Text: DENSE-PAC 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan
    PDF DPS128X16Cn3/DPS128X16Bn3 DPS128X16Cn3/DPS128X16Bn3 50-pin 6Cn3/DPS128X1 ERL+35 BN3

    48-PIN

    Abstract: No abstract text available
    Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead


    OCR Scan
    PDF PS128M PS3232V DPS128X16CJ3/BJ3 PS128X16CH DPS128X16Y3 PS128X16H PS128X24BH PS512S8BN PS512S8N 48-PIN