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    SMT reflow profile

    Abstract: PCB design pcb design of a radio PCB-Design guideline for mobile phone LGA voiding pcb warpage in ipc standard
    Text: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1,


    Original     		PDF 101752I SMT reflow profile PCB design pcb design of a radio PCB-Design guideline for mobile phone LGA voiding pcb warpage in ipc standard