24-Pin Plastic DIP
Abstract: DIP024-P-0600-1
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M02 EIAJ code :∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP (DIP-24P-M02) +0.20 +.008
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DIP-24P-M02
DIP024-P-0600-1
24-pin
DIP-24P-M02)
D24015S-2C-3
24-Pin Plastic DIP
DIP024-P-0600-1
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DIP024-P-0600-1
Abstract: 24-Pin Plastic DIP
Text: DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M02 EIAJ code : ∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP (DIP-24P-M02) +.008 +0.20 30.20 –0.30 1.189 –.012 INDEX-1
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DIP-24P-M02
DIP024-P-0600-1
100mil
600mil
24-pin
DIP-24P-M02)
D24015S-2C-3
DIP024-P-0600-1
24-Pin Plastic DIP
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24-Pin Plastic DIP
Abstract: dip 24 dimension DIP024-P-0600-1
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M02 EIAJ code :∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP
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DIP-24P-M02
DIP024-P-0600-1
24-pin
DIP-24P-M02)
D24015S-2C-3
24-Pin Plastic DIP
dip 24 dimension
DIP024-P-0600-1
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dip 24 dimension
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 Lead pitch 70mil Row spacing 300mil Sealing method Plastic mold 24-pin plastic SH-DIP DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20 22.05 –0.30 .868 +.008 –.012
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DIP-24P-M05
SDIP024-P-0300-1
70mil
300mil
24-pin
DIP-24P-M05)
D24034S-3C-2
dip 24 dimension
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Untitled
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M03 EIAJ code : ∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-24P-M03 24-pin plastic SK-DIP (DIP-24P-M03) +0.20 29.72 –0.30 1.170 +.008 –.012
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DIP-24P-M03
DIP024-P-0300-1
100mil
300mil
24-pin
DIP-24P-M03)
D24017S-3C-2
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DIP-24P-M04
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M04 EIAJ code : ∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20 30.28 –0.30 +.008 1.192 –.012
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DIP-24P-M04
DIP024-P-0400-1
100mil
400mil
24-pin
DIP-24P-M04)
D24025S-3C-3
DIP-24P-M04
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2972
Abstract: DIP-24P-M03
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M03 EIAJ code :∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M03 24-pin plastic SK-DIP (DIP-24P-M03)
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DIP-24P-M03
DIP024-P-0300-1
24-pin
DIP-24P-M03)
D24017S-3C-2
2972
DIP-24P-M03
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SDIP024
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 24-pin plastic SH-DIP Lead pitch 70 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20
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DIP-24P-M05
SDIP024-P-0300-1
24-pin
DIP-24P-M05)
D24034S-3C-2
SDIP024
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910025
Abstract: DIP-24P-M04
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M04 EIAJ code :∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20
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DIP-24P-M04
DIP024-P-0400-1
24-pin
DIP-24P-M04)
D24025S-3C-3
910025
DIP-24P-M04
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cerdip
Abstract: 28 pin ceramic dip
Text: UNIT : mm 8.6 15.5 18.3 11.2 22.4 SC-600-1P Length : 495±2.0 Thickness : 0.7+0.3 −2.0 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24 pin Plastic DIP MAX. 14 24 pin Ceramic DIP (Cerdip) MAX. 15 24 pin Ceramic DIP (Seam Weld)
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SC-600-1P
cerdip
28 pin ceramic dip
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24-Pin Plastic DIP
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M03 EIAJ code :∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M03
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DIP-24P-M03
DIP024-P-0300-1
24-pin
DIP-24P-M03)
D24017S-3C-2
24-Pin Plastic DIP
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DIP10
Abstract: MD600-1A
Text: Unit : mm 8.6 15.5 18.3 11.2 MD600-1A 22.4 MD600-2A Length : 500±2.0 +0.3 Thickness : 0.7−2.0 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24-Pin Plastic DIP 14 28-Pin Plastic DIP 12 42-Pin Plastic DIP 8 42-Pin Plastic Shrinked DIP
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MD600-1A
MD600-2A
24-Pin
28-Pin
42-Pin
48-Pin
DIP10
MD600-1A
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24-Pin Plastic DIP
Abstract: transistor c 558 dip 24 dimension
Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 24-pin plastic SH-DIP Lead pitch 70 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M05
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DIP-24P-M05
SDIP024-P-0300-1
24-pin
DIP-24P-M05)
D24034S-3C-2
24-Pin Plastic DIP
transistor c 558
dip 24 dimension
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24-Pin Plastic DIP
Abstract: DIP-24P-M04
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M04 EIAJ code :∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-24P-M04
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DIP-24P-M04
DIP024-P-0400-1
24-pin
DIP-24P-M04)
D24025S-3C-3
24-Pin Plastic DIP
DIP-24P-M04
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cerdip
Abstract: MD400-05A MD-400
Text: UNIT : mm 7.5 13.5 12.5 7.0 17.9 MD400-05A length : 495±2.0 +0.2 thickness : 0.5−0.1 tolerance : ±0.4 material : plastic with antistatic finish Applied Package Quantity (pcs) 14-pin • Plastic DIP MAX. 24 20-pin · Plastic DIP MAX. 17 22-pin · Plastic DIP/Ceramic DIP (cerdip)
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MD400-05A
14-pin
20-pin
22-pin
24-pin
28-pin
30-pin
cerdip
MD400-05A
MD-400
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dip 28
Abstract: "lead material" DIP
Text: TUBE CONTAINER UNIT : mm 8.6 15.5 18.3 11.2 MD600-1A 22.4 MD600-2A Length : 501±2.0 +0.3 Thickness : 0.7−0.2 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24-Pin Plastic DIP MAX. 14 28-Pin Plastic DIP MAX. 12
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MD600-1A
MD600-2A
24-Pin
28-Pin
42-Pin
48-Pin
SSD-A-H5171-3
dip 28
"lead material" DIP
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NEC 20PIN DIP
Abstract: NEC 28PIN DIP MD400 NEC 24PIN DIP SSD-A-H6525-1 cerdip MD400-05A
Text: TUBE CONTAINER UNIT : mm 7.5 13.5 12.5 7.0 17.9 MD400-05A length : 495±2.0 +0.2 thickness : 0.5−0.1 tolerance : ±0.4 material : plastic with antistatic finish Applied Package Quantity (pcs) 14-pin • Plastic DIP MAX. 24 20-pin · Plastic DIP MAX. 17
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MD400-05A
14-pin
20-pin
22-pin
24-pin
28-pin
30-pin
SSD-A-H6525-1
NEC 20PIN DIP
NEC 28PIN DIP
MD400
NEC 24PIN DIP
SSD-A-H6525-1
cerdip
MD400-05A
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HV1614PJ
Abstract: No abstract text available
Text: HV16 LJ} Super te x inc. 8-Channel High Voltage Switch Ordering Information Package Options Vpp V nn VsiG 24-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 24-pin Plastic DIP 28-lead Plastic Chip Carrier +70V -70V 110V P-P HV1614C HV1614X
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OCR Scan
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PDF
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24-pin
HV1614C
HV1616C
HV1614X
HV1616X
36-pin
HV1614CS
HV1616CS
HV1614P
HV1614PJ
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Untitled
Abstract: No abstract text available
Text: HV18 fàì S u p ertex inc. 8-Channel High Voltage Switch Ordering Information Package Options Vpp V nn VsiG 24-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 24-pin Plastic DIP 28-lead Plastic Chip Carrier +70V -70V 110V P-P HV1814C
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OCR Scan
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PDF
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24-pin
HV1814C
HV1816C
HV1814X
HV1816X
36-pin
HV1814CS
HV1816CS
HV1814P
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HV1614C
Abstract: HV1616C
Text: LJï S u p e r te x inc. HV16 8-Channel High Voltage Analog Switch Ordering Information Package Options > 0_ CL * V nn VsiG 24-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 24-pin Plastic DIP 28-lead Plastic Chip Carrier +70V -70V 110V P-P
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OCR Scan
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PDF
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24-pin
HV1614C
HV1616C
HV1614X
HV1616X
36-pin
HV1614CS
HV1616CS
HV1614P
HV1616C
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Untitled
Abstract: No abstract text available
Text: HV21 inc. 8-Channel High Voltage Analog Switch Ordering Information Package Options Vpp - v NN 24-pin ceram ic*1 side-brazed DIP Die in waffle pack 24-pin plastic DIP 28-lead plastic chip carrier 140 V HV2114C HV2114X HV2114P HV2114PJ 160 V HV2116C HV2116X
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OCR Scan
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24-pin
HV2114C
HV2116C
HV2114X
HV2116X
HV2114P
HV2116P
28-lead
HV2114PJ
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M62X42B
Abstract: M6242B DIP16-P-300 M65421 m58321
Text: PACKAGING PACKAGE/PIN COUNT PART NAME DIP SOP M58321 16 - M6242B 18 24 M62X42B 18 - 18/24 20/24 M6542-1/2/3 2 • 16 PIN PLASTIC DIP DIP16-P-300 (UNIT : mm) 3 •24 PIN PLASTIC DIP (DIP24-P-600) (UNIT : mm) @ nnnr-innnnnnnn o U U U o I 1—1 U L J LTT_J L J L J L J L J r
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M58321
M6242B
M62X42B
M6542-1/2/3
DIP16-P-300)
DIP24-P-600)
SSOP20-P-250-K)
OP24-P-43Q-VK)
8-P-R290)
DIP16-P-300
M65421
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RGB to composite video
Abstract: CXA1645M
Text: SONY CXA1645P/M RGB Encoder Description 24 pin DIP Plastic The CXA1645P/M is an encoder IC that converts 24 pin SOP (Plastic) analog RGB signals to a composite video signal. This IC has various pulse generators necessary for encoding. Composite video outputs and Y/C outputs for the S
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OCR Scan
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CXA1645P/M
CXA1645P/M
CXA1645P
CXA1645M
OP-24P-L01
024-P
-0300-A
RGB to composite video
CXA1645M
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Untitled
Abstract: No abstract text available
Text: SUPERTEX INC blE D 07732^5 0GG3S3S ^ 3 HV21 &k S u p e rte x in c. 8-Channel High Voltage Analog Switch Ordering Information Package Options V p p -vNN 24-pin ceramic* side-brazed DIP 140V HV2114C 160V HV2116C 24-pin plastic DIP 28-lead plastic chip carrier
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OCR Scan
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PDF
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24-pin
HV2114C
HV2116C
24-pin
28-lead
HV2114X
HV2114P
HV2114PJ
HV2116X
HV2116P
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