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    Abstract: No abstract text available
    Text: PRODUCT CATALO' N-CHANNEL ENHANCEMENT MOS FET 200A, o . o n n 1 0 0 V , SDF200NA10 HE FEATURES • • • • • • • • RUGGED PACKAGE HI-REL CONSTRUCTION CERAMIC EYELETS LEAD BENDING OPTIONS COPPER CORED 52 ALLOY PINS LOW IR LOSSES LOW THERMAL RESISTANCE


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    PDF SDF200NA10 MIL-STD-883 03bflbG2

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    Abstract: No abstract text available
    Text: IM-CHANIUEL M O S FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS . 021 " _ “ 0.533mm It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.


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    PDF 533mm) 0254mm) 3N169, 3N170, 3N171 03bflbG2