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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: B NOTES: 1.MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. SHELL: COPPER ALLOY. 2.PLATING CONTACT AREA: GOLD PLATED OVER Ni. SOLDER TAIL: 100 u" MIN Sn/Pb PLATED OVER Ni. SHELL SOLDER AREA: GOLD PLATED OVER Ni. 3.RATING CURRENT RATING: 0.5A	OCR Scan	PDF	200VRMS 500VAC 10-WRITE 11-CARD ES101214 ES090834 128604S

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: B NOTES: 1.MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. SHELL: COPPER ALLOY. 2.PLATING CONTACT AREA: GOLD PLATED OVER Ni. SOLDER TAIL: 100 u" MIN Sn/Pb PLATED OVER Ni. SHELL SOLDER AREA: GOLD PLATED OVER Ni. 3.RATING CURRENT RATING: 0.5A

OCR Scan

PDF

200VRMS 500VAC 10-WRITE 11-CARD ES101214 ES090834 128604S